SCHEMBL340724

SCHEMBL340724

CC=CC(=O)OCCCCCO[SiH](C)C

nearest known ligand 0.46

Predicted protein targets (top 13)

geneUniProtsupporting neighboursconfidence
HCAR2 Q8TDS4 4/20 0.46
ATM Q13315 1/20 0.46
TSHR P16473 2/20 0.42
ALDH1A1 P00352 1/20 0.42
CYP3A4 P08684 1/20 0.42
MAPT P10636 1/20 0.36
RAB9A P51151 1/20 0.36
NPSR1 Q6W5P4 1/20 0.36
APP P05067 6/20 0.35
PRKCA P17252 2/20 0.35
HPGD P15428 1/20 0.35
HTT P42858 2/20 0.34
SMN1; SMN2 Q16637 2/20 0.34

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL340231 0.98 ATM (0.47) HCAR2ATMTSHRALDH1A1CYP3A4
SCHEMBL28872434 0.87 ATM (0.58) HCAR2ATMTSHRALDH1A1CYP3A4
SCHEMBL20875241 0.87 ATM (0.58) HCAR2ATMTSHRALDH1A1CYP3A4
SCHEMBL20875236 0.84 ATM (0.60) HCAR2ATMTSHRALDH1A1CYP3A4
SCHEMBL8669692 0.84 ATM (0.60) HCAR2ATMTSHRALDH1A1CYP3A4
SCHEMBL15901752 0.84 ATM (0.47) HCAR2ATMTSHRALDH1A1CYP3A4
SCHEMBL10840160 0.83 HCAR2 (0.44) HCAR2ATMTSHRALDH1A1CYP3A4
SCHEMBL340573 0.83 HCAR2 (0.47) HCAR2ATMTSHRALDH1A1CYP3A4
SCHEMBL25174772 0.82 ATM (0.64) HCAR2ATMTSHRALDH1A1CYP3A4
SCHEMBL9627582 0.81 ATM (0.52) HCAR2ATMTSHRALDH1A1CYP3A4

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 7 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2023190135-A1 STRESS REDUCING AGENT AND RESIN COMPOSITION 株式会社カネカ 2023-10-05 WO disclosed
WO-2023106317-A1 WATER-BASED COATING 株式会社カネカ 2023-06-15 WO disclosed
EP-2065455-B1 Pressure-sensitive adhesive tape NITTO DENKO CORP (JP) 2012-05-16 EP disclosed
US-20120015100-A1 Pressure-Sensitive Adhesive Tape NITTO DENKO CORPORATION (JP) 2012-01-19 US disclosed
EP-2383321-A2 Process for producing an adhesive composition and adhesive tape comprising an adhesive composition produced by said process Nitto Denko Corporation (JP) 2011-11-02 EP disclosed
US-20090142593-A1 PRESSURE-SENSITIVE ADHESIVE TAPE NITTO DENKO CORPORATION (JP) 2009-06-04 US disclosed
EP-2065455-A1 Pressure-sensitive adhesive tape NITTO DENKO CORPORATION (JP) 2009-06-03 EP disclosed