SCHEMBL3406419

SCHEMBL3406419

C[Si](C)(F)O[Si](C)(C)F

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL6389637 0.82
SCHEMBL23701300 0.82
SCHEMBL17439402 0.76
SCHEMBL15367846 0.73
SCHEMBL730610 0.72
SCHEMBL9766116 0.67
SCHEMBL9224164 0.67
SCHEMBL7572250 0.67
SCHEMBL701366 0.65
SCHEMBL329326 0.65

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 48 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-12122935-B2 Curable organopolysiloxane composition for forming film and production method for organopolysiloxane cured product film DOW TORAY CO., LTD. (JP) 2024-10-22 US claimed
EP-3892688-A1 CURABLE ORGANOPOLYSILOXANE COMPOSITION FOR FORMING FILM AND PRODUCTION METHOD FOR ORGANOPOLYSILOXANE CURED PRODUCT FILM Dow Toray Co., Ltd. (JP) 2021-10-13 EP claimed
CN-113348211-A Curable polyorganosiloxane composition for film formation and method for producing polyorganosiloxane cured film 陶氏东丽株式会社 2021-09-03 CN claimed
WO-2020116596-A1 CURABLE ORGANOPOLYSILOXANE COMPOSITION FOR FORMING FILM AND PRODUCTION METHOD FOR ORGANOPOLYSILOXANE CURED PRODUCT FILM ダウ・東レ株式会社 2020-06-11 WO claimed
EP-2011834-B1 CURABLE COMPOSITION KANEKA CORP (JP) 2012-07-25 EP claimed
US-12584016-B2 Curable elastomer composition, cured product of same, film provided with cured product, multilayer body provided with film, method for producing said multilayer body, electronic component and display device each comprising cured product, method for designing curable elastomer composition and method for designing transducer device DOW TORAY CO., LTD. (JP) 2026-03-24 US disclosed
US-12503598-B2 Organopolysiloxane cured product film and usage, manufacturing method, and manufacturing apparatus therefor DOW TORAY CO., LTD. (JP) 2025-12-23 US disclosed
US-12122935-B2 Curable organopolysiloxane composition for forming film and production method for organopolysiloxane cured product film DOW TORAY CO., LTD. (JP) 2024-10-22 US disclosed
CN-115038757-B Curable elastomer composition and method for designing transducer device 陶氏东丽株式会社 2024-04-05 CN disclosed
US-11807758-B2 Siloxane polymer and method of producing siloxane polymer JNC CORPORATION (JP) 2023-11-07 US disclosed
CN-113631281-B Organopolysiloxane cured film, use thereof, method for producing the same, and apparatus for producing the same 陶氏东丽株式会社 2023-08-25 CN disclosed
US-20230015553-A1 CURABLE ELASTOMER COMPOSITION, CURED PRODUCT OF SAME, FILM PROVIDED WITH CURED PRODUCT, MULTILAYER BODY PROVIDED WITH FILM, METHOD FOR PRODUCING SAID MULTILAYER BODY, ELECTRONIC COMPONENT AND DISPLAY DEVICE EACH COMPRISING CURED PRODUCT, METHOD FOR DESIGNING CURABLE ELASTOMER COMPOSITION AND METHOD FOR DESIGNING TRANSDUCER DEVICE DOW TORAY CO., LTD. (JP) 2023-01-19 US disclosed
EP-2879144-A1 ELECTRICITY STORAGE DEVICE Adeka Corporation (JP) 2015-06-03 EP disclosed
EP-2779299-A1 NONAQUEOUS ELECTROLYTE SOLUTION, AND NONAQUEOUS ELECTROLYTE SECONDARY BATTERY USING SAID ELECTROLYTE SOLUTION Adeka Corporation (JP) 2014-09-17 EP disclosed
US-20140242456-A1 NONAQUEOUS ELECTROLYTE AND NONAQUEOUS SECONDARY BATTERY USING SAME ADEKA CORPORATION (JP) 2014-08-28 US disclosed
CN-103828116-A Nonaqueous electrolyte solution and nonaqueous electrolyte secondary battery using same ADEKA CORP 2014-05-28 CN disclosed
EP-2011834-B1 CURABLE COMPOSITION KANEKA CORP (JP) 2012-07-25 EP disclosed
US-7772332-B2 organotin-free catalyst; fluorosilane catalyst and an amine or aminoalkylsiloxane coupler used together for high curing of a polymer with a reactive silicon group; polymer is hydrosilylated polyether, polyisobutylene, or polyacrylate; sealant, adhesive; oil resistance; elasticity KANEKA CORPORATION (JP) 2010-08-10 US disclosed
US-20090069505-A1 CURABLE COMPOSITION KANEKA CORPORATION (JP) 2009-03-12 US disclosed
EP-2011834-A1 CURABLE COMPOSITION Kaneka Corporation (JP) 2009-01-07 EP disclosed