Predicted protein targets (top 2)
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL5184842 | 0.87 | CYP1A2 (0.31) | CYP1A2 | |
| SCHEMBL28991822 | 0.79 | FFAR3 (0.36) | CYP1A2FFAR3 | |
| SCHEMBL2234618 | 0.76 | CYP1A2 (0.33) | CYP1A2FFAR3 | |
| SCHEMBL471868 | 0.75 | GRM4 (0.34) | CYP1A2 | |
| SCHEMBL766024 | 0.73 | APLNR (0.32) | CYP1A2FFAR3 | |
| SCHEMBL988593 | 0.71 | CYP1A2 (0.38) | CYP1A2FFAR3 | |
| Hydrochloric Acid SCHEMBL1632919 | 0.71 | ARG1 (0.44) | CYP1A2 | |
| SCHEMBL5184847 | 0.71 | TP53 (0.31) | CYP1A2 | |
| SCHEMBL7439240 | 0.70 | CYP1A2 (0.37) | CYP1A2FFAR3 | |
| SCHEMBL2277283 | 0.70 | FFAR3 (0.39) | CYP1A2FFAR3 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 157 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-116162391-B | Photo-thermal driving limited solid-liquid transition self-repairing anti-corrosion coating material and preparation method thereof | 河南省科学院化学研究所 | 2023-08-01 | — | — | CN | claimed |
| CN-116162391-A | Photo-thermal driving limited solid-liquid transition self-repairing anti-corrosion coating material and preparation method thereof | 河南省科学院化学研究所 | 2023-05-26 | — | — | CN | claimed |
| CN-116103002-A | Anti-cracking high-toughness underfill adhesive and preparation method and application thereof | 深圳先进电子材料国际创新研究院 | 2023-05-12 | — | — | CN | claimed |
| CN-115926379-A | Non-covalent modified boron nitride/epoxy resin heat-conducting and insulating composite material and preparation method thereof | 江南大学 | 2023-04-07 | — | — | CN | claimed |
| CN-113845775-B | Preparation method of hyperbranched polymer modified boron nitride heat-conducting and insulating composite material | 江南大学 | 2022-06-21 | — | — | CN | claimed |
| CN-113845775-A | Preparation method of hyperbranched polymer modified boron nitride heat-conducting and insulating composite material | 江南大学 | 2021-12-28 | — | — | CN | claimed |
| CN-108192077-B | Preparation method of photosensitive resin with flame retardant property and application of photosensitive resin on circuit board | 盐城艾肯科技有限公司 | 2020-07-28 | — | — | CN | claimed |
| EP-3889202-B1 | POLYESTER RESIN, COATING AGENT, ADHESIVE, RESIN COMPOSITION, INK, AND METHOD FOR PRODUCING POLYESTER RESIN | MITSUBISHI CHEM CORP (JP) | 2025-09-10 | — | — | EP | disclosed |
| CN-118201976-A | Epoxy resin | 化学和冶金生产联合体股份公司 | 2024-06-14 | — | — | CN | disclosed |
| CN-117924038-A | Efficient and environment-friendly method for degrading epoxy resin | 四川大学 | 2024-04-26 | — | — | CN | disclosed |
| WO-2024070134-A1 | METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND ADHESIVE FILM FOR SEMICONDUCTOR WAFER PROCESSING | 株式会社レゾナック | 2024-04-04 | — | — | WO | disclosed |
| WO-2024070132-A1 | METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE AND ADHESION FILM FOR SEMICONDUCTOR WAFER PROCESSING | 株式会社レゾナック | 2024-04-04 | — | — | WO | disclosed |
| CN-111801781-B | Adhesive for semiconductor and method for manufacturing semiconductor device using the same | 株式会社力森诺科 | 2024-02-20 | — | — | CN | disclosed |
| EP-1149833-A1 | Sulfidoamidocarboxylic acids used as corrosion inhibitors | Nippon Shokubai Co., Ltd. (JP) | 2001-10-31 | — | — | EP | disclosed |
| EP-0531019-B1 | Photosensitive polyimide precursor compositions and process for preparing same | TORAY INDUSTRIES (JP) | 2000-11-15 | — | — | EP | disclosed |
| EP-0845486-A1 | EPOXIDIZED POLYENE, EPOXY RESIN COMPOSITION AND PRODUCT OF CURING THEREOF, AND POWDER COATING MATERIAL | DAICEL CHEMICAL INDUSTRIES, LTD. (JP) | 1998-06-03 | — | — | EP | disclosed |
| US-5609914-A | APPLYING AN AQUEOUS INK IMAGEWISE TO THE NONPHOTOSENSITIVE LAYER TO CHANGE ITS SOLUBILITY, WASHING TO REMOVE SOLUBLE AREAS OF LAYER AND CURING POLYAMIC ACID TO FORM A POLYIMIDE | E.I. DU PONT DE NEMOURS AND COMPANY (US) | 1997-03-11 | — | — | US | disclosed |
| EP-0742487-A1 | Method for preparing high resolution polyimide images using non-photosensitive layers of poly(amic acid) or salts thereof | E.I. DU PONT DE NEMOURS AND COMPANY (US) | 1996-11-13 | — | — | EP | disclosed |
| EP-0531019-A1 | Photosensitive polyimide precursor compositions and process for preparing same | TORAY INDUSTRIES, INC. (JP) | 1993-03-10 | — | — | EP | disclosed |
| EP-0023363-B1 | PLASTICIZER FOR POLYMERS THAT CONTAIN HALOGEN | DAINIPPON INK AND CHEMICALS, INC. (JP) | 1984-06-13 | — | — | EP | disclosed |