⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL3482170 | 0.92 | — | — | |
| SCHEMBL2120546 | 0.90 | OPRM1 (0.44) | — | |
| SCHEMBL3482208 | 0.90 | OPRM1 (0.44) | — | |
| SCHEMBL27148820 | 0.90 | OPRM1 (0.44) | — | |
| SCHEMBL2119929 | 0.90 | OPRM1 (0.44) | — | |
| SCHEMBL1614341 | 0.90 | OPRM1 (0.44) | — | |
| SCHEMBL17100561 | 0.90 | OPRM1 (0.44) | — | |
| SCHEMBL661577 | 0.90 | OPRM1 (0.44) | — | |
| SCHEMBL2018010 | 0.90 | OPRM1 (0.44) | — | |
| SCHEMBL27626712 | 0.85 | ACE2 (0.39) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 26 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-4018015-A1 | MONOALKOXYSILANES AND DIALKOXYSILANES AND DENSE ORGANOSILICA FILMS MADE THEREFROM | Versum Materials US, LLC (US) | 2022-06-29 | — | — | EP | claimed |
| WO-2021050798-A1 | MONOALKOXYSILANES AND DIALKOXYSILANES AND DENSE ORGANOSILICA FILMS MADE THEREFROM | VERSUM MATERIALS US, LLC (US) | 2021-03-18 | — | — | WO | claimed |
| EP-4309006-A1 | METHOD FOR SUPPRESSING COLLAPSE OF THREE-DIMENSIONAL STRUCTURE | Tokyo Ohka Kogyo Co., Ltd. (JP) | 2024-01-24 | — | — | EP | disclosed |
| CN-110320755-A | Minus white photosensitive resin composition and its application | 奇美实业股份有限公司 | 2019-10-11 | — | — | CN | disclosed |
| CN-104423168-B | Positive photosensitive resin composition and pattern forming method thereof | 奇美实业股份有限公司 | 2018-11-30 | — | — | CN | disclosed |
| CN-103885294-B | Photosensitive polysiloxane composition, protective film and element with protective film | 奇美实业股份有限公司 | 2017-07-14 | — | — | CN | disclosed |
| CN-103901728-B | Photosensitive polysiloxane composition and application thereof | 奇美实业股份有限公司 | 2017-06-06 | — | — | CN | disclosed |
| EP-2128897-B1 | SILICON DIELECTRIC TREATING AGENT FOR USE AFTER ETCHING, PROCESS FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE | FUJITSU LTD (JP) | 2015-05-06 | — | — | EP | disclosed |
| US-8716209-B2 | Agent for post-etch treatment of silicon dielectric film, method of manufacturing semiconductor device, and semiconductor device | FUJITSU LIMITED (JP) | 2014-05-06 | — | — | US | disclosed |
| US-8124239-B2 | Silica film forming material, silica film and method of manufacturing the same, multilayer wiring structure and method of manufacturing the same, and semiconductor device and method of manufacturing the same | FUJITSU LIMITED (JP) | 2012-02-28 | — | — | US | disclosed |
| US-20110313184-A1 | INSULATING FILM MATERIAL, AND FILM FORMATION METHOD UTILIZING THE MATERIAL, AND INSULATING FILM | TAIYO NIPPON SANSO CORPORATION (JP) | 2011-12-22 | — | — | US | disclosed |
| US-7176269-B2 | Curable composition and its use | MITSUI CHEMICALS, INC. (JP) | 2007-02-13 | — | — | US | disclosed |
| US-20070026689-A1 | Silica film forming material, silica film and method of manufacturing the same, multilayer wiring structure and method of manufacturing the same, and semiconductor device and method of manufacturing the same | FUJITSU LIMITED (JP) | 2007-02-01 | — | — | US | disclosed |
| WO-2007009935-A2 | HYDROPHOBING MINERALS AND FILLER MATERIALS | DOW CORNING CORPORATION (US) | 2007-01-25 | — | — | WO | disclosed |
| EP-1304354-B1 | CURABLE COMPOSITION AND USES THEREOF | MITSUI CHEMICALS INC (JP) | 2007-01-24 | — | — | EP | disclosed |
| US-20070015893-A1 | Curable composition and its use | MITSUI CHEMICALS, INC. | 2007-01-18 | — | — | US | disclosed |
| CN-1781955-A | Hydrogenation catalyst composition and method for hydrogenating conjugate diene polymer | TAIWAN RUBBER CO LTD (CN) | 2006-06-07 | — | — | CN | disclosed |
| US-20030096904-A1 | Curable composition and its use | MITSUI CHEMICALS, INC. (JP) | 2003-05-22 | — | — | US | disclosed |
| EP-1304354-A1 | CURABLE COMPOSITION AND USES THEREOF | Mitsui Chemicals, Inc. (JP) | 2003-04-23 | — | — | EP | disclosed |
| CN-1392890-A | Curable composition and use thereof | MITSUI CHEMICALS INC (JP) | 2003-01-22 | — | — | CN | disclosed |