SCHEMBL3452977

SCHEMBL3452977

NNC(=O)C1=CCC(=O)C=C1

nearest known ligand 0.35

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 3/20 0.35
KDM4E B2RXH2 3/20 0.35
MAPT P10636 3/20 0.35
BLM P54132 2/20 0.35
LMNA P02545 2/20 0.35
L3MBTL1 Q9Y468 2/20 0.35
GAA P10253 2/20 0.35
TDP1 Q9NUW8 2/20 0.35
NSD2 O96028 1/20 0.35
ALPL P05186 1/20 0.35
POLB P06746 1/20 0.35
ALPI P09923 1/20 0.35
ALPG P10696 1/20 0.35
APEX1 P27695 1/20 0.35
HTT P42858 1/20 0.35
RECQL P46063 1/20 0.35
CASP6 P55212 1/20 0.35
GFER P55789 2/20 0.32
MPO P05164 2/20 0.32
CYP3A4 P08684 2/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL11893095 0.78 ALDH1A1 (0.34) ALDH1A1KDM4EMAPTBLMLMNA
SCHEMBL6422940 0.78
SCHEMBL10870360 0.76 GSK3A (0.35)
SCHEMBL10942022 0.75 GSK3A (0.36)
SCHEMBL36449 0.74 GSK3A (0.33)
SCHEMBL48012 0.72 LMNA (0.37) ALDH1A1KDM4EBLMLMNAL3MBTL1
Potassium Ion SCHEMBL10908762 0.71 GSK3A (0.31)
SCHEMBL563314 0.71 GSK3A (0.31)
SCHEMBL596181 0.71 GSK3A (0.31) ALDH1A1KDM4E
SCHEMBL3110549 0.71 SERPINE1 (0.37) TDP1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 32 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2024053732-A1 LAMINATED CORE AND METHOD FOR MANUFACTURING LAMINATED CORE 日本製鉄株式会社 2024-03-14 WO disclosed
WO-2024024834-A1 ADHESIVE RESIN COMPOSITION-COATED ELECTROMAGNETIC STEEL SHEET AND METHOD FOR MANUFACTURING SAME 日本製鉄株式会社 2024-02-01 WO disclosed
WO-2024024835-A1 ADHESIVE RESIN COMPOSITION-COATED ELECTROMAGNETIC STEEL SHEET AND METHOD FOR PRODUCING SAME 日本製鉄株式会社 2024-02-01 WO disclosed
WO-2021256081-A1 EPOXY RESIN COMPOSITION 株式会社スリーボンド 2021-12-23 WO disclosed
US-20200087445-A1 THERMOSETTING RESIN COMPOSITION ASAHI KASEI KABUSHIKI KAISHA (JP) 2020-03-19 US disclosed
US-7854860-B2 High-speed curable two-part liquid epoxy resin adhesivescomprising a microcapsulated hardener for comprising an amineadduct of a epoxy resin and a covering or shell of an epoxyresin having infrared-sensitve binding groups; storage stability; sovent resistance; high adhesiveness; dispersibility ASAHI KASEI CHEMICALS CORPORATION (JP) 2010-12-21 US disclosed
US-7820772-B2 comprises an amine adduct and a low-molecular amine compound 2-methylimidazole; bisphenol A type epoxy resin reacted with 2-methylimidazole as the amine adduct; excellent hardening property at low temperature, and storage stability at low and high temperature; adhesives; sealant ASAHI KASEI CHEMICALS CORPORATION (JP) 2010-10-26 US disclosed
US-20090261298-A1 High-speed curable two-part liquid epoxy resin adhesivescomprising a microcapsulated hardener for comprising an amineadduct of a epoxy resin and a covering or shell of an epoxyresin having infrared-sensitve binding groups; storage stability; sovent resistance; high adhesiveness; dispersibility ASAHI KASEI CHEMICALS CORPORATION (JP) 2009-10-22 US disclosed
WO-2009014353-A2 SURFACE MODIFIED AMINE CURING AGENT, AND ONE-COMPONENT TYPE EPOXY RESIN COMPOSITION AND ANISOTROPIC CONDUCTIVE ADHESIVE HAVING THE SAME LG CHEM, LTD. (KR) 2009-01-29 WO disclosed
EP-1930359-A1 HIGH-STABILITY MICROENCAPSULATED HARDENER FOR EPOXY RESIN AND EPOXY RESIN COMPOSITION Asahi Kasei Chemicals Corporation (JP) 2008-06-11 EP disclosed
US-5516813-A ROTORS STARKEY DONN R (US) 1996-05-14 US disclosed
EP-0444457-B1 Sealant, liquid crystal cell, display apparatus and recording apparatus CANON KK (JP) 1995-06-28 EP disclosed
US-5384339-A Quartz or silica radiation transparent filler, dynamic testing STARKEY DONN R (US) 1995-01-24 US disclosed
EP-0632080-A1 Resin composition for sealing film-made liquid crystal cells MITSUI TOATSU CHEMICALS, Inc. (JP) 1995-01-04 EP disclosed
US-5150239-A One-pack type epoxy sealant with amine-type curing agent, for liquid crystal cell, display apparatus and recording apparatus CANON KABUSHIKI KAISHA (JP) 1992-09-22 US disclosed
US-5124234-A Protective coating for printed circuits FUJI PHOTO FILM CO., LTD. (JP) 1992-06-23 US disclosed
EP-0444457-A2 Sealant, liquid crystal cell, display apparatus and recording apparatus CANON KABUSHIKI KAISHA (JP) 1991-09-04 EP disclosed
US-5008309-A Epoxy resin, curing agent and fillers ASMO CO., LTD. (JP) 1991-04-16 US disclosed
US-4912152-A From polyisocyanate and polyol JAPAN SYNTHETIC RUBBER CO., LTD. (JP) 1990-03-27 US disclosed
EP-0193068-A1 One liquid type epoxy resin composition Asahi Kasei Kogyo Kabushiki Kaisha (JP) 1986-09-03 EP disclosed