SCHEMBL340733

SCHEMBL340733

C=CCC([SiH3])(OCC)OCC

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL17675053 0.82
SCHEMBL3679768 0.81 TSHR (0.31)
SCHEMBL3677726 0.78 TSHR (0.36)
SCHEMBL6062736 0.76 TSHR (0.36)
SCHEMBL1780756 0.75
SCHEMBL340029 0.74
SCHEMBL6063912 0.73 TSHR (0.41)
SCHEMBL10701607 0.72
SCHEMBL15841276 0.71
SCHEMBL2326072 0.70

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 30 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-114180623-A Method for preparing massive metal oxide-silicon oxide composite aerogel through click reaction 滁州学院 2022-03-15 CN claimed
EP-3909766-B1 MODIFIED CONJUGATED DIENE POLYMER, MODIFIED CONJUGATED DIENE POLYMER COMPOSITION, MULTILAYER ARTICLE, METHOD FOR PRODUCING MULTILAYER ARTICLE, AND MOLDED ARTICLE ASAHI CHEMICAL IND (JP) 2025-05-07 EP disclosed
CN-116891557-A Modified conjugated diene polymer, resin composition containing the same, and product 旭化成株式会社 2023-10-17 CN disclosed
WO-2022230944-A1 PLANARIZING FILM MANUFACTURING METHOD, PLANARIZING FILM MATERIAL, AND PLANARIZING FILM 東ソー株式会社 2022-11-03 WO disclosed
CN-114180623-A Method for preparing massive metal oxide-silicon oxide composite aerogel through click reaction 滁州学院 2022-03-15 CN disclosed
EP-3909766-A1 MODIFIED CONJUGATED DIENE POLYMER, MODIFIED CONJUGATED DIENE POLYMER COMPOSITION, MULTILAYER ARTICLE, METHOD FOR PRODUCING MULTILAYER ARTICLE, AND MOLDED ARTICLE Asahi Kasei Kabushiki Kaisha (JP) 2021-11-17 EP disclosed
US-9994681-B2 Organopolysiloxane prepolymer and a curable organopolysiloxane composition comprising the same HENKEL AG & CO. KGAA (DE) 2018-06-12 US disclosed
EP-3245256-A1 ORGANOPOLYSILOXANE PREPOLYMER AND CURABLE ORGANOPOLYSILOXANE COMPOSITION COMPRISING SAME Henkel AG & Co. KGaA (DE) 2017-11-22 EP disclosed
US-20170306100-A1 Organopolysiloxane Prepolymer and a Curable Organopolysiloxane Composition Comprising the Same HENKEL CORPORATION 2017-10-26 US disclosed
WO-2016112487-A1 ORGANOPOLYSILOXANE PREPOLYMER AND CURABLE ORGANOPOLYSILOXANE COMPOSITION COMPRISING SAME HENKEL (CHINA) COMPANY LIMITED (CN) 2016-07-21 WO disclosed
US-20090142593-A1 PRESSURE-SENSITIVE ADHESIVE TAPE NITTO DENKO CORPORATION (JP) 2009-06-04 US disclosed
EP-2065455-A1 Pressure-sensitive adhesive tape NITTO DENKO CORPORATION (JP) 2009-06-03 EP disclosed
US-7282535-B2 Thermoplastic resin composition KANEKA CORPORATION (JP) 2007-10-16 US disclosed
EP-1786552-A1 METHOD OF MAKING POLYMER MONOLITH COMPOSITE SUBSTRATE AND RESULTING SUBSTRATE AS WELL AS BEADS AND BEAD ARRAY Applera Corporation (US) 2007-05-23 EP disclosed
US-20060078983-A1 Polymer monolith substrate APPLERA CORPORATION (US) 2006-04-13 US disclosed
US-7015292-B2 Silicon-containing olefin copolymer, crosslinkable rubber composition thereof, and use thereof MITSUI CHEMICALS, INC. (JP) 2006-03-21 US disclosed
WO-2006026378-A1 METHOD OF MAKING POLYMER MONOLITH COMPOSITE SUBSTRATE AND RESULTING SUBSTRATE AS WELL AS BEADS AND BEAD ARRAY APPLERA CORPORATION (US) 2006-03-09 WO disclosed
US-20050038214-A1 Silicon-containing olefin copolymer, crosslinkable rubber composition thereof, and use thereof MITSUI CHEMICALS, INC. (JP) 2005-02-17 US disclosed
US-20040147674-A1 Thermoplastic resin composition KANEKA CORPORATION (JP) 2004-07-29 US disclosed
EP-1398353-A1 THERMOPLASTIC RESIN COMPOSITION Kaneka Corporation (JP) 2004-03-17 EP disclosed