Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | MGLL | Q99685 | 15/20 | 0.81 |
| ▸ | FAAH | O00519 | 5/20 | 0.62 |
| ▸ | HSP90AA1 | P07900 | 3/20 | 0.46 |
| ▸ | ALDH1A1 | P00352 | 2/20 | 0.46 |
| ▸ | HPGD | P15428 | 2/20 | 0.46 |
| ▸ | HTT | P42858 | 2/20 | 0.46 |
| ▸ | PKM | P14618 | 2/20 | 0.46 |
| ▸ | MEN1 | O00255 | 1/20 | 0.46 |
| ▸ | LMNA | P02545 | 1/20 | 0.46 |
| ▸ | CCR6 | P51684 | 1/20 | 0.46 |
| ▸ | KMT2A | Q03164 | 1/20 | 0.46 |
| ▸ | ATM | Q13315 | 1/20 | 0.46 |
| ▸ | NPSR1 | Q6W5P4 | 2/20 | 0.45 |
| ▸ | TDP1 | Q9NUW8 | 2/20 | 0.45 |
| ▸ | CACNA1B | Q00975 | 1/20 | 0.45 |
| ▸ | APBA1 | Q02410 | 1/20 | 0.45 |
| ▸ | GSK3A | P49840 | 1/20 | 0.44 |
| ▸ | GSK3B | P49841 | 1/20 | 0.44 |
| ▸ | NR1H3 | Q13133 | 1/20 | 0.43 |
| ▸ | MAPK1 | P28482 | 1/20 | 0.42 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL27174528 | 0.91 | MGLL (0.72) | MGLLFAAHHSP90AA1ALDH1A1HPGD | |
| SCHEMBL27939458 | 0.90 | MGLL (0.66) | MGLLFAAHHSP90AA1ALDH1A1HPGD | |
| SCHEMBL486996 | 0.90 | MGLL (0.68) | MGLLFAAHHSP90AA1ALDH1A1HPGD | |
| SCHEMBL3482746 | 0.90 | MGLL (1.00) | MGLLFAAHHSP90AA1ALDH1A1HPGD | |
| SCHEMBL8852774 | 0.89 | MGLL (0.80) | MGLLFAAHHSP90AA1ALDH1A1HPGD | |
| SCHEMBL8402814 | 0.88 | MGLL (0.83) | MGLLFAAHHSP90AA1ALDH1A1HPGD | |
| SCHEMBL27846512 | 0.87 | MGLL (0.60) | MGLLFAAHHSP90AA1ALDH1A1HTT | |
| SCHEMBL8853360 | 0.87 | MGLL (0.79) | MGLLFAAHHSP90AA1ALDH1A1HPGD | |
| SCHEMBL22325656 | 0.87 | MGLL (0.64) | MGLLFAAHHSP90AA1ALDH1A1HPGD | |
| SCHEMBL28977582 | 0.86 | MGLL (0.59) | MGLLFAAHHSP90AA1ALDH1A1HPGD |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 444 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-118256088-A | Resin composition and application thereof | 广东生益科技股份有限公司 | 2024-06-28 | — | — | CN | claimed |
| CN-118251457-A | Thermosetting resin composition, prepreg and printed wiring board | 三菱瓦斯化学株式会社 | 2024-06-25 | — | — | CN | claimed |
| CN-116410594-B | Resin composition, prepreg and metal foil-clad laminate | 广东生益科技股份有限公司 | 2024-06-14 | — | — | CN | claimed |
| CN-117836359-A | Prepreg, metal foil-clad laminate, and printed circuit board | 三菱瓦斯化学株式会社 | 2024-04-05 | — | — | CN | claimed |
| CN-117836370-A | Curable composition, prepreg, resin sheet, metal foil-clad laminate, and printed wiring board | 三菱瓦斯化学株式会社 | 2024-04-05 | — | — | CN | claimed |
| CN-115052934-B | Resin composition, prepreg, laminated board, metal foil-clad laminated board, and printed wiring board | 三菱瓦斯化学株式会社 | 2024-01-30 | — | — | CN | claimed |
| CN-116410595-A | Resin composition, prepreg comprising same, and metal foil-clad laminate | 广东生益科技股份有限公司 | 2023-07-11 | — | — | CN | claimed |
| CN-116410596-A | Resin composition and application thereof | 广东生益科技股份有限公司 | 2023-07-11 | — | — | CN | claimed |
| CN-116410594-A | Resin composition, prepreg and metal foil-clad laminate | 广东生益科技股份有限公司 | 2023-07-11 | — | — | CN | claimed |
| CN-112912445-B | Thermosetting resin composition, prepreg, resin sheet, metal foil-clad laminate, and printed wiring board | 三菱瓦斯化学株式会社 | 2023-04-04 | — | — | CN | claimed |
| CN-101928460-A | Preparation method of linear polyimide-maleimide copolymer film containing active groups | UNIV DONGHUA | 2010-12-29 | — | — | CN | claimed |
| CN-101289537-B | Method for preparing 1,4-di(2,4-diaminophenoxy)benzenoid form self-plasticizing unsaturated polyimides powder | UNIV DONGHUA | 2010-09-08 | — | — | CN | claimed |
| CN-101575802-A | Preparation method for non-halogen smoke suppressing fire-retardant polyester fiber non-woven fabric | UNIV DONGHUA (CN) | 2009-11-11 | — | — | CN | claimed |
| CN-101289537-A | Method for preparing 1,4-di(2,4-diaminophenoxy)benzenoid form self-plasticizing unsaturated polyimides powder | UNIV DONGHUA (CN) | 2008-10-22 | — | — | CN | claimed |
| CN-101289543-A | Method for preparing 1,4-di(2,4-diamino phenoxy)benzenoid form polyimide film for flexible copper clad plate | UNIV DONGHUA (CN) | 2008-10-22 | — | — | CN | claimed |
| CN-1314726-C | Resin composition for producing insulating interlayer of printed wiring board, resin sheet for forming insulating layer produced using the resin composition, resin-coated copper foil, and copper-clad laminate produced using the same | MITSUI MINING & SMELTING CO (JP) | 2007-05-09 | — | — | CN | claimed |
| CN-1214400-C | Insulated power cable | FURUKAWA ELECTRIC CO LTD (JP) | 2005-08-10 | — | — | CN | claimed |
| CN-1398274-A | Resin compound for forming interlayer insualting layer of printed wiring board, resin for forming insulating layer using resin compound | MITSUI MINING & SMELTING CO (JP) | 2003-02-19 | — | — | CN | claimed |
| CN-1386284-A | Insulated power cable | FURUKAWA ELECTRIC CO LTD (JP) | 2002-12-18 | — | — | CN | claimed |
| US-6132852-A | LAMINATE OF POLYMER CONDUCTOR AND DIELECTRIC | HITACHI, LTD. (JP) | 2000-10-17 | — | — | US | claimed |