⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL129239 | 0.98 | — | — | |
| Ammonia Solution, Strong SCHEMBL278128 | 0.96 | — | — | |
| Ammonia Solution, Strong SCHEMBL7099069 | 0.96 | — | — | |
| SCHEMBL2160293 | 0.96 | — | — | |
| SCHEMBL10771281 | 0.96 | — | — | |
| Alcohol SCHEMBL28839408 | 0.88 | — | — | |
| SCHEMBL28608591 | 0.87 | — | — | |
| Acrylic Acid SCHEMBL27709464 | 0.85 | LMNA (0.34) | — | |
| Acrylamide SCHEMBL29277077 | 0.84 | ALDH1A1 (0.37) | — | |
| SCHEMBL15021984 | 0.81 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 11 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-7816280-B2 | Semiconductor device, semiconductor wafer, and methods of producing the same device and wafer | NEC ELECTRONICS CORPORATION (JP) | 2010-10-19 | — | — | US | disclosed |
| US-7674721-B2 | Semiconductor device, semiconductor wafer, and methods of producing same device and wafer | NEC ELECTRONICS CORPORATION (JP) | 2010-03-09 | — | — | US | disclosed |
| US-7602048-B2 | Semiconductor device and semiconductor wafer having a multi-layered insulation film | NEC ELECTRONICS CORPORATION (JP) | 2009-10-13 | — | — | US | disclosed |
| US-20090137108-A1 | Semiconductor device, semiconductor wafer, and methods of producing the same device and wafer | NEC ELECTRONICS CORPORATION (JP) | 2009-05-28 | — | — | US | disclosed |
| US-20070207610-A1 | Semiconductor device, semiconductor wafer, and methods of producing same device and wafer | NEC ELECTRONICS CORPORATION (JP) | 2007-09-06 | — | — | US | disclosed |
| US-7229910-B2 | Method of producing a semiconductor device having a multi-layered insulation film | NEC ELECTRONICS CORPORATION (JP) | 2007-06-12 | — | — | US | disclosed |
| US-7229915-B2 | Method for manufacturing semiconductor device | NEC ELECTRONICS CORPORATION (JP) | 2007-06-12 | — | — | US | disclosed |
| US-20050191850-A1 | Method for manufacturing semiconductor device | SEMICONDUCTOR LEADING EDGE TECHNOLOGIES, INC. (JP) | 2005-09-01 | — | — | US | disclosed |
| US-20050153536-A1 | Method for manufacturing semiconductor device | SEMICONDUCTOR LEADING EDGE TECHNOLOGIES, INC. (JP) | 2005-07-14 | — | — | US | disclosed |
| US-20020127807-A1 | Semiconductor device, semiconductor wafer, and methods of producing the same device and wafer | DTS LLC | 2002-09-12 | — | — | US | disclosed |
| US-20010051447-A1 | Interfacial adhesion | FOTONATION CORPORATION (F/K/A DIGITALOPTICS CORPORATION AND F/K/A DIGITALOPTICS CORPORATION MEMS) | 2001-12-13 | — | — | US | disclosed |