Predicted protein targets (top 1)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | LMNA | P02545 | 1/20 | 0.30 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL4813903 | 0.79 | OPRM1 (0.33) | — | |
| SCHEMBL3481780 | 0.79 | HSD17B10 (0.31) | — | |
| SCHEMBL12677620 | 0.79 | — | — | |
| SCHEMBL1585586 | 0.79 | — | — | |
| SCHEMBL13324280 | 0.79 | — | — | |
| SCHEMBL16497577 | 0.78 | LMNA (0.30) | LMNA | |
| SCHEMBL825955 | 0.78 | LMNA (0.30) | LMNA | |
| SCHEMBL1781373 | 0.76 | — | — | |
| SCHEMBL9662971 | 0.76 | — | — | |
| SCHEMBL16714758 | 0.75 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 7 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-113024725-A | Curable composition, cured product, (meth) acrylic resin, and compound | 东京应化工业株式会社 | 2021-06-25 | — | — | CN | disclosed |
| CN-113031399-A | Resin composition, cured product, and siloxane-modified (meth) acrylic resin | 东京应化工业株式会社 | 2021-06-25 | — | — | CN | disclosed |
| EP-2128897-B1 | SILICON DIELECTRIC TREATING AGENT FOR USE AFTER ETCHING, PROCESS FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE | FUJITSU LTD (JP) | 2015-05-06 | — | — | EP | disclosed |
| US-8716209-B2 | Agent for post-etch treatment of silicon dielectric film, method of manufacturing semiconductor device, and semiconductor device | FUJITSU LIMITED (JP) | 2014-05-06 | — | — | US | disclosed |
| US-20100007031-A1 | AGENT FOR POST-ETCH TREATMENT OF SILICON DIELECTRIC FILM, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE | FUJITSU LIMITED (JP) | 2010-01-14 | — | — | US | disclosed |
| EP-2128897-A1 | SILICON DIELECTRIC TREATING AGENT FOR USE AFTER ETCHING, PROCESS FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE | Fujitsu Limited (JP) | 2009-12-02 | — | — | EP | disclosed |
| US-5122490-A | Composed of organomagesium compounds, titanium and vanadium halides, alcohols, halogenated silanes, siloxanes, borates, electron donors and cyclic ether | CHISSO CORPORATION (JP) | 1992-06-16 | — | — | US | disclosed |