SCHEMBL3482345

SCHEMBL3482345

CCC(C)(CC)CO[SiH3]

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL3481857 0.84 LMNA (0.39)
SCHEMBL3481469 0.80
SCHEMBL6699124 0.80
SCHEMBL3482137 0.77 LMNA (0.41)
SCHEMBL8376082 0.77
SCHEMBL9458370 0.75
SCHEMBL13103975 0.73 TSHR (0.38)
SCHEMBL704083 0.73 SMPD1 (0.32)
SCHEMBL13354370 0.71
SCHEMBL423646 0.71 THRB (0.30)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 30 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-111138865-A Preparation method of novel liquid foaming silica gel for new energy automobile 佛山职业技术学院 2020-05-12 CN claimed
WO-2010082710-A1 METHOD FOR PREPARING A HIGHLY DURABLE REVERSE OSMOSIS MEMBRANE UNIVERSITY-INDUSTRY COOPERATION GROUP OF KYUNG HEE UNIVERSITY (KR) 2010-07-22 WO claimed
US-6410770-B2 REDUCTION OF ALKOXYSILANE IN PRESENCE OF ALKALI METAL HYDRIDE AND HIGH BOILING SOLVENTS GELEST, INC. 2002-06-25 US claimed
US-20020002299-A1 Chloride-free process for the production of alkylsilanes suitable for microelectronic applications GELEST, INC. 2002-01-03 US claimed
WO-2001058908-A2 CHLORIDE-FREE PROCESS FOR THE PRODUCTION OF ALKYLSILANES SUITABLE FOR MICROELECTRONIC APPLICATIONS GELEST, INC. (US) 2001-08-16 WO claimed
EP-3812428-B1 COLLOIDAL STRUCTURE, MULTI-COLLOIDAL STRUCTURE, AND PRODUCTION METHOD FOR COLLOIDAL STRUCTURE PANASONIC IP MAN CO LTD (JP) 2025-12-03 EP disclosed
CN-119998691-A Antireflection film, liquid composition set, and method for producing antireflection film 日本板硝子株式会社 2025-05-13 CN disclosed
WO-2024080149-A1 ANTI-REFLECTION FILM, LIQUID COMPOSITION, LIQUID COMPOSITION GROUP, AND METHOD FOR MANUFACTURING ANTI-REFLECTION FILM 日本板硝子株式会社 2024-04-18 WO disclosed
CN-112424290-B Colloid structure, colloid multiple structure, and method for producing colloid structure 松下知识产权经营株式会社 2023-08-22 CN disclosed
US-11353642-B2 Optical filter, multiplex optical filter, and light emitting device and illumination system using the same PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD. (JP) 2022-06-07 US disclosed
US-20210246330-A1 COLLOIDAL STRUCTURE, MULTI-COLLOIDAL STRUCTURE, AND PRODUCTION METHOD FOR COLLOIDAL STRUCTURE PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD. (JP) 2021-08-12 US disclosed
US-20210199865-A1 OPTICAL FILTER, MULTIPLEX OPTICAL FILTER, AND LIGHT EMITTING DEVICE AND ILLUMINATION SYSTEM USING THE SAME PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD. (JP) 2021-07-01 US disclosed
US-20100007031-A1 AGENT FOR POST-ETCH TREATMENT OF SILICON DIELECTRIC FILM, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE FUJITSU LIMITED (JP) 2010-01-14 US disclosed
EP-2128897-A1 SILICON DIELECTRIC TREATING AGENT FOR USE AFTER ETCHING, PROCESS FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE Fujitsu Limited (JP) 2009-12-02 EP disclosed
US-7604866-B2 Comprising silica particles and at least one binder compound; good mechanical strength and abrasion resistance ASAHI KASEI KABUSHIKI KAISHA (JP) 2009-10-20 US disclosed
US-20060269724-A1 Comprising silica particles and at least one binder compound; good mechanical strength and abrasion resistance ASAHI KASEI KABUSHIKI KAISHA (JP) 2006-11-30 US disclosed
US-20040077757-A1 Coating composition for use in producing an insulating thin film ASAHI KASEI KABUSHIKI KAISHA (JP) 2004-04-22 US disclosed
US-6410770-B2 REDUCTION OF ALKOXYSILANE IN PRESENCE OF ALKALI METAL HYDRIDE AND HIGH BOILING SOLVENTS GELEST, INC. 2002-06-25 US disclosed
US-20020002299-A1 Chloride-free process for the production of alkylsilanes suitable for microelectronic applications GELEST, INC. 2002-01-03 US disclosed
WO-2001058908-A2 CHLORIDE-FREE PROCESS FOR THE PRODUCTION OF ALKYLSILANES SUITABLE FOR MICROELECTRONIC APPLICATIONS GELEST, INC. (US) 2001-08-16 WO disclosed