SCHEMBL34680

SCHEMBL34680

S=C1NCCS1

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1628000 1.00
SCHEMBL17102937 1.00
SCHEMBL1304705 0.82
SCHEMBL13599846 0.75 SMN1; SMN2 (0.32)
SCHEMBL2318031 0.67
SCHEMBL5470783 0.67 SMN1; SMN2 (0.35)
SCHEMBL9716180 0.65 SMN1; SMN2 (0.33)
SCHEMBL3817007 0.63
SCHEMBL9516315 0.62 SMN1; SMN2 (0.32)
SCHEMBL761333 0.62

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Appears in 2493 patents — a generic fragment claimed broadly, so it's down-weighted as IP noise. Top by claim status then date:

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-122082056-A Electrolyte for preparing high-tensile microporous copper foil, and preparation method and application thereof 2026-05-26 CN claimed
US-20250271423-A1 POLYMER CONJUGATE FOR BLOCKING OF NON-SPECIFIC INTERACTIONS IN IMMUNOCHEMICAL ASSAYS, METHOD OF ITS SYNTHESIS AND USE THEREOF USTAV MAKROMOLEKULARNI CHEMIE AV CR, V.V.I. 2025-08-28 US claimed
CN-119910966-A Aluminum-copper foil-carrying copper-clad plate and preparation method thereof 宁夏锦航新材料科技有限公司 2025-05-02 CN claimed
CN-119900060-A Anti-abrasion composite layer and preparation method thereof 江东金具设备有限公司 2025-04-29 CN claimed
CN-115478306-B High-elongation high-tensile additive and preparation method and application method thereof 江苏梦得新材料科技有限公司 2025-04-22 CN claimed
CN-119753651-A Zn-Fe-P chemical plating gradient anti-abrasion layer and preparation method thereof 国网浙江省电力有限公司电力科学研究院 2025-04-04 CN claimed
CN-117535741-B Electrolytic copper foil capable of being annealed at low temperature and preparation method and application thereof 广东盈华电子科技有限公司 2025-04-04 CN claimed
CN-119753681-A Anti-abrasion layer and preparation method thereof 江东金具设备有限公司 2025-04-04 CN claimed
CN-119710842-A Palladium-nickel alloy electroplating solution 武汉天立表面技术有限公司 2025-03-28 CN claimed
CN-119601666-A Current collector, preparation method thereof, pole piece and secondary battery 上海恩捷新材料科技有限公司 2025-03-11 CN claimed
EP-0068807-A2 Acid copper electroplating baths containing brightening and levelling additives M & T CHEMICALS, INC. (US) 1983-01-05 EP claimed
US-4347108-A 2-THIAZOLIDINETHIONE, 2-IMIDAZOLIDINETHIONE OR A LOWER ALKYL DERIVATIVE ROHCO, INC. (US) 1982-08-31 US claimed
EP-0016420-B1 PROCESS FOR THE PREPARATION OF THIAZOLIDINE-2-THIONES BAYER AG (DE) 1982-01-27 EP claimed
US-4287350-A Process for the preparation of thiazolidine-2-thiones BAYER AKTIENGESELLSCHAFT (DE) 1981-09-01 US claimed
EP-0016420-A1 Process for the preparation of thiazolidine-2-thiones BAYER AG (DE) 1980-10-01 EP claimed
US-4216284-A NONDIFFUSIBLE SILVER BLEACH INHIBITOR FUJI PHOTO FILM CO., LTD. (JP) 1980-08-05 US claimed
US-4148800-A FROM AMINOETHANOLS AND THIONYL CHLORIDE AND CARBON DISULFIDE BAYER AKTIENGESELLSCHAFT (DE) 1979-04-10 US claimed
US-4142900-A Converted-halide photographic emulsions and elements having composite silver halide crystals EASTMAN KODAK COMPANY (US) 1979-03-06 US claimed
US-4001020-A DEVELOPING A SILVER HA1IDE EMULSION IN CONTACT WITH A HETEROCYCLIC THIONE AND A POLYALKYLENE OXIDE FUJI PHOTO FILM CO., LTD. (JA) 1977-01-04 US claimed
US-3960881-A Method for preparing 4-carboxythiazolidine-2-thione PHILLIPS PETROLEUM COMPANY (US) 1976-06-01 US claimed