SCHEMBL3454397

SCHEMBL3454397

CCCOC(=O)CC(CC(=O)OC(C)=O)(OCCC)C(=O)OCCC

nearest known ligand 0.35

Predicted protein targets (top 4)

geneUniProtsupporting neighboursconfidence
NAAA Q02083 1/20 0.33
ALDH1A1 P00352 3/20 0.32
LMNA P02545 2/20 0.31
TP53 P04637 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL28499700 0.89 NAAA (0.37) NAAAALDH1A1LMNATP53
SCHEMBL269748 0.88 ALDH1A1 (0.44) NAAAALDH1A1LMNA
SCHEMBL9195940 0.85 NAAA (0.50) NAAAALDH1A1LMNA
SCHEMBL676112 0.85 NAAA (0.50) NAAAALDH1A1LMNA
SCHEMBL28415361 0.81 NAAA (0.34) NAAAALDH1A1
SCHEMBL28417121 0.81 CYP19A1 (0.35)
SCHEMBL2187425 0.80 ALDH1A1 (0.35) NAAAALDH1A1LMNA
SCHEMBL28891481 0.79 PTPN1 (0.30)
SCHEMBL93901 0.78 ALDH1A1 (0.38) ALDH1A1LMNA
SCHEMBL28420906 0.77 RARB (0.32) NAAA

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 21 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-113785001-A Process for preparing branched polymers of lactic acid 生物价值世界福利公司 2021-12-10 CN claimed
CN-109280112-B Catalyst composition suitable for propylene homopolymerization or copolymerization 任丘市利和科技发展有限公司 2021-06-08 CN claimed
EP-3728394-A1 METHOD TO PREPARE BRANCHED POLYMERS OF LACTIC ACID Bio Valore World S.P.A. Societa' Benefit (IT) 2020-10-28 EP claimed
US-6414045-B1 FOAM; CONTAINING ESTER; LOW TEMPERATURE CURING HILTI AKTIENGESELLSCHAFT (LI) 2002-07-02 US claimed
US-12032286-B2 Method for producing multi-layered type microchannel device using photosensitive resin laminate ASAHI KASEI KABUSHIKI KAISHA (JP) 2024-07-09 US disclosed
US-20230375930-A1 PHOTOSENSITIVE RESIN MULTILAYER BODY ASAHI KASEI KABUSHIKI KAISHA (JP) 2023-11-23 US disclosed
CN-116783248-A Resin composition, member containing the same, laminate, and insect-repellent sustained-release preparation 住友化学株式会社 2023-09-19 CN disclosed
US-20230053900-A1 METHOD FOR PRODUCING MULTI-LAYERED TYPE MICROCHANNEL DEVICE USING PHOTOSENITIVE RESIN LAMINATE ASAHI KASEI KABUSHIKI KAISHA (JP) 2023-02-23 US disclosed
CN-113785001-A Process for preparing branched polymers of lactic acid 生物价值世界福利公司 2021-12-10 CN disclosed
CN-109280112-B Catalyst composition suitable for propylene homopolymerization or copolymerization 任丘市利和科技发展有限公司 2021-06-08 CN disclosed
WO-2021095784-A1 PHOTOSENSITIVE RESIN COMPOSITION AND PHOTOSENSITIVE RESIN MULTILAYER BODY 旭化成株式会社 2021-05-20 WO disclosed
US-20200393754-A1 METHOD FOR PRODUCING MULTI-LAYERED TYPE MICROCHANNEL DEVICE USING PHOTOSENITIVE RESIN LAMINATE ASAHI KASEI KABUSHIKI KAISHA (JP) 2020-12-17 US disclosed
CN-107428857-B Thermally expandable microspheres and use thereof 松本油脂制药株式会社 2020-05-26 CN disclosed
CN-106966074-B Photosensitive resin laminate roll 旭化成株式会社 2020-05-05 CN disclosed
CN-110896110-A Optoelectronic module 杨婵媛 2020-03-20 CN disclosed
US-20130340814-A1 Photovoltaic module SOLVAY ACETOW GMBH (DE) 2013-12-26 US disclosed
US-20130341665-A1 LED (Light-Emitting Diode) Luminous Source Module SOLVAY ACETOW GMBH (DE) 2013-12-26 US disclosed
US-8563223-B2 Photosensitive resin composition and laminate ASAHI KASEI E-MATERIALS CORPORATION (JP) 2013-10-22 US disclosed
US-20100119977-A1 PHOTOSENSITIVE RESIN COMPOSITION AND LAMINATE ASAHI KASEI E-MATERIALS CORPORATION (JP) 2010-05-13 US disclosed
US-6414045-B1 FOAM; CONTAINING ESTER; LOW TEMPERATURE CURING HILTI AKTIENGESELLSCHAFT (LI) 2002-07-02 US disclosed