Predicted protein targets (top 11)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | AGTR1 | P30556 | 1/20 | 0.43 |
| ▸ | AGTR2 | P50052 | 1/20 | 0.43 |
| ▸ | ALDH1A1 | P00352 | 1/20 | 0.40 |
| ▸ | HPGD | P15428 | 1/20 | 0.40 |
| ▸ | KDM5A | P29375 | 1/20 | 0.38 |
| ▸ | KDM4C | Q9H3R0 | 1/20 | 0.38 |
| ▸ | KDM5B | Q9UGL1 | 1/20 | 0.38 |
| ▸ | PTPN11 | Q06124 | 1/20 | 0.38 |
| ▸ | RARB | P10826 | 2/20 | 0.37 |
| ▸ | XDH | P47989 | 1/20 | 0.37 |
| ▸ | PLA2G4A | P47712 | 2/20 | 0.37 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL217674 | 1.00 | AGTR1 (0.43) | AGTR1AGTR2ALDH1A1HPGDKDM5A | |
| SCHEMBL27839823 | 1.00 | AGTR1 (0.43) | AGTR1AGTR2ALDH1A1HPGDKDM5A | |
| SCHEMBL31484752 | 1.00 | AGTR1 (0.43) | AGTR1AGTR2ALDH1A1HPGDKDM5A | |
| SCHEMBL29147715 | 0.90 | AGTR1 (0.44) | AGTR1AGTR2ALDH1A1HPGDKDM5A | |
| SCHEMBL11033149 | 0.89 | PLA2G2A (0.41) | AGTR1AGTR2ALDH1A1HPGDKDM5A | |
| SCHEMBL29045399 | 0.88 | ALPG (0.44) | AGTR1AGTR2ALDH1A1HPGDKDM5A | |
| SCHEMBL30438581 | 0.88 | ALPG (0.44) | AGTR1AGTR2ALDH1A1HPGDKDM5A | |
| SCHEMBL768937 | 0.84 | HTT (0.37) | AGTR1AGTR2PLA2G4A | |
| Gallic Acid SCHEMBL28677372 | 0.84 | ALPG (0.39) | AGTR1AGTR2ALDH1A1HPGDKDM5A | |
| SCHEMBL9231229 | 0.82 | TLR8 (0.43) | AGTR1AGTR2ALDH1A1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 1749 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-115948097-B | Moisture-heat resistant epoxy powder composition for magnetic ring and preparation method and application thereof | 天津凯华绝缘材料股份有限公司 | 2023-10-03 | — | — | CN | claimed |
| CN-115948097-A | Humidity-heat-resistant epoxy powder composition for magnetic ring and preparation method and application thereof | 天津凯华绝缘材料股份有限公司 | 2023-04-11 | — | — | CN | claimed |
| CN-112724867-B | Insulating adhesive film material and preparation method and application thereof | 深圳先进技术研究院 | 2023-01-10 | — | — | CN | claimed |
| EP-3331959-B1 | ANIONIC CURABLE COMPOSITIONS | DESIGNER MOLECULES INC (US) | 2022-10-05 | — | — | EP | claimed |
| US-20220204696-A1 | PHENOLIC FUNCTIONALIZED POLYIMIDES AND COMPOSITIONS THEREOF | DESIGNER MOLECULES, INC | 2022-06-30 | — | — | US | claimed |
| US-20220077099-A1 | COMPOSITION FOR CONDUCTIVE ADHESIVE, SEMICONDUCTOR PACKAGE COMPRISING CURED PRODUCT THEREOF, AND METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE USING THE SAME | ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE (KR) | 2022-03-10 | — | — | US | claimed |
| CN-113150494-A | PCB micro-foaming hole plugging resin and preparation method and application thereof | 深圳市百柔新材料技术有限公司 | 2021-07-23 | — | — | CN | claimed |
| CN-112724867-A | Insulating adhesive film material and preparation method and application thereof | 深圳先进技术研究院 | 2021-04-30 | — | — | CN | claimed |
| CN-108530836-B | Composite material for low-temperature reinforced lining plate and low-temperature reinforced lining plate thereof | 浙江吉利汽车有限公司 | 2021-03-23 | — | — | CN | claimed |
| CN-108291122-B | Anionically curable compositions | 设计分子有限公司 | 2021-01-05 | — | — | CN | claimed |
| US-9887382-B2 | Thermosetting composition for organic light-emitting element filler and organic light-emitting element display device comprising same | CHEIL INDUSTRIES, INC. (KR) | 2018-02-06 | — | — | US | claimed |
| US-20160005995-A1 | THERMOSETTING COMPOSITION FOR ORGANIC LIGHT-EMITTING ELEMENT FILLER AND ORGANIC LIGHT-EMITTING ELEMENT DISPLAY DEVICE COMPRISING SAME | CHEIL INDUSTRIES INC. (KR) | 2016-01-07 | — | — | US | claimed |
| EP-2251369-B1 | ONE-PACK TYPE EPOXY RESIN COMPOSITION AND USE THEREOF | OMRON TATEISI ELECTRONICS CO (JP) | 2015-04-01 | — | — | EP | claimed |
| US-20140014402-A1 | EPOXY RESIN COMPOSITION FOR BUILD-UP INSULATING FILM, INSULATING FILM FORMED THEREFROM, AND MULTILAYER PRINTED CIRCUIT BOARD HAVING THE SAME | SAMSUNG ELECTRO-MECHANICS CO., LTD. (KR) | 2014-01-16 | — | — | US | claimed |
| US-20130160289-A1 | ONE-PACK TYPE EPOXY RESIN COMPOSITION AND USE THEREOF | OMRON CORPORATION (JP) | 2013-06-27 | — | — | US | claimed |
| EP-2251369-A1 | ONE-PACK TYPE EPOXY RESIN COMPOSITION AND USE THEREOF | Omron Corporation (JP) | 2010-11-17 | — | — | EP | claimed |
| US-20100255313-A1 | ONE-PACK TYPE EPOXY RESIN COMPOSITION AND USE THEREOF | OMRON CORPORATION (JP) | 2010-10-07 | — | — | US | claimed |
| US-20090230570-A1 | RESIN COMPOSITION AND SEMICONDUCTOR DEVICE EMPOLYING THE SAME | KABUSHIKI KAISHA TOSHIBA (JP) | 2009-09-17 | — | — | US | claimed |
| US-20080261049-A1 | Electroconductive Paste and Substrate Using the Same for Mounting Electronic Parts | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2008-10-23 | — | — | US | claimed |
| US-20060051587-A1 | Thermosetting resin composition and adhesive film | SUMITOMO CHEMICAL COMPANY, LIMITED (JP) | 2006-03-09 | — | — | US | claimed |