SCHEMBL3482170

SCHEMBL3482170

CCCCCC(C)O[SiH3]

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2120546 0.97 OPRM1 (0.44)
SCHEMBL2018010 0.97 OPRM1 (0.44)
SCHEMBL3482208 0.97 OPRM1 (0.44)
SCHEMBL2119929 0.97 OPRM1 (0.44)
SCHEMBL27148820 0.97 OPRM1 (0.44)
SCHEMBL661577 0.97 OPRM1 (0.44)
SCHEMBL1614341 0.97 OPRM1 (0.44)
SCHEMBL17100561 0.97 OPRM1 (0.44)
SCHEMBL703267 0.92
SCHEMBL27646898 0.81 OPRM1 (0.39)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 12 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-4018015-A1 MONOALKOXYSILANES AND DIALKOXYSILANES AND DENSE ORGANOSILICA FILMS MADE THEREFROM Versum Materials US, LLC (US) 2022-06-29 EP claimed
WO-2021050798-A1 MONOALKOXYSILANES AND DIALKOXYSILANES AND DENSE ORGANOSILICA FILMS MADE THEREFROM VERSUM MATERIALS US, LLC (US) 2021-03-18 WO claimed
EP-4069797-A1 MICHAEL REACTION-CURING SYNTHETIC RESIN FOR USE IN CHEMICAL FASTENING TECHNOLOGY fischerwerke GmbH & Co. KG (DE) 2022-10-12 EP disclosed
WO-2021110622-A1 MICHAEL REACTION-CURING SYNTHETIC RESIN FOR USE IN CHEMICAL FASTENING TECHNOLOGY FISCHERWERKE GMBH & CO. KG (DE) 2021-06-10 WO disclosed
EP-2128897-B1 SILICON DIELECTRIC TREATING AGENT FOR USE AFTER ETCHING, PROCESS FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE FUJITSU LTD (JP) 2015-05-06 EP disclosed
US-8716209-B2 Agent for post-etch treatment of silicon dielectric film, method of manufacturing semiconductor device, and semiconductor device FUJITSU LIMITED (JP) 2014-05-06 US disclosed
US-20100007031-A1 AGENT FOR POST-ETCH TREATMENT OF SILICON DIELECTRIC FILM, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE FUJITSU LIMITED (JP) 2010-01-14 US disclosed
EP-2128897-A1 SILICON DIELECTRIC TREATING AGENT FOR USE AFTER ETCHING, PROCESS FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE Fujitsu Limited (JP) 2009-12-02 EP disclosed
CN-100354319-C Hydrogenation catalyst composition and method for hydrogenating conjugate diene polymer TAIWAN RUBBER CO LTD (CN) 2007-12-12 CN disclosed
CN-1781955-A Hydrogenation catalyst composition and method for hydrogenating conjugate diene polymer TAIWAN RUBBER CO LTD (CN) 2006-06-07 CN disclosed
EP-0360497-A2 Olefin polymerization catalyst, component thereof and process for polymerizing olefins with the catalyst, the film and injection-molded article from the obtained polyolefin MITSUI PETROCHEMICAL INDUSTRIES, LTD. (JP) 1990-03-28 EP disclosed
EP-0350170-A2 Process for polymerising olefins and polymerisation catalyst therefor MITSUI PETROCHEMICAL INDUSTRIES, LTD. (JP) 1990-01-10 EP disclosed