SCHEMBL3482746

SCHEMBL3482746

CCCc1ccc(N2C(=O)C=CC2=O)cc1

nearest known ligand 1.00 ✓ in ChEMBL — recovers established targets

Predicted protein targets (top 17)

geneUniProtsupporting neighboursconfidence
MGLL Q99685 16/20 1.00
FAAH O00519 6/20 0.74
HSP90AA1 P07900 3/20 0.50
TDP1 Q9NUW8 3/20 0.50
NPSR1 Q6W5P4 2/20 0.50
PKM P14618 1/20 0.50
MAPK1 P28482 1/20 0.50
ALDH1A1 P00352 2/20 0.49
CACNA1B Q00975 2/20 0.49
APBA1 Q02410 2/20 0.49
HPGD P15428 1/20 0.49
HTT P42858 1/20 0.49
DDAH1 O94760 1/20 0.46
BCHE P06276 1/20 0.45
LMNA P02545 1/20 0.44
CCR6 P51684 1/20 0.44
APOBEC3G Q9HC16 1/20 0.44

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL20842691 0.94 MGLL (0.89) MGLLFAAHHSP90AA1TDP1NPSR1
SCHEMBL22862057 0.90 MGLL (0.81) MGLLFAAHHSP90AA1TDP1NPSR1
SCHEMBL8048971 0.90 MGLL (0.81) MGLLFAAHHSP90AA1TDP1NPSR1
SCHEMBL1087192 0.89 MGLL (0.87) MGLLFAAHHSP90AA1TDP1NPSR1
SCHEMBL4388793 0.87 MGLL (0.77) MGLLFAAHHSP90AA1TDP1NPSR1
SCHEMBL3482538 0.87 MGLL (0.97) MGLLFAAHHSP90AA1TDP1NPSR1
SCHEMBL8736182 0.85 MGLL (1.00) MGLLFAAHALDH1A1LMNA
SCHEMBL3395815 0.85 MGLL (1.00) MGLLFAAHALDH1A1LMNA
SCHEMBL27951835 0.83 MGLL (0.73) MGLLFAAHHSP90AA1TDP1NPSR1
SCHEMBL112959 0.83 MGLL (1.00) MGLLFAAHHSP90AA1TDP1NPSR1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 106 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-117624837-A Resin composition, and prepreg, metal foil laminate and printed wiring board produced using the same 台燿科技股份有限公司 2024-03-01 CN claimed
CN-111690247-B Resin composition and use thereof 台燿科技股份有限公司 2024-01-02 CN claimed
CN-114058181-A Resin composition, and preparation method and application thereof 广东盈骅新材料科技有限公司 2022-02-18 CN claimed
CN-112662178-A Modified bismaleimide prepolymer and preparation and application thereof 广东盈骅新材料科技有限公司 2021-04-16 CN claimed
CN-111690247-A Resin composition and use thereof 台燿科技股份有限公司 2020-09-22 CN claimed
CN-118251440-A Copolymers derived from dicyclopentadiene 高新特殊工程塑料全球技术有限公司 2024-06-25 CN disclosed
CN-118139910-A Linear block copolymers and curable thermosetting compositions comprising the same 高新特殊工程塑料全球技术有限公司 2024-06-04 CN disclosed
CN-115038736-B Functionalized poly (arylene ether) copolymers, methods of making, and articles derived therefrom 高新特殊工程塑料全球技术有限公司 2024-06-04 CN disclosed
CN-118119648-A Graft copolymer and curable thermosetting composition comprising the same 高新特殊工程塑料全球技术有限公司 2024-05-31 CN disclosed
CN-115335431-B Modified poly (phenylene ether) copolymers, compositions and methods 高新特殊工程塑料全球技术有限公司 2024-05-24 CN disclosed
CN-111004385-B Poly (arylene ether) copolymer 高新特殊工程塑料全球技术有限公司 2024-04-12 CN disclosed
CN-117659387-A Poly (arylene ether) copolymer 高新特殊工程塑料全球技术有限公司 2024-03-08 CN disclosed
CN-1214455-C Adhesive for circuit connection, circuit connection method using same, and circuit connection structure HITACHI CHEMICAL CO LTD (JP) 2005-08-10 CN disclosed
CN-1578791-A Process for producing polymer JAPAN GOVERNMENT (JP) 2005-02-09 CN disclosed
US-20050009982-A1 Compound having silsesquioxane skeleton and its polymer CHISSO CORPORATION (JP) 2005-01-13 US disclosed
CN-1425192-A Adhesive for circuit connection, circuit connection method using same, and circuit connection structure HITACHI CHEMICAL CO LTD (JP) 2003-06-18 CN disclosed
EP-0722959-B1 Highly oxygen-permeable heat-resistant material MENICON CO LTD (JP) 1998-04-08 EP disclosed
US-5587445-A Highly oxygen-permeable heat-resistant material MENICON CO., LTD. (JP) 1996-12-24 US disclosed
EP-0722959-A2 Highly oxygen-permeable heat-resistant material Menicon Co., Ltd. (JP) 1996-07-24 EP disclosed
EP-0400898-A2 Heat resistant epoxy resin composition MITSUI TOATSU CHEMICALS, Inc. (JP) 1990-12-05 EP disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (1 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20050009982-A1 Compound having silsesquioxane skeleton and its polymer C1S, H1-4, H1-0 MGLL 4700/4885FAAH 4471/4885HSP90AA1 4031/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.