⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL667355 | 0.83 | — | — | |
| SCHEMBL2112026 | 0.81 | — | — | |
| SCHEMBL11700256 | 0.81 | OPRM1 (0.31) | — | |
| SCHEMBL4794587 | 0.79 | AKR1C1 (0.31) | — | |
| SCHEMBL6669191 | 0.78 | — | — | |
| SCHEMBL28337858 | 0.77 | OPRM1 (0.31) | — | |
| SCHEMBL912511 | 0.76 | — | — | |
| SCHEMBL2786782 | 0.76 | OPRM1 (0.33) | — | |
| SCHEMBL11720714 | 0.74 | — | — | |
| SCHEMBL7697446 | 0.73 | OPRM1 (0.32) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 17 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-104710621-B | Substrate bonding phenyl vinyl polysiloxane and its preparation method and application | 深圳新宙邦科技股份有限公司 | 2018-04-17 | — | — | CN | claimed |
| CN-106810700-A | One kind contains phenyl end capped methyl ethylene（Tetraphenyl）Phenyl modified silica gel and preparation method thereof | 沈阳化工大学 | 2017-06-09 | — | — | CN | claimed |
| CN-104710621-A | Phenyl vinyl silicon resin for adhering base as well as preparation method and application thereof | SHENZHEN CAPCHEM TECHNOLOGY CO LTD | 2015-06-17 | — | — | CN | claimed |
| CN-118185016-A | Method for preparing low-viscosity hyperbranched organic silicon resin with high silicon vinyl content | 南京大学 | 2024-06-14 | — | — | CN | disclosed |
| US-10947384-B2 | Curable resin composition, cured product thereof, and semiconductor device | DAICEL CORPORATION (JP) | 2021-03-16 | — | — | US | disclosed |
| US-20190218346-A1 | CURABLE RESIN COMPOSITION, CURED PRODUCT THEREOF, AND SEMICONDUCTOR DEVICE | DAICEL CORPORATION (JP) | 2019-07-18 | — | — | US | disclosed |
| CN-106810700-A | One kind contains phenyl end capped methyl ethylene（Tetraphenyl）Phenyl modified silica gel and preparation method thereof | 沈阳化工大学 | 2017-06-09 | — | — | CN | disclosed |
| CN-104710621-A | Phenyl vinyl silicon resin for adhering base as well as preparation method and application thereof | SHENZHEN CAPCHEM TECHNOLOGY CO LTD | 2015-06-17 | — | — | CN | disclosed |
| EP-2057239-B1 | BRANCHED POLYSILOXANE COMPOSITION | MOMENTIVE PERFORMANCE MAT INC (US) | 2015-03-04 | — | — | EP | disclosed |
| EP-2057238-B1 | COMPOSITION CONTAINING ANTI-MISTING COMPONENT | MOMENTIVE PERFORMANCE MAT INC (US) | 2012-10-10 | — | — | EP | disclosed |
| US-7649071-B2 | Branched polysiloxane composition | MOMENTIVE PERFORMANCE MATERIALS INC. (US) | 2010-01-19 | — | — | US | disclosed |
| US-7560167-B2 | branched polysiloxane component; paper release coating; high-speed coating processes | MOMENTIVE PERFORMANCE MATERIALS INC. (US) | 2009-07-14 | — | — | US | disclosed |
| WO-2008140761-A2 | BRANCHED POLYSILOXANE OF REDUCED MOLECULAR WEIGHT AND VISCOSITY | MOMENTIVE PERFORMANCE MATERIALS INC. (US) | 2008-11-20 | — | — | WO | disclosed |
| US-20080276836-A1 | Composition containing anti-misting component of reduced molecular weight and viscosity | MOMENTIVE PERFORMANCE MATERIALS INC. | 2008-11-13 | — | — | US | disclosed |
| US-20080281055-A1 | Branched polysiloxane of reduced molecular weight and viscosity | MOMENTIVE PERFORMANCE MATERIALS INC. | 2008-11-13 | — | — | US | disclosed |
| US-20080058491-A1 | Branched polysiloxane composition | GENERAL ELECTRIC COMPANY (US) | 2008-03-06 | — | — | US | disclosed |
| US-20080058479-A1 | Composition containing anti-misting component | GENERAL ELECTRIC COMPANY (US) | 2008-03-06 | — | — | US | disclosed |