SCHEMBL3482339

SCHEMBL3482339

CCO[Si](C)(CC)CC

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL3481852 0.82
SCHEMBL6116755 0.80
SCHEMBL12898440 0.80
SCHEMBL3481466 0.78
SCHEMBL6699121 0.78
SCHEMBL14956270 0.76
SCHEMBL12898472 0.76
SCHEMBL8376079 0.74 TSHR (0.32)
SCHEMBL3482244 0.73
SCHEMBL3481796 0.73

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 40 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-4018013-A1 MONOALKOXYSILANES AND DENSE ORGANOSILICA FILMS MADE THEREFROM Versum Materials US, LLC (US) 2022-06-29 EP claimed
CN-114616652-A Monoalkoxysilanes and dense organosilica films prepared therefrom 弗萨姆材料美国有限责任公司 2022-06-10 CN claimed
CN-111138865-A Preparation method of novel liquid foaming silica gel for new energy automobile 佛山职业技术学院 2020-05-12 CN claimed
WO-2010082710-A1 METHOD FOR PREPARING A HIGHLY DURABLE REVERSE OSMOSIS MEMBRANE UNIVERSITY-INDUSTRY COOPERATION GROUP OF KYUNG HEE UNIVERSITY (KR) 2010-07-22 WO claimed
US-6410770-B2 REDUCTION OF ALKOXYSILANE IN PRESENCE OF ALKALI METAL HYDRIDE AND HIGH BOILING SOLVENTS GELEST, INC. 2002-06-25 US claimed
US-20020002299-A1 Chloride-free process for the production of alkylsilanes suitable for microelectronic applications GELEST, INC. 2002-01-03 US claimed
WO-2001058908-A2 CHLORIDE-FREE PROCESS FOR THE PRODUCTION OF ALKYLSILANES SUITABLE FOR MICROELECTRONIC APPLICATIONS GELEST, INC. (US) 2001-08-16 WO claimed
EP-3812428-B1 COLLOIDAL STRUCTURE, MULTI-COLLOIDAL STRUCTURE, AND PRODUCTION METHOD FOR COLLOIDAL STRUCTURE PANASONIC IP MAN CO LTD (JP) 2025-12-03 EP disclosed
CN-119998691-A Antireflection film, liquid composition set, and method for producing antireflection film 日本板硝子株式会社 2025-05-13 CN disclosed
US-12230497-B2 Methods for forming a topographically selective silicon oxide film by a cyclical plasma-enhanced deposition process ASM IP HOLDING B.V. (NL) 2025-02-18 US disclosed
WO-2024080149-A1 ANTI-REFLECTION FILM, LIQUID COMPOSITION, LIQUID COMPOSITION GROUP, AND METHOD FOR MANUFACTURING ANTI-REFLECTION FILM 日本板硝子株式会社 2024-04-18 WO disclosed
CN-112593212-B Method for forming topologically selective silicon oxide film by cyclic plasma enhanced deposition process ASM IP私人控股有限公司 2023-12-22 CN disclosed
CN-112424290-B Colloid structure, colloid multiple structure, and method for producing colloid structure 松下知识产权经营株式会社 2023-08-22 CN disclosed
US-7604866-B2 Comprising silica particles and at least one binder compound; good mechanical strength and abrasion resistance ASAHI KASEI KABUSHIKI KAISHA (JP) 2009-10-20 US disclosed
US-20060269724-A1 Comprising silica particles and at least one binder compound; good mechanical strength and abrasion resistance ASAHI KASEI KABUSHIKI KAISHA (JP) 2006-11-30 US disclosed
US-20040077757-A1 Coating composition for use in producing an insulating thin film ASAHI KASEI KABUSHIKI KAISHA (JP) 2004-04-22 US disclosed
WO-2002055707-A2 CLONING OF AN INHIBITOR OF ANTIGEN-RECEPTOR SIGNALING BY A RETROVIRAL-BASED FUNCTIONAL SCREEN RIGEL PHARMACEUTICALS INC (US) 2002-07-18 WO disclosed
US-6410770-B2 REDUCTION OF ALKOXYSILANE IN PRESENCE OF ALKALI METAL HYDRIDE AND HIGH BOILING SOLVENTS GELEST, INC. 2002-06-25 US disclosed
US-20020002299-A1 Chloride-free process for the production of alkylsilanes suitable for microelectronic applications GELEST, INC. 2002-01-03 US disclosed
WO-2001058908-A2 CHLORIDE-FREE PROCESS FOR THE PRODUCTION OF ALKYLSILANES SUITABLE FOR MICROELECTRONIC APPLICATIONS GELEST, INC. (US) 2001-08-16 WO disclosed