Predicted protein targets (top 2)
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL415769 | 1.00 | LMNA (0.30) | LMNATSHR | |
| SCHEMBL3481922 | 0.95 | TSHR (0.35) | TSHR | |
| SCHEMBL537510 | 0.95 | TSHR (0.33) | LMNATSHR | |
| SCHEMBL9091916 | 0.92 | TSHR (0.40) | TSHR | |
| SCHEMBL706254 | 0.92 | TSHR (0.37) | TSHR | |
| SCHEMBL16497599 | 0.92 | TSHR (0.37) | TSHR | |
| SCHEMBL3481532 | 0.90 | — | — | |
| SCHEMBL613245 | 0.89 | TSHR (0.39) | TSHR | |
| SCHEMBL415691 | 0.89 | — | — | |
| SCHEMBL610797 | 0.86 | TSHR (0.44) | TSHR |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 34 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-115155113-B | Structure for organic silicon defoamer and synthesis method thereof | 佛山市南海大田化学有限公司 | 2023-09-29 | — | — | CN | claimed |
| EP-4056604-B1 | METHOD FOR PRODUCING COPOLYMER OF 1,3,7-OCTATRIENE AND STYRENE | KURARAY CO (JP) | 2023-08-02 | — | — | EP | disclosed |
| EP-3564280-B1 | COPOLYMER OF 1, 3, 7-OCTATRIENE AND STYRENE AND HYDRIDE THEREOF | KURARAY CO (JP) | 2023-07-26 | — | — | EP | disclosed |
| EP-4163312-A1 | COPOLYMER OF 1,3,7-OCTATRIENE AND ISOPRENE, HYDRIDE THEREOF, AND METHOD FOR PRODUCING SAID COPOLYMER | Kuraray Co., Ltd. (JP) | 2023-04-12 | — | — | EP | disclosed |
| EP-4163311-A1 | COPOLYMER OF 1,3,7-OCTATRIENE AND ISOPRENE, HYDRIDE THEREOF, AND METHOD FOR PRODUCING SAID COPOLYMER | Kuraray Co., Ltd. (JP) | 2023-04-12 | — | — | EP | disclosed |
| EP-3564274-B1 | 1, 3, 7-OCTATRIENE POLYMER, HYDRIDE THEREOF, AND METHOD FOR PRODUCING SAID POLYMER | KURARAY CO (JP) | 2022-12-28 | — | — | EP | disclosed |
| EP-4056604-A1 | METHOD FOR PRODUCING COPOLYMER OF 1,3,7-OCTATRIENE AND STYRENE | Kuraray Co., Ltd. (JP) | 2022-09-14 | — | — | EP | disclosed |
| US-11332567-B2 | Copolymer of 1, 3, 7-octatriene and butadiene, hydride thereof, and method for producing said copolymer | KURARAY CO., LTD. (JP) | 2022-05-17 | — | — | US | disclosed |
| US-11198744-B2 | 1,3, 7-octatriene polymer, hydride thereof, and method for producing said polymer | KURARAY CO., LTD. (JP) | 2021-12-14 | — | — | US | disclosed |
| US-11091578-B2 | Copolymer of 1,3,7-octatriene and isoprene, hydride thereof, and method for producing said copolymer | KURARAY CO., LTD. (JP) | 2021-08-17 | — | — | US | disclosed |
| US-20180282600-A1 | TIRE WITH REDUCED CAVITY NOISE | HANKOOK TIRE CO., LTD. (KR) | 2018-10-04 | — | — | US | disclosed |
| EP-3381712-A1 | TIRE WITH REDUCED CAVITY NOISE | Hankook Tire Co., Ltd. (KR) | 2018-10-03 | — | — | EP | disclosed |
| US-20180134933-A1 | TIRE WITH REDUCED CAVITY NOISE | HANKOOK TIRE CO., LTD. (KR) | 2018-05-17 | — | — | US | disclosed |
| EP-3321108-A1 | TIRE WITH REDUCED CAVITY NOISE | Hankook Tire Co., Ltd. (KR) | 2018-05-16 | — | — | EP | disclosed |
| US-20170204214-A1 | METHOD FOR MANUFACTURING HYDROGENATED POLYMER | KURARAY CO., LTD. (JP) | 2017-07-20 | — | — | US | disclosed |
| EP-3162816-A1 | METHOD FOR MANUFACTURING HYDROGENATED POLYMER | Kuraray Co., Ltd. (JP) | 2017-05-03 | — | — | EP | disclosed |
| EP-2128897-B1 | SILICON DIELECTRIC TREATING AGENT FOR USE AFTER ETCHING, PROCESS FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE | FUJITSU LTD (JP) | 2015-05-06 | — | — | EP | disclosed |
| US-8716209-B2 | Agent for post-etch treatment of silicon dielectric film, method of manufacturing semiconductor device, and semiconductor device | FUJITSU LIMITED (JP) | 2014-05-06 | — | — | US | disclosed |
| US-20100007031-A1 | AGENT FOR POST-ETCH TREATMENT OF SILICON DIELECTRIC FILM, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE | FUJITSU LIMITED (JP) | 2010-01-14 | — | — | US | disclosed |
| EP-2128897-A1 | SILICON DIELECTRIC TREATING AGENT FOR USE AFTER ETCHING, PROCESS FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE | Fujitsu Limited (JP) | 2009-12-02 | — | — | EP | disclosed |