⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL335572 | 0.85 | — | — | |
| SCHEMBL3481328 | 0.83 | — | — | |
| SCHEMBL8440192 | 0.83 | — | — | |
| SCHEMBL3481321 | 0.80 | — | — | |
| SCHEMBL13621335 | 0.80 | — | — | |
| SCHEMBL4851011 | 0.79 | — | — | |
| SCHEMBL335955 | 0.78 | — | — | |
| SCHEMBL217872 | 0.78 | — | — | |
| SCHEMBL13621362 | 0.78 | — | — | |
| SCHEMBL13621351 | 0.78 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 24 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-3608367-B1 | ROOM-TEMPERATURE-CURABLE ORGANOPOLYSILOXANE COMPOSITION AND BASE MATERIAL | SHINETSU CHEMICAL CO (JP) | 2024-07-10 | — | — | EP | disclosed |
| CN-109661435-B | Curable resin composition, cured product thereof, and semiconductor device | 日亚化学工业株式会社 | 2022-04-12 | — | — | CN | disclosed |
| US-10947384-B2 | Curable resin composition, cured product thereof, and semiconductor device | DAICEL CORPORATION (JP) | 2021-03-16 | — | — | US | disclosed |
| US-10941317-B2 | Room-temperature-curable organopolysiloxane composition and base material | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2021-03-09 | — | — | US | disclosed |
| EP-3608367-A1 | ROOM-TEMPERATURE-CURABLE ORGANOPOLYSILOXANE COMPOSITION AND BASE MATERIAL | Shin-Etsu Chemical Co., Ltd. (JP) | 2020-02-12 | — | — | EP | disclosed |
| US-20200032103-A1 | ROOM-TEMPERATURE-CURABLE ORGANOPOLYSILOXANE COMPOSITION AND BASE MATERIAL | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2020-01-30 | — | — | US | disclosed |
| CN-110177841-A | Hardening resin composition, its solidfied material and semiconductor device | 株式会社大赛璐 | 2019-08-27 | — | — | CN | disclosed |
| US-20190218346-A1 | CURABLE RESIN COMPOSITION, CURED PRODUCT THEREOF, AND SEMICONDUCTOR DEVICE | DAICEL CORPORATION (JP) | 2019-07-18 | — | — | US | disclosed |
| CN-109661435-A | Hardening resin composition, its solidfied material and semiconductor device | 株式会社大赛璐 | 2019-04-19 | — | — | CN | disclosed |
| EP-2057239-B1 | BRANCHED POLYSILOXANE COMPOSITION | MOMENTIVE PERFORMANCE MAT INC (US) | 2015-03-04 | — | — | EP | disclosed |
| EP-2057239-A2 | BRANCHED POLYSILOXANE COMPOSITION | Momentive Performance Materials Inc. (US) | 2009-05-13 | — | — | EP | disclosed |
| WO-2008140762-A2 | COMPOSITION CONTAINING ANTI-MISTING COMPONENT OF REDUCED MOLECULAR WEIGHT AND VISCOSITY | MOMENTIVE PERFORMANCE MATERIALS INC. (US) | 2008-11-20 | — | — | WO | disclosed |
| WO-2008140761-A2 | BRANCHED POLYSILOXANE OF REDUCED MOLECULAR WEIGHT AND VISCOSITY | MOMENTIVE PERFORMANCE MATERIALS INC. (US) | 2008-11-20 | — | — | WO | disclosed |
| US-20080276836-A1 | Composition containing anti-misting component of reduced molecular weight and viscosity | MOMENTIVE PERFORMANCE MATERIALS INC. | 2008-11-13 | — | — | US | disclosed |
| US-20080281055-A1 | Branched polysiloxane of reduced molecular weight and viscosity | MOMENTIVE PERFORMANCE MATERIALS INC. | 2008-11-13 | — | — | US | disclosed |
| WO-2008027497-A2 | BRANCHED POLYSILOXANE COMPOSITION | MOMENTIVE PERFORMANCE MATERIALS INC. (US) | 2008-03-06 | — | — | WO | disclosed |
| US-20080058491-A1 | Branched polysiloxane composition | GENERAL ELECTRIC COMPANY (US) | 2008-03-06 | — | — | US | disclosed |
| WO-2008027494-A2 | COMPOSITION CONTAINING ANTI-MISTING COMPONENT | MOMENTIVE PERFORMANCE MATERIALS INC. (US) | 2008-03-06 | — | — | WO | disclosed |
| US-20080058479-A1 | Composition containing anti-misting component | GENERAL ELECTRIC COMPANY (US) | 2008-03-06 | — | — | US | disclosed |
| US-4398010-A | CONTAINING PLATINUM | SWS SILICONES CORPORATION (US) | 1983-08-09 | — | — | US | disclosed |