SCHEMBL3459048

SCHEMBL3459048

O=C(O)c1cccc(C(=O)O)c1N1C(=O)C2=CCCCC2C1=O

nearest known ligand 0.39

Predicted protein targets (top 17)

geneUniProtsupporting neighboursconfidence
▸ GAA P10253 1/20 0.39
▸ L3MBTL1 Q9Y468 1/20 0.39
▸ ALDH1A1 P00352 10/20 0.34
▸ HSD17B10 Q99714 2/20 0.34
▸ PTGER4 P35408 2/20 0.34
▸ PTGIR P43119 2/20 0.34
▸ PTGER1 P34995 1/20 0.34
▸ ALOX15 P16050 1/20 0.33
▸ KDM4E B2RXH2 6/20 0.32
▸ HPGD P15428 2/20 0.32
▸ PKM P14618 2/20 0.32
▸ MEN1 O00255 1/20 0.32
▸ KMT2A Q03164 1/20 0.32
▸ MAPT P10636 2/20 0.32
▸ HTT P42858 1/20 0.32
▸ RCE1 Q9Y256 1/20 0.32
▸ CTDSP1 Q9GZU7 1/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL11325543 0.80 GAA (0.40) GAAL3MBTL1ALDH1A1ALOX15PKM
SCHEMBL11868086 0.73 — —
SCHEMBL11818305 0.68 L3MBTL1 (0.40) L3MBTL1ALDH1A1HSD17B10ALOX15KDM4E
SCHEMBL17060019 0.60 ALDH1A1 (0.50) GAAL3MBTL1ALDH1A1HSD17B10ALOX15
SCHEMBL950887 0.59 PTPN1 (0.39) ALDH1A1HSD17B10ALOX15KDM4EHPGD
Phthalic Acid SCHEMBL23275564 0.59 ALDH1A1 (0.82) GAAALDH1A1HSD17B10ALOX15KDM4E
Phthalic Acid SCHEMBL6537229 0.59 ALDH1A1 (0.82) GAAALDH1A1HSD17B10ALOX15KDM4E
Phthalic Acid SCHEMBL2160580 0.59 ALDH1A1 (0.82) GAAALDH1A1HSD17B10ALOX15KDM4E
Phthalic Acid SCHEMBL28752744 0.59 ALDH1A1 (0.82) GAAALDH1A1HSD17B10ALOX15KDM4E
SCHEMBL1500383 0.59 ALDH1A1 (0.50) ALDH1A1HSD17B10ALOX15KDM4EHPGD

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8986846-B2 Thermosetting oligomer or polymer, thermosetting resin composition including the oligomer or polymer, and printed circuit board using the composition SAMSUNG ELECTRO-MECHANICS CO., LTD. (KR) 2015-03-24 — — US disclosed
US-20100155120-A1 THERMOSETTING OLIGOMER OR POLYMER, THERMOSETTING RESIN COMPOSITION INCLUDING THE OLIGOMER OR POLYMER, AND PRINTED CIRCUIT BOARD USING THE COMPOSITION SAMSUNG ELECTRONICS CO. LTD. (KR) 2010-06-24 — — US disclosed
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