Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | EPHX1 | P07099 | 1/20 | 0.44 |
| ▸ | TAAR1 | Q96RJ0 | 4/20 | 0.41 |
| ▸ | SLC6A2 | P23975 | 2/20 | 0.41 |
| ▸ | SIGMAR1 | Q99720 | 2/20 | 0.41 |
| ▸ | MAOA | P21397 | 1/20 | 0.41 |
| ▸ | SLC6A4 | P31645 | 1/20 | 0.41 |
| ▸ | SLC6A3 | Q01959 | 1/20 | 0.41 |
| ▸ | CYP2A6 | P11509 | 1/20 | 0.41 |
| ▸ | ADORA2A | P29274 | 1/20 | 0.41 |
| ▸ | ADORA1 | P30542 | 1/20 | 0.41 |
| ▸ | CYP1A2 | P05177 | 1/20 | 0.40 |
| ▸ | SLC18A2 | Q05940 | 1/20 | 0.39 |
| ▸ | ANPEP | P15144 | 1/20 | 0.39 |
| ▸ | CYP2D6 | P10635 | 1/20 | 0.39 |
| ▸ | SRR | Q9GZT4 | 2/20 | 0.38 |
| ▸ | ALPI | P09923 | 1/20 | 0.38 |
| ▸ | PKM | P14618 | 1/20 | 0.38 |
| ▸ | PTGS1 | P23219 | 1/20 | 0.38 |
| ▸ | XIAP | P98170 | 1/20 | 0.38 |
| ▸ | SLC7A5 | Q01650 | 1/20 | 0.38 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL3808422 | 0.78 | SIGMAR1 (0.48) | EPHX1TAAR1SLC6A2SIGMAR1MAOA | |
| SCHEMBL3481817 | 0.78 | EPHX1 (0.41) | EPHX1TAAR1SLC6A2SIGMAR1MAOA | |
| SCHEMBL12459378 | 0.77 | SIGMAR1 (0.46) | EPHX1TAAR1SLC6A2SIGMAR1MAOA | |
| SCHEMBL4981467 | 0.77 | EPHX1 (0.60) | EPHX1TAAR1SLC6A2SIGMAR1MAOA | |
| Ammonia Solution, Strong SCHEMBL21412646 | 0.75 | EPHX1 (0.57) | EPHX1TAAR1SLC6A2SIGMAR1MAOA | |
| SCHEMBL6835652 | 0.73 | EPHX1 (0.50) | EPHX1TAAR1SLC6A2SIGMAR1MAOA | |
| SCHEMBL18489459 | 0.73 | SIGMAR1 (0.46) | EPHX1TAAR1SLC6A2SIGMAR1MAOA | |
| SCHEMBL18085425 | 0.72 | EPHX1 (0.46) | EPHX1TAAR1SLC6A2SIGMAR1MAOA | |
| SCHEMBL3482737 | 0.71 | EPHX1 (0.48) | EPHX1TAAR1SLC6A2SIGMAR1MAOA | |
| SCHEMBL21239583 | 0.71 | TSHR (0.58) | EPHX1TSHR |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 11 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-109641482-B | Preparation of cis-1, 4-polydienes having multiple silane functional groups prepared by in situ hydrosilylation of polymer glues | 株式会社普利司通 | 2021-11-05 | — | — | CN | disclosed |
| US-10259208-B2 | Three-dimensional shaped object manufacturing device, method for manufacturing three-dimensional shaped object, and three-dimensional shaped object | SEIKO EPSON CORPORATION (JP) | 2019-04-16 | — | — | US | disclosed |
| US-9579852-B2 | Method for manufacturing three-dimensional shaped object | SEIKO EPSON CORPORATION (JP) | 2017-02-28 | — | — | US | disclosed |
| US-20150251352-A1 | THREE-DIMENSIONAL SHAPED OBJECT MANUFACTURING DEVICE, METHOD FOR MANUFACTURING THREE-DIMENSIONAL SHAPED OBJECT, AND THREE-DIMENSIONAL SHAPED OBJECT | SEIKO EPSON CORPORATION (JP) | 2015-09-10 | — | — | US | disclosed |
| US-20150251336-A1 | THREE-DIMENSIONAL SHAPED OBJECT MANUFACTURING DEVICE, METHOD FOR MANUFACTURING THREE-DIMENSIONAL SHAPED OBJECT, AND THREE-DIMENSIONAL SHAPED OBJECT | SEIKO EPSON CORPORATION (JP) | 2015-09-10 | — | — | US | disclosed |
| US-20150246483-A1 | THREE-DIMENSIONAL SHAPED OBJECT MANUFACTURING DEVICE, MANUFACTURING METHOD OF THREE-DIMENSIONAL SHAPED OBJECT, AND THREE-DIMENSIONAL SHAPED OBJECT | SEIKO EPSON CORPORATION (JP) | 2015-09-03 | — | — | US | disclosed |
| US-20150210016-A1 | METHOD FOR MANUFACTURING THREE-DIMENSIONAL SHAPED OBJECT AND THREE-DIMENSIONAL SHAPED OBJECT | SEIKO EPSON CORPORATION (JP) | 2015-07-30 | — | — | US | disclosed |
| EP-2128897-B1 | SILICON DIELECTRIC TREATING AGENT FOR USE AFTER ETCHING, PROCESS FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE | FUJITSU LTD (JP) | 2015-05-06 | — | — | EP | disclosed |
| US-8716209-B2 | Agent for post-etch treatment of silicon dielectric film, method of manufacturing semiconductor device, and semiconductor device | FUJITSU LIMITED (JP) | 2014-05-06 | — | — | US | disclosed |
| US-20100007031-A1 | AGENT FOR POST-ETCH TREATMENT OF SILICON DIELECTRIC FILM, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE | FUJITSU LIMITED (JP) | 2010-01-14 | — | — | US | disclosed |
| EP-2128897-A1 | SILICON DIELECTRIC TREATING AGENT FOR USE AFTER ETCHING, PROCESS FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE | Fujitsu Limited (JP) | 2009-12-02 | — | — | EP | disclosed |