Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | HTR6 | P50406 | 7/20 | 0.77 |
| ▸ | GAA | P10253 | 1/20 | 0.68 |
| ▸ | TSHR | P16473 | 3/20 | 0.60 |
| ▸ | CYP2C9 | P11712 | 2/20 | 0.60 |
| ▸ | LMNA | P02545 | 1/20 | 0.60 |
| ▸ | MPO | P05164 | 1/20 | 0.60 |
| ▸ | CYP3A4 | P08684 | 1/20 | 0.60 |
| ▸ | CA9 | Q16790 | 5/20 | 0.54 |
| ▸ | CA1 | P00915 | 4/20 | 0.54 |
| ▸ | CA2 | P00918 | 4/20 | 0.54 |
| ▸ | CA12 | O43570 | 3/20 | 0.54 |
| ▸ | CA4 | P22748 | 3/20 | 0.54 |
| ▸ | CA6 | P23280 | 2/20 | 0.54 |
| ▸ | CA5A | P35218 | 2/20 | 0.54 |
| ▸ | CA7 | P43166 | 2/20 | 0.54 |
| ▸ | CA14 | Q9ULX7 | 2/20 | 0.54 |
| ▸ | CA5B | Q9Y2D0 | 2/20 | 0.54 |
| ▸ | ALDH1A1 | P00352 | 2/20 | 0.52 |
| ▸ | PKM | P14618 | 1/20 | 0.52 |
| ▸ | HKDC1 | Q2TB90 | 1/20 | 0.51 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| Alcohol SCHEMBL27500513 | 0.89 | HTR6 (0.62) | HTR6GAATSHRCYP2C9LMNA | |
| SCHEMBL3790370 | 0.89 | HTR6 (0.69) | HTR6GAATSHRCYP2C9LMNA | |
| SCHEMBL395274 | 0.87 | HTR6 (1.00) | HTR6GAATSHRCYP2C9CA9 | |
| SCHEMBL30751995 | 0.87 | HTR6 (1.00) | HTR6GAATSHRCYP2C9CA9 | |
| SCHEMBL2004711 | 0.84 | HTR6 (0.71) | HTR6GAACYP2C9CA9CA1 | |
| SCHEMBL9464499 | 0.84 | HTR6 (0.71) | HTR6GAACYP2C9CYP3A4CA9 | |
| SCHEMBL20723646 | 0.84 | HTR6 (0.71) | HTR6GAACYP2C9LMNACA9 | |
| SCHEMBL10585490 | 0.82 | GAA (1.00) | HTR6GAACYP2C9LMNACYP3A4 | |
| SCHEMBL34423 | 0.82 | GAA (1.00) | HTR6GAACYP2C9LMNACYP3A4 | |
| SCHEMBL30223488 | 0.82 | GAA (1.00) | HTR6GAACYP2C9LMNACYP3A4 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 71 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-112194790-B | Low-thermal-expansion transparent polyimide film and preparation method thereof | 中国科学院长春应用化学研究所 | 2022-03-29 | — | — | CN | claimed |
| CN-112194790-A | Low-thermal-expansion transparent polyimide film and preparation method thereof | 中国科学院长春应用化学研究所 | 2021-01-08 | — | — | CN | claimed |
| US-20250233103-A1 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, HYBRID BONDING INSULATION FILM FORMING MATERIAL AND SEMICONDUCTOR DEVICE | HD MICROSYSTEMS, LTD. (JP) | 2025-07-17 | — | — | US | disclosed |
| WO-2024224735-A1 | RESIN COMPOSITION, INSULATED WIRE, AND METHOD FOR PRODUCING INSULATED WIRE | 住友電工ウインテック株式会社 | 2024-10-31 | — | — | WO | disclosed |
| WO-2024218834-A1 | RESIN COMPOSITION, INSULATED WIRE, AND METHOD FOR PRODUCING INSULATED WIRE | 住友電気工業株式会社 | 2024-10-24 | — | — | WO | disclosed |
| WO-2024157378-A1 | RESIN COMPOSITION, INSULATED WIRE, AND METHOD FOR PRODUCING INSULATED WIRE | 住友電気工業株式会社 | 2024-08-02 | — | — | WO | disclosed |
| CN-118210196-A | Photosensitive resin composition, cured film pattern and method for producing the same | 奇美实业股份有限公司 | 2024-06-18 | — | — | CN | disclosed |
| WO-2024111131-A1 | POLYAMIC ACID ESTER AND RESIN COMPOSITION | ＨＤマイクロシステムズ株式会社 | 2024-05-30 | — | — | WO | disclosed |
| WO-2024111130-A1 | POLYAMIC ACID ESTER AND RESIN COMPOSITION | ＨＤマイクロシステムズ株式会社 | 2024-05-30 | — | — | WO | disclosed |
| WO-2024111129-A1 | METHOD FOR PRODUCING POLYIMIDE PRECURSOR, POLYIMIDE PRECURSOR, PHOTOSENSITIVE RESIN COMPOSITION, CURED PRODUCT, METHOD FOR PRODUCING PATTERN CURED PRODUCT, AND ELECTRONIC COMPONENT | ＨＤマイクロシステムズ株式会社 | 2024-05-30 | — | — | WO | disclosed |
| WO-2024095573-A1 | POLYIMIDE PRECURSOR AND RESIN COMPOSITION | ＨＤマイクロシステムズ株式会社 | 2024-05-10 | — | — | WO | disclosed |
| EP-0370954-A2 | Damp-adhesive epoxy resin systems | CIBA-GEIGY AG (CH) | 1990-05-30 | — | — | EP | disclosed |
| EP-0354303-A1 | Amidines of diphenyl sulfones, their derivatives and their use | AMERICAN CYANAMID COMPANY (US) | 1990-02-14 | — | — | EP | disclosed |
| US-4880892-A | PHOSPHONIUM OR PHOSPHORANE CATALYST, PROTECTIVE COATINGS | CIBA-GEIGY CORPORATION (US) | 1989-11-14 | — | — | US | disclosed |
| EP-0099338-B1 | EPOXY RESIN SYSTEMS MODIFIED WITH THERMOPLASTIC RESINS | CIBA-GEIGY AG (CH) | 1986-05-14 | — | — | EP | disclosed |
| EP-0099338-A1 | Epoxy resin systems modified with thermoplastic resins | CIBA-GEIGY AG (CH) | 1984-01-25 | — | — | EP | disclosed |
| EP-0017905-B1 | POLYURETHANE UREAS WITH AROMATIC SULFUR-CONTAINING UREA GROUPS AND PROCESS FOR THEIR PREPARATION | BAYER AG (DE) | 1983-10-12 | — | — | EP | disclosed |
| EP-0017883-B1 | SULPHUR-CONTAINING DIISOCYANATES, A PROCESS FOR THEIR PREPARATION AND THEIR USE AS SYNTHESIS COMPONENTS TO PREPARE POLYURETHANES | BAYER AG (DE) | 1981-10-21 | — | — | EP | disclosed |
| EP-0017905-A1 | Polyurethane ureas with aromatic sulfur-containing urea groups and process for their preparation | BAYER AG (DE) | 1980-10-29 | — | — | EP | disclosed |
| EP-0017883-A1 | Sulphur-containing diisocyanates, a process for their preparation and their use as synthesis components to prepare polyurethanes | BAYER AG (DE) | 1980-10-29 | — | — | EP | disclosed |