Predicted protein targets (top 15)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | ESR1 | P03372 | 1/20 | 0.34 |
| ▸ | ESR2 | Q92731 | 1/20 | 0.34 |
| ▸ | TP53 | P04637 | 2/20 | 0.33 |
| ▸ | KDM4E | B2RXH2 | 1/20 | 0.33 |
| ▸ | NPC1 | O15118 | 1/20 | 0.33 |
| ▸ | ALDH1A1 | P00352 | 1/20 | 0.33 |
| ▸ | HPGD | P15428 | 1/20 | 0.33 |
| ▸ | RAB9A | P51151 | 1/20 | 0.33 |
| ▸ | SMN1; SMN2 | Q16637 | 1/20 | 0.33 |
| ▸ | TSHR | P16473 | 1/20 | 0.33 |
| ▸ | LTA4H | P09960 | 1/20 | 0.33 |
| ▸ | ELANE | P08246 | 1/20 | 0.32 |
| ▸ | MAPT | P10636 | 1/20 | 0.32 |
| ▸ | RELA | Q04206 | 1/20 | 0.31 |
| ▸ | NPSR1 | Q6W5P4 | 1/20 | 0.31 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL6116111 | 0.89 | ESR1 (0.34) | ESR1 | |
| SCHEMBL3482587 | 0.83 | LMNA (0.36) | ESR1ESR2TP53ALDH1A1HPGD | |
| SCHEMBL13089129 | 0.83 | ESR1 (0.32) | ESR1ESR2TP53KDM4ENPC1 | |
| SCHEMBL3482722 | 0.83 | ESR1 (0.32) | ESR1ESR2TP53KDM4ENPC1 | |
| SCHEMBL10942685 | 0.83 | ESR1 (0.32) | ESR1ESR2TP53KDM4ENPC1 | |
| SCHEMBL18328935 | 0.83 | — | — | |
| SCHEMBL13089521 | 0.83 | — | — | |
| SCHEMBL15249587 | 0.82 | ESR1 (0.37) | ESR1ESR2TP53KDM4ENPC1 | |
| SCHEMBL19130352 | 0.82 | ESR1 (0.31) | ESR1ESR2TP53KDM4ENPC1 | |
| SCHEMBL19130399 | 0.82 | ESR1 (0.31) | ESR1ESR2TP53KDM4ENPC1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 21 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-109438633-A | A kind of organosilicon toughener and its synthetic method with anti-drop effect | 广东优科艾迪高分子材料有限公司 | 2019-03-08 | — | — | CN | disclosed |
| CN-109337025-A | A kind of anti-dripping agent and its synthetic method with toughening effect | 广东优科艾迪高分子材料有限公司 | 2019-02-15 | — | — | CN | disclosed |
| CN-109320674-A | A kind of anti-dripping agent and preparation method thereof containing PTFE and organosilicon | 广东优科艾迪高分子材料有限公司 | 2019-02-12 | — | — | CN | disclosed |
| CN-109320937-A | A kind of organic silicon fibre retardant and preparation method thereof based on poroid inorganic matter | 铨盛（云浮）新型聚合物有限公司 | 2019-02-12 | — | — | CN | disclosed |
| CN-109320772-A | A kind of anti-dripping agent and preparation method thereof containing organosilicon and inorganic silicon | 广东优科艾迪高分子材料有限公司 | 2019-02-12 | — | — | CN | disclosed |
| CN-109306169-A | A kind of hydridization organic matter and the organic silicon fibre retardant of nano silica and preparation method thereof | 铨盛（云浮）新型聚合物有限公司 | 2019-02-05 | — | — | CN | disclosed |
| CN-109293853-A | A kind of organic silicon fibre retardant and preparation method thereof containing epoxy group | 铨盛聚碳科技股份有限公司 | 2019-02-01 | — | — | CN | disclosed |
| CN-109293856-A | A kind of the organosilicon toughener and its synthetic method of polymer overmold nano-inorganic substance | 铨盛聚碳科技股份有限公司 | 2019-02-01 | — | — | CN | disclosed |
| CN-109233160-A | A kind of organic silicon fibre retardant and preparation method thereof containing PTFE and nano silica | 铨盛聚碳科技股份有限公司 | 2019-01-18 | — | — | CN | disclosed |
| US-9546237-B2 | Stabilization of polymers that contain a hydrolyzable functionality | BRIDGESTONE CORPORATION (JP) | 2017-01-17 | — | — | US | disclosed |
| US-9035446-B2 | Power module | FUJI ELECTRIC CO., LTD. (JP) | 2015-05-19 | — | — | US | disclosed |
| EP-2128897-B1 | SILICON DIELECTRIC TREATING AGENT FOR USE AFTER ETCHING, PROCESS FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE | FUJITSU LTD (JP) | 2015-05-06 | — | — | EP | disclosed |
| US-20140319669-A1 | POWER MODULE | FUJI ELECTRIC CO., LTD. (JP) | 2014-10-30 | — | — | US | disclosed |
| US-20140319669-A1 | POWER MODULE | FUJI ELECTRIC CO., LTD. (JP) | 2014-10-30 | — | — | US | disclosed |
| US-8716209-B2 | Agent for post-etch treatment of silicon dielectric film, method of manufacturing semiconductor device, and semiconductor device | FUJITSU LIMITED (JP) | 2014-05-06 | — | — | US | disclosed |
| US-20130331520-A1 | STABILIZATION OF POLYMERS THAT CONTAIN A HYDROLYZABLE FUNCTIONALITY | BRIDGESTONE CORPORATION (JP) | 2013-12-12 | — | — | US | disclosed |
| US-20100007031-A1 | AGENT FOR POST-ETCH TREATMENT OF SILICON DIELECTRIC FILM, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE | FUJITSU LIMITED (JP) | 2010-01-14 | — | — | US | disclosed |
| EP-2128897-A1 | SILICON DIELECTRIC TREATING AGENT FOR USE AFTER ETCHING, PROCESS FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE | Fujitsu Limited (JP) | 2009-12-02 | — | — | EP | disclosed |
| US-20090108488-A1 | Process for Production of Hybrid Polymeric Material | KANEKA CORPORATION (JP) | 2009-04-30 | — | — | US | disclosed |
| EP-0129834-A2 | Photo and radiation-sensitive organopolymeric material | HITACHI, LTD. (JP) | 1985-01-02 | — | — | EP | disclosed |