SCHEMBL3472775

SCHEMBL3472775

CC(c1ccccc1)(c1ccc(C(=O)O)c(C(=O)O)c1)c1ccc(C(=O)O)c(C(=O)O)c1

nearest known ligand 0.53

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ESR1 P03372 2/20 0.53
ESR2 Q92731 2/20 0.53
TDP1 Q9NUW8 1/20 0.50
ALDH1A1 P00352 3/20 0.46
ALOX15 P16050 1/20 0.46
HSD17B10 Q99714 2/20 0.46
CDC25A P30304 1/20 0.46
CDC25B P30305 1/20 0.46
KDM4C Q9H3R0 1/20 0.42
MAPT P10636 1/20 0.41
KMT2A Q03164 1/20 0.41
KDM4E B2RXH2 2/20 0.41
CYP2C19 P33261 1/20 0.40
HIF1A Q16665 1/20 0.40
HPGD P15428 1/20 0.40
POLB P06746 1/20 0.39
RXRB P28702 1/20 0.39
NOTUM Q6P988 1/20 0.39
HDAC3 O15379 1/20 0.39
HDAC4 P56524 1/20 0.39

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL10464294 0.86 ESR1 (0.64) ESR1ESR2TDP1ALDH1A1ALOX15
SCHEMBL11484532 0.86 ESR1 (0.64) ESR1ESR2TDP1ALDH1A1ALOX15
SCHEMBL8579977 0.85 ALDH1A1 (0.52) ESR1ESR2TDP1ALDH1A1ALOX15
SCHEMBL7053224 0.85 CDC25B (0.59) ESR1ESR2TDP1ALDH1A1HSD17B10
SCHEMBL11476131 0.84 ESR1 (0.62) ESR1ESR2TDP1ALDH1A1ALOX15
SCHEMBL5527278 0.82 ESR1 (0.62) ESR1ESR2TDP1ALDH1A1ALOX15
SCHEMBL29396119 0.81 ESR1 (0.53) ESR1ESR2TDP1ALDH1A1ALOX15
SCHEMBL1098749 0.81 ESR1 (0.53) ESR1ESR2TDP1ALDH1A1ALOX15
SCHEMBL105948 0.80 TDP1 (0.56) ESR1ESR2TDP1ALDH1A1ALOX15
SCHEMBL1356449 0.80 TDP1 (0.71) TDP1ALDH1A1ALOX15HSD17B10KDM4E

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 32 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-2092807-B1 COMPOSITE ORGANIC ENCAPSULANTS CDA PROC LTD LIABILITY COMPANY (US) 2013-04-17 EP claimed
US-7745516-B2 Composition of polyimide and sterically-hindered hydrophobic epoxy E. I. DU PONT DE NEMOURS AND COMPANY (US) 2010-06-29 US claimed
US-20090111948-A1 Compositions comprising polyimide and hydrophobic epoxy and phenolic resins, and methods relating thereto CDA PROCESSING LIMITED LIABILITY COMPANY 2009-04-30 US claimed
EP-2027184-A2 HYDROPHOBIC COMPOSITIONS FOR ELECTRONIC APPLICATIONS E.I. DU PONT DE NEMOURS AND COMPANY (US) 2009-02-25 EP claimed
US-20080185561-A1 Resistor compositions for electronic circuitry applications U.S. BANK TRUST COMPANY, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT 2008-08-07 US claimed
US-20080185361-A1 Compositions for electronic circuitry applications and methods relating thereto CDA PROCESSING LIMITED LIABILITY COMPANY 2008-08-07 US claimed
EP-1943311-A1 COMPOSITIONS COMPRISING POLYIMIDE AND HYDROPHOBIC EPOXY, AND METHODS RELATING THERETO E.I.Du pont de nemours and company (US) 2008-07-16 EP claimed
WO-2007146382-A2 HYDROPHOBIC COMPOSITIONS FOR ELECTRONIC APPLICATIONS E. I. DU PONT DE NEMOURS AND COMPANY (US) 2007-12-21 WO claimed
US-20070290379-A1 Hydrophobic compositions for electronic applications E. I. DU PONT DE NEMOURS AND COMPANY 2007-12-20 US claimed
WO-2007047384-A1 COMPOSITIONS COMPRISING POLYIMIDE AND HYDROPHOBIC EPOXY, AND METHODS RELATING THERETO E.I. DU PONT DE NEMOURS AND COMPANY (US) 2007-04-26 WO claimed
US-20070083017-A1 Compositions comprising polyimide and hydrophobic epoxy, and methods relating thereto CDA PROCESSING LIMITED LIABILITY COMPANY 2007-04-12 US claimed
EP-2092807-B1 COMPOSITE ORGANIC ENCAPSULANTS CDA PROC LTD LIABILITY COMPANY (US) 2013-04-17 EP disclosed
US-8233261-B2 Composite organic encapsulants CDA PROCESSING LIMITED LIABILITY COMPANY (US) 2012-07-31 US disclosed
US-7745516-B2 Composition of polyimide and sterically-hindered hydrophobic epoxy E. I. DU PONT DE NEMOURS AND COMPANY (US) 2010-06-29 US disclosed
US-20100085680-A1 CRYSTALLINE ENCAPSULANTS E. I. DU PONT DE NEMOURS AND COMPANY (US) 2010-04-08 US disclosed
US-20070290379-A1 Hydrophobic compositions for electronic applications E. I. DU PONT DE NEMOURS AND COMPANY 2007-12-20 US disclosed
US-20070291440-A1 Organic encapsulant compositions based on heterocyclic polymers for protection of electronic components E. I. DU PONT DE NEMOURS AND COMPANY 2007-12-20 US disclosed
WO-2007047384-A1 COMPOSITIONS COMPRISING POLYIMIDE AND HYDROPHOBIC EPOXY, AND METHODS RELATING THERETO E.I. DU PONT DE NEMOURS AND COMPANY (US) 2007-04-26 WO disclosed
US-20070083016-A1 Photosensitive polyimide compositions E. I. DUPONT DE NEMOURS AND COMPANY 2007-04-12 US disclosed
US-20070083017-A1 Compositions comprising polyimide and hydrophobic epoxy, and methods relating thereto CDA PROCESSING LIMITED LIABILITY COMPANY 2007-04-12 US disclosed