SCHEMBL341121

SCHEMBL341121

CC=CC(=O)OCCC[SiH2]C(OC)OC

nearest known ligand 0.42

Predicted protein targets (top 12)

geneUniProtsupporting neighboursconfidence
ATM Q13315 1/20 0.42
HCAR2 Q8TDS4 4/20 0.38
MAPT P10636 1/20 0.33
RAB9A P51151 1/20 0.33
NPSR1 Q6W5P4 1/20 0.33
TSHR P16473 2/20 0.33
HPGD P15428 1/20 0.33
ALDH1A1 P00352 1/20 0.32
CYP3A4 P08684 1/20 0.32
GSTP1 P09211 1/20 0.31
LMNA P02545 1/20 0.30
SMN1; SMN2 Q16637 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL28074015 0.98 ATM (0.41) ATMHCAR2MAPTRAB9ANPSR1
SCHEMBL21291808 0.94 HCAR2 (0.41) ATMHCAR2MAPTRAB9ANPSR1
SCHEMBL8461574 0.90 ATM (0.36) ATMHCAR2GSTP1LMNA
SCHEMBL3917255 0.85 ATM (0.38) ATMHCAR2MAPTRAB9ANPSR1
SCHEMBL676304 0.84 ATM (0.43) ATMHCAR2MAPTRAB9ANPSR1
SCHEMBL35613 0.84 ATM (0.40) ATMHCAR2MAPTRAB9ANPSR1
SCHEMBL9093138 0.84 ATM (0.40) ATMHCAR2MAPTRAB9ANPSR1
SCHEMBL15402551 0.84 ATM (0.40) ATMHCAR2MAPTRAB9ANPSR1
SCHEMBL7256806 0.84 ATM (0.43) ATMHCAR2MAPTRAB9ANPSR1
SCHEMBL4441172 0.83 ATM (0.46) ATMHCAR2MAPTRAB9ANPSR1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1220 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-119614100-A Low-temperature self-adhesive high-modulus polyimide adhesive film for filter and application thereof 明士(北京)新材料开发有限公司 2025-03-14 CN claimed
CN-116217835-B Water-dispersible polymer, composition containing same and application thereof 北京马普新材料有限公司 2024-08-06 CN claimed
CN-118221883-A Multilayer core-shell structure polymer and preparation method and application thereof 中化学科学技术研究有限公司 2024-06-21 CN claimed
CN-117806123-B Chemical amplification type negative photosensitive polyimide composition and application thereof 明士(北京)新材料开发有限公司 2024-05-31 CN claimed
CN-117209673-B Flame-retardant low-temperature toughening synergistic anti-dripping agent and preparation method thereof 铨盛聚碳科技股份有限公司 2024-04-26 CN claimed
CN-117806123-A Chemical amplification type negative photosensitive polyimide composition and application thereof 明士(北京)新材料开发有限公司 2024-04-02 CN claimed
CN-117331279-A Photosensitive resin composition, film material, epoxy compound containing benzocyclobutene structure and application thereof 华为技术有限公司 2024-01-02 CN claimed
CN-117209673-A Flame-retardant low-temperature toughening synergistic anti-dripping agent and preparation method thereof 铨盛聚碳科技股份有限公司 2023-12-12 CN claimed
CN-115561966-B Chemical amplification type negative photosensitive polyimide coating adhesive and application thereof 明士(北京)新材料开发有限公司 2023-05-16 CN claimed
CN-111607227-B Three-dimensional nano carbon/polyimide composite aerogel material and preparation method and application thereof 深圳先进电子材料国际创新研究院 2023-02-28 CN claimed
US-7615594-B2 Graft copolymers and impact-resistant flame-retardant resin compositions containing the same KANEKA CORPORATION (JP) 2009-11-10 US claimed
US-7195849-B2 Photosensitive resin compositions ARCH SPECIALTY CHEMICALS, INC. (US) 2007-03-27 US claimed
US-20040229160-A1 Novel photosensitive resin compositions ARCH SPECIALTY CHEMICALS, INC. 2004-11-18 US claimed
US-6638617-B2 Smokeless, flameproofing and flexible multilayer insulators used as coverings for wires comprising mixtures of halogen-free thermoplastic resins and organic silicon compounds JUDD WIRE, INC. 2003-10-28 US claimed
US-20020096356-A1 Dual layer insulation system KIM YOUNG JOON (US) 2002-07-25 US claimed
US-6281297-B1 CONTAINING ALLYL METHACRYLATE AND ORGANOSILICON COMPOUND KANEKA CORPORATION (JP) 2001-08-28 US claimed
US-5616753-A Stabilizers for unsaturated, polymerizable organosilicon compounds OSI SPECIALTIES, INC. (US) 1997-04-01 US claimed
US-5589219-A POLYOLEFIN INSULATING COATING SUMITOMO ELECTRIC INDUSTRIES, LTD. (JP) 1996-12-31 US claimed
EP-0474252-B1 Flame-retardant resin composition and insulated electrical wire employing the same SUMITOMO ELECTRIC INDUSTRIES (JP) 1995-05-24 EP claimed
US-5236985-A Obtained by irradiating with ionizing radiation composition of thermoplastic resin, magnesium hydroxide, organosilicon compound containing acrylic group SUMITOMO ELECTRIC INDUSTRIES LTD. (JP) 1993-08-17 US claimed