SCHEMBL347279

SCHEMBL347279

CCOc1cc(N)ccc1-c1ccc(N)cc1OCC

nearest known ligand 0.63

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
MAPT P10636 4/20 0.63
GAA P10253 4/20 0.63
KDM4E B2RXH2 3/20 0.63
TSHR P16473 2/20 0.50
TDP1 Q9NUW8 2/20 0.50
ALDH1A1 P00352 5/20 0.48
MEN1 O00255 5/20 0.48
KMT2A Q03164 5/20 0.48
HSD17B10 Q99714 3/20 0.48
TP53 P04637 2/20 0.48
POLB P06746 2/20 0.48
MAPK1 P28482 2/20 0.48
CYP3A4 P08684 1/20 0.48
HPGD P15428 1/20 0.48
L3MBTL1 Q9Y468 1/20 0.48
HTT P42858 2/20 0.44
USP2 O75604 2/20 0.44
CASP1 P29466 1/20 0.44
CASP7 P55210 1/20 0.44
ATM Q13315 1/20 0.44

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL10021510 0.91 MAPT (0.54) MAPTGAAKDM4ETSHRTDP1
SCHEMBL2210399 0.88 MAPT (0.56) MAPTGAAKDM4ETSHRTDP1
SCHEMBL30427138 0.88 MAPT (0.56) MAPTGAAKDM4ETSHRTDP1
SCHEMBL3789873 0.88 ALDH1A1 (0.55) MAPTGAAKDM4ETSHRTDP1
SCHEMBL3783390 0.85 MAPT (0.53) MAPTGAAKDM4ETSHRTDP1
SCHEMBL6753659 0.85 MAPT (0.53) MAPTGAAKDM4ETSHRTDP1
SCHEMBL112468 0.84 MAPT (0.78) MAPTGAAKDM4ETSHRTDP1
SCHEMBL31095359 0.84 MAPT (0.78) MAPTGAAKDM4ETSHRTDP1
SCHEMBL3790341 0.84 MAPT (0.51) MAPTGAAKDM4ETSHRTDP1
SCHEMBL5446140 0.83 GAA (0.65) MAPTGAAKDM4ETSHRTDP1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 96 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-115891346-B Metal-clad laminate, circuit board, electronic component, and electronic device 日铁化学材料株式会社 2026-05-15 CN disclosed
EP-4029690-B1 METAL-CLAD LAMINATE FOR FLEXIBLE ELECTRONIC DEVICES, AND FLEXIBLE ELECTRONIC DEVICE USING SAME NIPPON STEEL CHEMICAL & MAT CO LTD (JP) 2026-04-22 EP disclosed
WO-2025070797-A1 COPOLYMER, RESIN BASE MATERIAL, RESIN COMPOSITION, COATING LIQUID, POLYIMIDE, RESIN FILM, METAL-CLAD LAMINATE, CIRCUIT BOARD, ELECTRONIC DEVICE AND ELECTRONIC APPARATUS, AND MANUFACTURING METHOD 日鉄ケミカル&マテリアル株式会社 2025-04-03 WO disclosed
WO-2025070767-A1 RESIN COMPOSITION, COATING SOLUTION, RESIN FILM, METAL-CLAD LAMINATE, CIRCUIT BOARD, ELECTRONIC DEVICE, AND ELECTRONIC APPARATUS 日鉄ケミカル&マテリアル株式会社 2025-04-03 WO disclosed
CN-112571901-B Polyimide film, metal-clad laminate, and circuit board 日铁化学材料株式会社 2024-12-31 CN disclosed
CN-119217819-A Laminate, metal-clad laminate, circuit board, electronic component, device, adhesive resin composition, method for producing the same, and adhesive film 日铁化学材料株式会社 2024-12-31 CN disclosed
CN-113527882-B Polyimide film and copper-clad laminate 日铁化学材料株式会社 2024-10-18 CN disclosed
CN-118255987-A Polyamic acid, polyimide, resin film, metal-clad laminate, and circuit board 日铁化学材料株式会社 2024-06-28 CN disclosed
CN-111746080-B Metal-clad laminate and circuit board 日铁化学材料株式会社 2024-01-16 CN disclosed
WO-2023195206-A1 POLYIMIDE PRECURSOR COMPOSITION AND POLYIMIDE JFEケミカル株式会社 2023-10-12 WO disclosed
EP-0596150-B1 Solutions of polyimide precursors BASF LACKE & FARBEN (DE) 1997-02-05 EP disclosed
EP-0596149-B1 Solutions of polyimide precursors BASF LACKE & FARBEN (DE) 1996-10-16 EP disclosed
US-5489644-A COMPRISING AROMATIC DIAMINES AND TETRAESTER OF AROMATIC TETRACARBOXYLIC ACID; PROTECTIVE COATING FOR METALS, SILICON WAFERS, GLASS BASF LACKE + FARBEN (DE) 1996-02-06 US disclosed
US-5478918-A Low stress polyimide composition and precursor composition solution of same CENTRAL GLASS COMPANY, LIMITED (JP) 1995-12-26 US disclosed
EP-0659800-A1 Polyimide precursor composition, polyimide composition and process for the production of said polyimide composition CENTRAL GLASS COMPANY, LIMITED (JP) 1995-06-28 EP disclosed
EP-0621299-A1 Solutions of polyimide-forming substances and their use as coating material BASF Lacke + Farben AG (DE) 1994-10-26 EP disclosed
US-5332799-A Aromatic diamines, diesters of aromatic tetracarboxylic acids, circuit coatings BASF LACKE+FARBEN AKTIENGESELLSCHAFT (DE) 1994-07-26 US disclosed
EP-0596150-A1 Solutions of polyimide precursors BASF Lacke + Farben Aktiengesellschaft (DE) 1994-05-11 EP disclosed
EP-0596149-A1 Solutions of polyimide precursors BASF Lacke + Farben Aktiengesellschaft (DE) 1994-05-11 EP disclosed
US-5264545-A Aromatic or partly aromatic diamine with tetracarboxylic acid BASF LACKE+FARBEN AKTIENGESELLSCHAFT (DE) 1993-11-23 US disclosed