SCHEMBL34620

SCHEMBL34620

C=CC(=O)N(CCO)CCO

nearest known ligand 0.39

Predicted protein targets (top 13)

geneUniProtsupporting neighboursconfidence
ZDHHC20 Q5W0Z9 2/20 0.39
ZDHHC2 Q9UIJ5 1/20 0.39
TSHR P16473 3/20 0.36
CA12 O43570 1/20 0.35
CA1 P00915 1/20 0.35
CA2 P00918 1/20 0.35
CA9 Q16790 1/20 0.35
LMNA P02545 1/20 0.32
ALDH1A1 P00352 4/20 0.31
FGFR4 P22455 1/20 0.30
ITGB2 P05107 1/20 0.30
ICAM1 P05362 1/20 0.30
ITGAL P20701 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL22984190 0.97 ZDHHC20 (0.38) ZDHHC20ZDHHC2TSHRCA12CA1
Acrylamide SCHEMBL5916982 0.91 TSHR (0.48) ZDHHC20ZDHHC2TSHRCA12CA1
SCHEMBL6667461 0.90 ZDHHC20 (0.41) ZDHHC20ZDHHC2TSHRCA12CA1
SCHEMBL11118601 0.89 ZDHHC20 (0.45) ZDHHC20ZDHHC2TSHRCA12CA1
SCHEMBL1483143 0.86 ALDH1A1 (0.43) ZDHHC20ZDHHC2TSHRCA12CA1
SCHEMBL34682 0.86 ZDHHC20 (0.42) ZDHHC20ZDHHC2TSHRCA12CA1
SCHEMBL22454600 0.85 ZDHHC20 (0.54) ZDHHC20ZDHHC2TSHRCA12CA1
SCHEMBL588652 0.85 ZDHHC20 (0.44) ZDHHC20ZDHHC2TSHRALDH1A1
SCHEMBL28145408 0.84 ZDHHC20 (0.38) ZDHHC20ZDHHC2TSHRALDH1A1FGFR4
SCHEMBL589045 0.83 ZDHHC20 (0.47) ZDHHC20ZDHHC2TSHRALDH1A1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 947 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-118459651-B Temperature-resistant self-breaking fracturing fluid thickener and preparation method and application thereof 西南石油大学 2024-09-20 CN claimed
CN-118459651-A Temperature-resistant self-breaking fracturing fluid thickener and preparation method and application thereof 西南石油大学 2024-08-09 CN claimed
US-20220332867-A1 HYDROXYALKYLAMIDE FUNCTIONALIZED ACRYLIC POLYMERS AND PROCESS FOR MANUFACTURING THEM POLIRESIN S R L (IT) 2022-10-20 US claimed
CN-115097693-A Photoresist for treatment-free thermosensitive CTP and preparation method thereof 河北金锐美科技有限公司 2022-09-23 CN claimed
EP-4025617-A1 HYDROXYALKYLAMIDE FUNCTIONALIZED ACRYLIC POLYMERS AND PROCESS FOR MANUFACTURING THEM Poliresin S.r.l. (IT) 2022-07-13 EP claimed
US-20210317250-A1 RADIATION-CURABLE AQUEOUS POLYURETHANE DISPERSIONS COVESTRO (NETHERLANDS) B.V. (NL) 2021-10-14 US claimed
EP-2951220-B1 SALT-TOLERANT STAR MACROMOLECULES PILOT POLYMER TECH INC (US) 2020-11-25 EP claimed
CN-110435318-B Spherical curved surface printing process 温州酷乐餐桌用品有限公司 2020-11-10 CN claimed
CN-108064253-B Polymer matrices formed from carboxy-functional acrylamides 生命技术公司 2020-09-15 CN claimed
US-10696995-B2 Enzymatic production of glycosylated synthons INSTITUT NATIONAL DE RECHERCHE POUR L'AGRICULTURE, L'ALIMENTATION ET L'ENVIRONNEMENT (FR) 2020-06-30 US claimed
EP-0924276-A1 Two-step method for the production of pressure sensitive adhesive by radiation curing ADHESIVES RESEARCH, INC. (US) 1999-06-23 EP claimed
US-5879759-A PROVIDING MACROMER AND SOLVENT-FREE RADIATION CURABLE COMPOSITION COMPRISED OF (METH)ACRYLIC ESTER OF NON-TERTIARY ALCOHOL, IRRADIATING TO FORM COATABLE SYRUP, MIXING WITH ADDITIONAL MONOMER, MULTIFUNCTIONAL MONOMER, IRRADIATING ADHESIVES RESEARCH, INC. (US) 1999-03-09 US claimed
US-5700873-A GRAFT COPOLYMER COMPRISED OF ONE OR MORE WATER SOLUBLE MONOMERS AND AT LEAST ONE WATER SOLUBLE/DISPERSIBLE MACROMER ADHESIVES RESEARCH, INC. (US) 1997-12-23 US claimed
EP-0681601-A1 WATER-SOLUBLE PRESSURE SENSITIVE ADHESIVE ADHESIVES RESEARCH, INC. (US) 1995-11-15 EP claimed
WO-1995014746-A2 WATER-SOLUBLE PRESSURE SENSITIVE ADHESIVE ADHESIVES RESEARCH, INC. (US) 1995-06-01 WO claimed
US-5395907-A Water-soluble pressure sensitive adhesive ADHESIVE RESEARCH, INC. (US) 1995-03-07 US claimed
EP-0297677-B1 CONDUCTIVE METALLIZATION OF SUBSTRATES VIA DEVELOPING AGENTS AKZO N.V. (NL) 1992-07-29 EP claimed
US-4997674-A Depositing metal particles, applying developer which forms complex, heating AKZO AMERICA INC. (US) 1991-03-05 US claimed
US-4961879-A Conductive metal-filled substrates via developing agents AKZO AMERICA INC. (US) 1990-10-09 US claimed
EP-0297677-A1 Conductive metallization of substrates via developing agents AKZO N.V. (NL) 1989-01-04 EP claimed