SCHEMBL350033

SCHEMBL350033

C=CCOCC(=C)C(=O)OC

nearest known ligand 0.38

Predicted protein targets (top 13)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 2/20 0.38
TDP1 Q9NUW8 1/20 0.35
LMNA P02545 1/20 0.32
TSHR P16473 1/20 0.31
MAPT P10636 1/20 0.31
CACNA1B Q00975 1/20 0.31
APBA1 Q02410 1/20 0.31
MEN1 O00255 1/20 0.31
POLB P06746 1/20 0.31
KMT2A Q03164 1/20 0.31
CA1 P00915 1/20 0.31
CA2 P00918 1/20 0.31
CA7 P43166 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL14269234 0.91 TDP1 (0.39) ALDH1A1TDP1LMNATSHRMEN1
SCHEMBL35210600 0.87
SCHEMBL353002 0.83 ALDH1A1 (0.48) ALDH1A1TSHR
SCHEMBL352550 0.82 TDP1 (0.40) ALDH1A1TDP1TSHRMAPTCACNA1B
SCHEMBL38666599 0.81 MEN1 (0.36) ALDH1A1TDP1LMNATSHRMEN1
SCHEMBL352539 0.81 ALDH1A1 (0.35) ALDH1A1
SCHEMBL350219 0.81 ALDH1A1 (0.40) ALDH1A1TDP1LMNATSHRMAPT
SCHEMBL351994 0.80 TDP1 (0.37) ALDH1A1TDP1TSHRMEN1POLB
SCHEMBL29256091 0.80 CA1 (0.34) TDP1CA1CA2CA7
SCHEMBL351309 0.79 L3MBTL1 (0.34) TDP1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 220 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2026105125-A1 FORMULATIONS USABLE IN ADDITIVE MANUFACTURING OF THREE-DIMENSIONAL OBJECTS STRATASYS LTD. (IL) 2026-05-21 WO claimed
EP-4049841-B1 HYBRID RESIN COMPOSITION CUBICURE GMBH (AT) 2026-03-18 EP claimed
WO-2024128086-A1 CURABLE COMPOSITION, LAMINATE, AND METHOD FOR PRODUCING LAMINATE 富士フイルム株式会社 2024-06-20 WO claimed
US-20240198582-A1 HYBRID RESIN COMPOSITION FOR THE 3D-PRINTING OF OBJECTS CUBICURE GMBH (AT) 2024-06-20 US claimed
CN-118185551-A High-strength UV protective adhesive suitable for flexible materials and preparation method thereof 合肥微晶材料科技有限公司 2024-06-14 CN claimed
WO-2024117094-A1 PHOTOCURABLE RESIN COMPOSITION, OPTICAL COMPONENT, METHOD FOR PRODUCING OPTICAL COMPONENT, LIGHT EMITTING DEVICE, AND METHOD FOR PRODUCING LIGHT EMITTING DEVICE パナソニックIPマネジメント株式会社 2024-06-06 WO claimed
US-11987658-B2 Curable resin composition and method of manufacturing article CANON KABUSHIKI KAISHA (JP) 2024-05-21 US claimed
US-20230242774-A1 A PHOTOPOLYMER EPOXY COMPOSITION AND A PHOTOINITIATOR FOR CURING SAME POLYMER GVULOT LTD (IL) 2023-08-03 US claimed
EP-4157916-A1 A PHOTOPOLYMER EPOXY COMPOSITION AND A PHOTOINITIATOR FOR CURING SAME Polymer Gvulot Ltd. (IL) 2023-04-05 EP claimed
CN-111954700-B Photocurable ink composition for inkjet printing 阪田油墨股份有限公司 2022-11-22 CN claimed
US-20220282013-A1 CURABLE RESIN COMPOSITION AND METHOD OF MANUFACTURING ARTICLE CANON KABUSHIKI KAISHA (JP) 2022-09-08 US claimed
WO-2022180566-A1 HYBRID RESIN COMPOSITION FOR THE 3D-PRINTING OF OBJECTS CUBICURE GMBH (AT) 2022-09-01 WO claimed
EP-4049841-A1 HYBRID RESIN COMPOSITION Cubicure GmbH (AT) 2022-08-31 EP claimed
CN-111954700-A Photocurable ink composition for inkjet printing 阪田油墨股份有限公司 2020-11-17 CN claimed
WO-2020162475-A1 CURABLE RESIN COMPOSITION キヤノン株式会社 2020-08-13 WO claimed
WO-2019188569-A1 PHOTOCURABLE INK COMPOSITION FOR INKJET PRINTING サカタインクス株式会社 2019-10-03 WO claimed
CN-106068282-B Curable composition containing semiconductor nanoparticles, cured product, optical material, and electronic material 昭和电工株式会社 2017-11-03 CN claimed
CN-106068282-A Curable composition containing semiconductor nanoparticles, cured product, optical material, and electronic material 昭和电工株式会社 2016-11-02 CN claimed
WO-2026105125-A1 FORMULATIONS USABLE IN ADDITIVE MANUFACTURING OF THREE-DIMENSIONAL OBJECTS STRATASYS LTD. (IL) 2026-05-21 WO disclosed
US-20110263805-A1 ALPHA-ALLYLOXYMETHYLACRYLIC ACID-BASED COPOLYMER, RESIN COMPOSITIONS, AND USE THEREOF NIPPON SHOKUBAI CO., LTD. (JP) 2011-10-27 US disclosed