SCHEMBL3451561

SCHEMBL3451561

CCO[Si](C)(OCC)C(N)N

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL3449572 0.81
SCHEMBL2337429 0.80 OPRM1 (0.31)
SCHEMBL534973 0.78
Methylamine SCHEMBL29089954 0.76
SCHEMBL2830815 0.76
SCHEMBL2291869 0.74 TSHR (0.33)
SCHEMBL7099980 0.74 OPRM1 (0.32)
Ethylene SCHEMBL28805812 0.74
SCHEMBL135559 0.73 LMNA (0.33)
SCHEMBL622429 0.73 LMNA (0.33)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 44 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-12261143-B2 Method of manufacturing substrate layered body and layered body MITSUI CHEMICALS, INC. (JP) 2025-03-25 US disclosed
WO-2025023139-A1 LAMINATE AND LAMINATE PRODUCTION METHOD 三井化学株式会社 2025-01-30 WO disclosed
WO-2025005084-A1 SUBSTRATE LAMINATE 三井化学株式会社 2025-01-02 WO disclosed
WO-2024225232-A1 SEMICONDUCTOR STRUCTURE AND METHOD FOR PRODUCING SAME 三井化学株式会社 2024-10-31 WO disclosed
WO-2024177074-A1 METHOD FOR MANUFACTURING SUBSTRATE LAMINATE 三井化学株式会社 2024-08-29 WO disclosed
WO-2024177116-A1 PRODUCTION METHOD FOR SEMICONDUCTOR CHIP WITH RESIN LAYER AND PRODUCTION METHOD FOR SUBSTRATE LAMINATE 三井化学株式会社 2024-08-29 WO disclosed
WO-2024177149-A1 SEMICONDUCTOR STRUCTURE AND METHOD FOR PRODUCING SAME 三井化学株式会社 2024-08-29 WO disclosed
WO-2024172044-A1 METHOD FOR MANUFACTURING SUBSTRATE LAYERED BODY, LAYERED BODY, AND SUBSTRATE LAYERED BODY 三井化学株式会社 2024-08-22 WO disclosed
WO-2024166789-A1 SEMICONDUCTOR STRUCTURE AND PRODUCTION METHOD FOR SAME 三井化学株式会社 2024-08-15 WO disclosed
WO-2024162446-A1 SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING SAME 三井化学株式会社 2024-08-08 WO disclosed
US-20180334588-A1 SEMICONDUCTOR FILM COMPOSITION, METHOD FOR MANUFACTURING SEMICONDUCTOR FILM COMPOSITION, METHOD FOR MANUFACTURING SEMICONDUCTOR MEMBER, METHOD FOR MANUFACTURING SEMICONDUCTOR PROCESSING MATERIAL, AND SEMICONDUCTOR DEVICE MITSUI CHEMICALS, INC. (JP) 2018-11-22 US disclosed
EP-3379565-A1 SEMICONDUCTOR FILM COMPOSITION, METHOD FOR MANUFACTURING SEMICONDUCTOR FILM COMPOSITION, METHOD FOR MANUFACTURING SEMICONDUCTOR MEMBER, METHOD FOR MANUFACTURING PROCESSING MATERIAL FOR SEMICONDUCTOR, AND SEMICONDUCTOR DEVICE Mitsui Chemicals, Inc. (JP) 2018-09-26 EP disclosed
EP-1907517-B1 AMINE TUNGSTATES AND DIARYLAMINES IN LUBRICANT COMPOSITIONS KING INDUSTRIES INC (US) 2012-12-05 EP disclosed
US-8080500-B2 Amine tungstates and lubricant compositions KING INDUSTRIES, INC. (US) 2011-12-20 US disclosed
US-7820602-B2 Amine tungstates and lubricant compositions KING INDUSTRIES, INC. (US) 2010-10-26 US disclosed
US-20090029888-A1 AMINE TUNGSTATES AND LUBRICANT COMPOSITIONS KING INDUSTRIES, INC. 2009-01-29 US disclosed
US-20080194440-A1 AMINE TUNGSTATES AND LUBRICANT COMPOSITIONS RAVICHANDRAN RAMANATHAN 2008-08-14 US disclosed
EP-1907517-A2 AMINE TUNGSTATES AND LUBRICANT COMPOSITIONS King Industries, Inc. (US) 2008-04-09 EP disclosed
US-20070042917-A1 Amine Tungstates and Lubricant Compositions KING INDUSTRIES, INC. 2007-02-22 US disclosed
WO-2007009022-A2 AMINE TUNGSTATES AND LUBRICANT COMPOSITIONS KING INDUSTRIES, INC. (US) 2007-01-18 WO disclosed