⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL3481242 | 0.83 | — | — | |
| SCHEMBL11700256 | 0.83 | OPRM1 (0.31) | — | |
| SCHEMBL3482070 | 0.75 | — | — | |
| SCHEMBL912511 | 0.71 | — | — | |
| SCHEMBL1552116 | 0.67 | OPRM1 (0.36) | — | |
| SCHEMBL4794587 | 0.67 | AKR1C1 (0.31) | — | |
| SCHEMBL8573142 | 0.67 | OPRM1 (0.33) | — | |
| SCHEMBL28412642 | 0.67 | — | — | |
| SCHEMBL2112026 | 0.67 | — | — | |
| SCHEMBL335956 | 0.66 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 50 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-12521919-B2 | Anisotropic film and method for manufacturing anisotropic film | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2026-01-13 | — | — | US | disclosed |
| US-20240286321-A1 | ANISOTROPIC FILM AND METHOD FOR MANUFACTURING ANISOTROPIC FILM | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2024-08-29 | — | — | US | disclosed |
| CN-111205788-B | Anisotropic film and method for producing anisotropic film | 信越化学工业株式会社 | 2024-06-07 | — | — | CN | disclosed |
| EP-2626898-B1 | Sealant laminated composite and method for sealing a semiconductor devices mounting substrate using the sealant laminated composite | SHINETSU CHEMICAL CO (JP) | 2021-05-19 | — | — | EP | disclosed |
| EP-2469590-B1 | Fiber-containing resin substrate for sealing semiconductor devices or a wafer and a method of sealing a semiconductor apparatus using a fiber-containing resin substrate | SHINETSU CHEMICAL CO (JP) | 2020-08-12 | — | — | EP | disclosed |
| CN-111205788-A | Anisotropic film and method for producing anisotropic film | 信越化学工业株式会社 | 2020-05-29 | — | — | CN | disclosed |
| US-20200156291-A1 | ANISOTROPIC FILM AND METHOD FOR MANUFACTURING ANISOTROPIC FILM | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2020-05-21 | — | — | US | disclosed |
| EP-3024021-B1 | METHOD FOR MANUFACTURING A SEMICONDUCTOR APPARATUS | SHINETSU CHEMICAL CO (JP) | 2020-03-25 | — | — | EP | disclosed |
| CN-104851826-B | Vacuum laminating apparatus and method for manufacturing semiconductor device | 信越化学工业株式会社 | 2020-02-21 | — | — | CN | disclosed |
| US-10242924-B2 | Base-attached encapsulant for semiconductor encapsulation, semiconductor apparatus | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2019-03-26 | — | — | US | disclosed |
| US-20140138856-A1 | FIBER-CONTAINING RESIN SUBSTRATE, DEVICE-MOUNTING SUBSTRATE AND DEVICE-FORMING WAFER, SEMICONDUCTOR APPARATUS, AND METHOD FOR PRODUCING SEMICONDUCTOR APPARATUS | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2014-05-22 | — | — | US | disclosed |
| US-20140138857-A1 | ENCAPSULANT EQUIPPED WITH SUPPORTING SUBSTRATE, ENCAPSULATED SUBSTRATE HAVING SEMICONDUCTOR DEVICES MOUNTING THEREON, ENCAPSULATED WAFER HAVING SEMICONDUCTOR DEVICES FORMING THEREON, SEMICONDUCTOR APPARATUS, AND METHOD FOR MANUFACTURING SEMICONDUCTOR APPARATUS | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2014-05-22 | — | — | US | disclosed |
| US-8610293-B2 | Resin composition for encapsulating optical semiconductor element and optical semiconductor device | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2013-12-17 | — | — | US | disclosed |
| EP-2626898-A2 | Sealant laminated composite, sealed semiconductor devices mounting substrate, sealed semiconductor devices forming wafer, semiconductor apparatus, and method for manufacturing semiconductor apparatus | Shin-Etsu Chemical Co., Ltd. (JP) | 2013-08-14 | — | — | EP | disclosed |
| US-20130200534-A1 | SEALANT LAMINATED COMPOSITE, SEALED SEMICONDUCTOR DEVICES MOUNTING SUBSTRATE, SEALED SEMICONDUCTOR DEVICES FORMING WAFER, SEMICONDUCTOR APPARATUS, AND METHOD FOR MANUFACTURING SEMICONDUCTOR APPARATUS | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2013-08-08 | — | — | US | disclosed |
| US-20120161339-A1 | FIBER-CONTAINING RESIN SUBSTRATE, SEALED SUBSTRATE HAVING SEMICONDUCTOR DEVICE MOUNTED THEREON, SEALED WAFER HAVING SEMICONDUCTOR DEVICE FORMED THEREON, A SEMICONDUCTOR APPARATUS, AND METHOD FOR MANUFACTURING SEMICONDUCTOR APPARATUS | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2012-06-28 | — | — | US | disclosed |
| EP-2469590-A2 | Fiber-containing resin substrate, sealed substrate having semiconductor device mounted thereon, sealed wafer having semiconductor device formed thereon, a semiconductor apparatus, and method for manufacturing semiconductor apparatus | Shin-Etsu Chemical Co., Ltd. (JP) | 2012-06-27 | — | — | EP | disclosed |
| US-20120043577-A1 | CURABLE SILICONE RESIN COMPOSITION AND LIGHT-EMITTING DIODE DEVICE USING THE SAME | SHIN-ETSU CEMICAL CO., LTD. (JP) | 2012-02-23 | — | — | US | disclosed |
| EP-2336230-A1 | Resin composition for encapsulating optical semiconductor element and optical semiconductor device | Shin-Etsu Chemical Co., Ltd. (JP) | 2011-06-22 | — | — | EP | disclosed |
| US-20110140289-A1 | RESIN COMPOSITION FOR ENCAPSULATING OPTICAL SEMICONDUCTOR ELEMENT AND OPTICAL SEMICONDUCTOR DEVICE | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2011-06-16 | — | — | US | disclosed |