SCHEMBL3482046

SCHEMBL3482046

CCCCC(CC)[SiH](OCC)OCC

nearest known ligand 0.33

Predicted protein targets (top 11)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 3/20 0.33
TDP1 Q9NUW8 1/20 0.33
CA2 P00918 3/20 0.32
CA1 P00915 2/20 0.32
TSHR P16473 2/20 0.32
CYP3A4 P08684 2/20 0.32
SMN1; SMN2 Q16637 1/20 0.32
DNM1 Q05193 2/20 0.32
L3MBTL1 Q9Y468 1/20 0.31
MAPK1 P28482 1/20 0.31
OPRM1 P35372 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL23611409 0.93 OPRM1 (0.39) CYP3A4DNM1OPRM1
SCHEMBL6303884 0.91 OPRM1 (0.38) CYP3A4DNM1OPRM1
SCHEMBL6298286 0.91 OPRM1 (0.38) CYP3A4DNM1OPRM1
SCHEMBL11794046 0.91 OPRM1 (0.38) CYP3A4DNM1OPRM1
SCHEMBL27837323 0.91 DNM1 (0.35) ALDH1A1TDP1CA2CA1TSHR
SCHEMBL5834139 0.86
SCHEMBL3482648 0.84 CYP3A4 (0.32) ALDH1A1TDP1CA2CA1TSHR
SCHEMBL17937691 0.83
SCHEMBL2927194 0.83 CYP3A4 (0.32) CYP3A4
SCHEMBL11783473 0.83

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 23 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-3429980-B1 SURFACE APPLIED CORROSION INHIBITOR SIKA TECH AG (CH) 2026-05-13 EP disclosed
CN-110573964-B Negative photosensitive resin composition and cured film 东丽株式会社 2023-11-03 CN disclosed
CN-109071366-B Surface applied corrosion inhibitor 建筑研究和技术有限公司 2022-05-10 CN disclosed
US-20210214564-A1 SURFACE APPLIED CORROSION INHIBITOR SIKA TECHNOLOGY AG (CH) 2021-07-15 US disclosed
US-11001716-B2 Surface applied corrosion inhibitor CONSTRUCTION RESEARCH & TECHNOLOGY GMBH (DE) 2021-05-11 US disclosed
US-20190092948-A1 SURFACE APPLIED CORROSION INHIBITOR SIKA TECHNOLOGY AG (CH) 2019-03-28 US disclosed
EP-3429980-A1 SURFACE APPLIED CORROSION INHIBITOR Construction Research & Technology GmbH (DE) 2019-01-23 EP disclosed
WO-2017157836-A1 SURFACE APPLIED CORROSION INHIBITOR CONSTRUCTION RESEARCH & TECHNOLOGY GMBH (DE) 2017-09-21 WO disclosed
EP-2128897-B1 SILICON DIELECTRIC TREATING AGENT FOR USE AFTER ETCHING, PROCESS FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE FUJITSU LTD (JP) 2015-05-06 EP disclosed
US-8716209-B2 Agent for post-etch treatment of silicon dielectric film, method of manufacturing semiconductor device, and semiconductor device FUJITSU LIMITED (JP) 2014-05-06 US disclosed
EP-1003199-B1 Inorganic particle-containing composition, transfer film comprising the same and plasma display panel production process JSR CORP (JP) 2004-05-12 EP disclosed
US-6548582-B2 Inorganic particles, binder resin and at least one plasticizer selected from dialk(en)yl ester of alkanedioic acids, or alkoxyalkylylated esters therof, or 1,2-propanediol 1-alkanoates; flexibility JSR CORPORATION (JP) 2003-04-15 US disclosed
EP-0877003-B1 Glass paste composition JSR CORP (JP) 2002-09-18 EP disclosed
US-20020035183-A1 Inorgaic particle-containing composition, transfer film comprising the same and plasma display panel production process JSR CORPORATION (JP) 2002-03-21 US disclosed
US-20020016401-A1 Inorganic particle-containing composition, transfer film comprising the same and plasma display panel production process JSR CORPORATION (JP) 2002-02-07 US disclosed
US-6339118-B1 FOR FORMING BARRIER, ELECTRODE, RESISTOR, DIELECTRIC LAYER, PHOSPHOR, COLOR FILTER OR BLACK MATRIX OF PLASMA DISPLAY PANEL JSR CORPORATION (JP) 2002-01-15 US disclosed
EP-1003199-A2 Inorganic particle-containing composition, transfer film comprising the same and plasma display panel production process JSR Corporation (JP) 2000-05-24 EP disclosed
US-6046121-A MIXTURE COMPRISING GLASS POWDER, HYDROPHILIC ACRYLATE POLYMER BINDER RESIN IN A NONAQUEOUS SOLVENT HAVING BOILING POINT BETWEEN 100 AND 200 DEGREES C., AND A LOW VAPOR PRESSURE JSR CORPORATION (JP) 2000-04-04 US disclosed
EP-0987228-A2 Glass paste composition, and transfer film and plasma display panel comprising the same JSR Corporation (JP) 2000-03-22 EP disclosed
EP-0877003-A2 Glass paste composition JSR Corporation (JP) 1998-11-11 EP disclosed