SCHEMBL3481923

SCHEMBL3481923

C=C[SiH](C=C)OCCC

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL15302339 0.84 TSHR (0.40)
SCHEMBL15302119 0.82 TSHR (0.37)
SCHEMBL81525 0.78 TSHR (0.30)
SCHEMBL1585576 0.77
SCHEMBL8856928 0.76
SCHEMBL3481994 0.76
SCHEMBL3482349 0.74
SCHEMBL22654218 0.74 ALDH1A1 (0.32)
Propene SCHEMBL27787474 0.72 TSHR (0.30)
SCHEMBL22654142 0.72

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 17 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-1212380-A1 CHEMICALLY MODIFIED SILICA FILLERS, PROCESS FOR PRODUCING, AND SILICONE COMPOSITIONS CONTAINING SAME DOW CORNING CORPORATION (US) 2002-06-12 EP claimed
US-6384125-B1 CONTACTING ACIDIC AQUEOUS SUSPENSION OF PRECIPITATED OR COLLOIDAL SILICA WITH COMBINATION OF FUNCTIONALIZING COUPLING AGENT AND ORGANOMETALLIC HYDROPHOBING COMPOUND, NEUTRALIZING TO INCREASE PH, RECOVERING MODIFIED FILLER DOW CORNING CORPORATION 2002-05-07 US claimed
WO-2001014480-A1 CHEMICALLY MODIFIED SILICA FILLERS, PROCESS FOR PRODUCING, AND SILICONE COMPOSITIONS CONTAINING SAME DOW CORNING CORPORATION (US) 2001-03-01 WO claimed
CN-118843711-A Material for gas barrier film, silicon oxide film, and method for producing silicon oxide film 东曹株式会社 2024-10-25 CN disclosed
CN-117355632-A Method for producing planarizing film, material for planarizing film, and planarizing film 东曹株式会社 2024-01-05 CN disclosed
EP-2128897-B1 SILICON DIELECTRIC TREATING AGENT FOR USE AFTER ETCHING, PROCESS FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE FUJITSU LTD (JP) 2015-05-06 EP disclosed
US-8791221-B2 Addition-curable metallosiloxane compound DAICEL CORPORATION (JP) 2014-07-29 US disclosed
US-8716209-B2 Agent for post-etch treatment of silicon dielectric film, method of manufacturing semiconductor device, and semiconductor device FUJITSU LIMITED (JP) 2014-05-06 US disclosed
EP-2650319-A1 ADDITION-CURABLE METALLOSILOXANE COMPOUND Daicel Corporation (JP) 2013-10-16 EP disclosed
US-20130267653-A1 ADDITION-CURABLE METALLOSILOXANE COMPOUND DAICEL CORPORATION (JP) 2013-10-10 US disclosed
CN-102559209-A LIQUID CRYSTAL ALIGNING AGENT, METHOD FOR FORMING LIQUID CRYSTAL ALIGNMENT FILM, AND LIQUID CRYSTAL DISPLAY DEVICE JSR CORP 2012-07-11 CN disclosed
CN-102385192-A Cholesteric liquid crystal display manufacturing method, cholesteric liquid crystal display and liquid crystal aligning agent JSR CORP 2012-03-21 CN disclosed
US-20100007031-A1 AGENT FOR POST-ETCH TREATMENT OF SILICON DIELECTRIC FILM, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE FUJITSU LIMITED (JP) 2010-01-14 US disclosed
EP-2128897-A1 SILICON DIELECTRIC TREATING AGENT FOR USE AFTER ETCHING, PROCESS FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE Fujitsu Limited (JP) 2009-12-02 EP disclosed
EP-1212380-A1 CHEMICALLY MODIFIED SILICA FILLERS, PROCESS FOR PRODUCING, AND SILICONE COMPOSITIONS CONTAINING SAME DOW CORNING CORPORATION (US) 2002-06-12 EP disclosed
US-6384125-B1 CONTACTING ACIDIC AQUEOUS SUSPENSION OF PRECIPITATED OR COLLOIDAL SILICA WITH COMBINATION OF FUNCTIONALIZING COUPLING AGENT AND ORGANOMETALLIC HYDROPHOBING COMPOUND, NEUTRALIZING TO INCREASE PH, RECOVERING MODIFIED FILLER DOW CORNING CORPORATION 2002-05-07 US disclosed
WO-2001014480-A1 CHEMICALLY MODIFIED SILICA FILLERS, PROCESS FOR PRODUCING, AND SILICONE COMPOSITIONS CONTAINING SAME DOW CORNING CORPORATION (US) 2001-03-01 WO disclosed