Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | PDK2 | Q15119 | 3/20 | 0.42 |
| ▸ | MAPT | P10636 | 4/20 | 0.38 |
| ▸ | KDM4E | B2RXH2 | 4/20 | 0.38 |
| ▸ | MEN1 | O00255 | 3/20 | 0.38 |
| ▸ | ALDH1A1 | P00352 | 3/20 | 0.38 |
| ▸ | KMT2A | Q03164 | 3/20 | 0.38 |
| ▸ | FTO | Q9C0B1 | 1/20 | 0.38 |
| ▸ | GAA | P10253 | 4/20 | 0.35 |
| ▸ | TSHR | P16473 | 2/20 | 0.35 |
| ▸ | GLA | P06280 | 1/20 | 0.35 |
| ▸ | POLB | P06746 | 1/20 | 0.35 |
| ▸ | SMN1; SMN2 | Q16637 | 2/20 | 0.33 |
| ▸ | MAPK1 | P28482 | 2/20 | 0.33 |
| ▸ | MITF | O75030 | 1/20 | 0.33 |
| ▸ | TDP1 | Q9NUW8 | 1/20 | 0.33 |
| ▸ | CA12 | O43570 | 1/20 | 0.33 |
| ▸ | CA1 | P00915 | 1/20 | 0.33 |
| ▸ | CA2 | P00918 | 1/20 | 0.33 |
| ▸ | CA9 | Q16790 | 1/20 | 0.33 |
| ▸ | NPC1 | O15118 | 2/20 | 0.32 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL30397838 | 1.00 | PDK2 (0.42) | PDK2MAPTKDM4EMEN1ALDH1A1 | |
| SCHEMBL30884612 | 0.85 | PDK2 (0.41) | PDK2MAPTKDM4EMEN1ALDH1A1 | |
| SCHEMBL8644400 | 0.77 | FTO (0.44) | PDK2MAPTMEN1ALDH1A1KMT2A | |
| SCHEMBL30398085 | 0.76 | PDK2 (0.43) | PDK2MAPTKDM4EMEN1ALDH1A1 | |
| SCHEMBL3472059 | 0.76 | PDK2 (0.43) | PDK2MAPTKDM4EMEN1ALDH1A1 | |
| SCHEMBL22051892 | 0.72 | MAPT (0.43) | PDK2MAPTKDM4EMEN1ALDH1A1 | |
| SCHEMBL9455472 | 0.72 | PDK2 (0.34) | PDK2MAPTMEN1KMT2AFTO | |
| SCHEMBL9732686 | 0.71 | PDK2 (0.40) | PDK2 | |
| SCHEMBL29617163 | 0.71 | PDK2 (0.40) | PDK2 | |
| SCHEMBL14182658 | 0.70 | CYP3A4 (0.32) | HSD17B10 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 39 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-2092807-B1 | COMPOSITE ORGANIC ENCAPSULANTS | CDA PROC LTD LIABILITY COMPANY (US) | 2013-04-17 | — | — | EP | claimed |
| US-7745516-B2 | Composition of polyimide and sterically-hindered hydrophobic epoxy | E. I. DU PONT DE NEMOURS AND COMPANY (US) | 2010-06-29 | — | — | US | claimed |
| US-20090111948-A1 | Compositions comprising polyimide and hydrophobic epoxy and phenolic resins, and methods relating thereto | CDA PROCESSING LIMITED LIABILITY COMPANY | 2009-04-30 | — | — | US | claimed |
| EP-2027184-A2 | HYDROPHOBIC COMPOSITIONS FOR ELECTRONIC APPLICATIONS | E.I. DU PONT DE NEMOURS AND COMPANY (US) | 2009-02-25 | — | — | EP | claimed |
| WO-2007146382-A2 | HYDROPHOBIC COMPOSITIONS FOR ELECTRONIC APPLICATIONS | E. I. DU PONT DE NEMOURS AND COMPANY (US) | 2007-12-21 | — | — | WO | claimed |
| US-20070290379-A1 | Hydrophobic compositions for electronic applications | E. I. DU PONT DE NEMOURS AND COMPANY | 2007-12-20 | — | — | US | claimed |
| US-20070083016-A1 | Photosensitive polyimide compositions | E. I. DUPONT DE NEMOURS AND COMPANY | 2007-04-12 | — | — | US | claimed |
| US-20070083017-A1 | Compositions comprising polyimide and hydrophobic epoxy, and methods relating thereto | CDA PROCESSING LIMITED LIABILITY COMPANY | 2007-04-12 | — | — | US | claimed |
| WO-2025100302-A1 | NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING CURED RELIEF PATTERN USING SAME, AND SEMICONDUCTOR DEVICE | 旭化成株式会社 | 2025-05-15 | — | — | WO | disclosed |
| US-20250138422-A1 | PHOTOSENSITIVE RESIN COMPOSITION, MANUFACTURING METHOD OF ELECTRONIC DEVICE, AND ELECTRONIC DEVICE | SUMITOMO BAKELITE CO., LTD. (JP) | 2025-05-01 | — | — | US | disclosed |
| WO-2024204317-A1 | RESIN COMPOSITION, FILM, FILM SET, OPTICAL WAVEGUIDE, PHOTOELECTRIC COMPOSITE SUBSTRATE, AND ELECTRONIC COMPONENT | 住友ベークライト株式会社 | 2024-10-03 | — | — | WO | disclosed |
| WO-2024053564-A1 | PHOTOSENSITIVE RESIN COMPOSITION, RESIN FILM, AND ELECTRONIC DEVICE | 住友ベークライト株式会社 | 2024-03-14 | — | — | WO | disclosed |
| WO-2023190309-A1 | SURFACE-MODIFIER RESIN COMPOSITION | 住友ベークライト株式会社 | 2023-10-05 | — | — | WO | disclosed |
| WO-2023054381-A1 | PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING ELECTRONIC DEVICE, ELECTRONIC DEVICE AND LIGHT DEVICE | 住友ベークライト株式会社 | 2023-04-06 | — | — | WO | disclosed |
| WO-2007146383-A1 | ORGANIC ENCAPSULANT COMPOSITIONS BASED ON HETEROCYCLIC POLYMERS FOR PROTECTION OF ELECTRONIC COMPONENTS | E. I. DU PONT DE NEMOURS AND COMPANY (US) | 2007-12-21 | — | — | WO | disclosed |
| US-20070290379-A1 | Hydrophobic compositions for electronic applications | E. I. DU PONT DE NEMOURS AND COMPANY | 2007-12-20 | — | — | US | disclosed |
| US-20070291440-A1 | Organic encapsulant compositions based on heterocyclic polymers for protection of electronic components | E. I. DU PONT DE NEMOURS AND COMPANY | 2007-12-20 | — | — | US | disclosed |
| WO-2007047384-A1 | COMPOSITIONS COMPRISING POLYIMIDE AND HYDROPHOBIC EPOXY, AND METHODS RELATING THERETO | E.I. DU PONT DE NEMOURS AND COMPANY (US) | 2007-04-26 | — | — | WO | disclosed |
| US-20070083016-A1 | Photosensitive polyimide compositions | E. I. DUPONT DE NEMOURS AND COMPANY | 2007-04-12 | — | — | US | disclosed |
| US-20070083017-A1 | Compositions comprising polyimide and hydrophobic epoxy, and methods relating thereto | CDA PROCESSING LIMITED LIABILITY COMPANY | 2007-04-12 | — | — | US | disclosed |