SCHEMBL350981

SCHEMBL350981

O=C(c1ccc(O)c(O)c1O)c1c(O)cccc1O

nearest known ligand 0.60

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
HDAC1 Q13547 1/20 0.55
SELL P14151 1/20 0.54
SELP P16109 1/20 0.54
HSD17B14 Q9BPX1 2/20 0.48
CA1 P00915 3/20 0.46
CA2 P00918 3/20 0.46
CA12 O43570 2/20 0.46
CA7 P43166 2/20 0.46
CA9 Q16790 2/20 0.46
CA14 Q9ULX7 2/20 0.46
ALDH1A1 P00352 3/20 0.46
HPGD P15428 3/20 0.46
ALOX15 P16050 3/20 0.46
RECQL P46063 3/20 0.46
HSD17B10 Q99714 3/20 0.46
KDM4E B2RXH2 2/20 0.46
MAPT P10636 2/20 0.46
MEN1 O00255 1/20 0.46
ALOX12 P18054 1/20 0.46
KMT2A Q03164 1/20 0.46

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL29670619 1.00 HDAC1 (0.55) HDAC1SELLSELPHSD17B14CA1
SCHEMBL8861210 0.91 CA1 (0.50) HDAC1SELLSELPHSD17B14CA1
SCHEMBL21935544 0.87 HDAC1 (0.59) HDAC1SELLSELPHSD17B14ALDH1A1
SCHEMBL29468156 0.87 HDAC1 (0.59) HDAC1SELLSELPHSD17B14CA1
SCHEMBL273458 0.87 HDAC1 (0.59) HDAC1SELLSELPHSD17B14CA1
SCHEMBL6847041 0.86 HDAC1 (0.53) HDAC1SELLSELPHSD17B14ALDH1A1
SCHEMBL29942150 0.86 HDAC1 (0.53) HDAC1SELLSELPHSD17B14ALDH1A1
SCHEMBL7757807 0.85 HDAC1 (0.61) HDAC1SELLSELPHSD17B14ALDH1A1
SCHEMBL8605869 0.83 HDAC1 (0.59) HDAC1SELLSELPHSD17B14ALDH1A1
SCHEMBL1063407 0.82 SELL (0.68) HDAC1SELLSELPHSD17B14ALDH1A1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 205 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-112731765-B Fluorine-containing resin composition, preparation method thereof and preparation method of cured film containing fluorine-containing resin composition 西安瑞联新材料股份有限公司 2024-03-26 CN claimed
US-20230194984-A1 FLUORINE-CONTAINING RESIN COMPOSITION AND PREPARATION METHOD THEREOF, AND PREPARATION METHOD OF CURED FILM CONTAINING SAME XI'AN MANARECO NEW MATERIALS CO., LTD. (CN) 2023-06-22 US claimed
WO-2022142537-A1 FLUORINE-CONTAINING RESIN COMPOSITION, PREPARATION METHOD THEREFOR, AND PREPARATION METHOD FOR CURED FILM CONTAINING SAME 西安瑞联新材料股份有限公司 2022-07-07 WO claimed
EP-1798596-B1 Positive photoresist composition SHINETSU CHEMICAL CO (JP) 2012-08-01 EP claimed
US-20090081589-A1 THICK FILM RESISTS MERCK PATENT GMBH (DE) 2009-03-26 US claimed
EP-1623274-A2 PHOTORESIST COMPOSITIONS AZ Electronic Materials USA Corp. (US) 2006-02-08 EP claimed
EP-1614005-A2 PHOTORESIST COMPOSITIONS AZ Electronic Materials USA Corp. (US) 2006-01-11 EP claimed
US-6905809-B2 Photoresist compositions CLARIANT FINANCE (BVI) LIMITED (VG) 2005-06-14 US claimed
WO-2004088423-A2 PHOTORESIST COMPOSITIONS AZ ELECTRONIC MATERIALS USA CORP. (US) 2004-10-14 WO claimed
WO-2004088424-A2 PHOTORESIST COMPOSITIONS AZ ELECTRONIC MATERIALS USA CORP. (US) 2004-10-14 WO claimed
US-20040197696-A1 Photoresist compositions AZ ELECTRONIC MATERIALS USA CORP. 2004-10-07 US claimed
US-20040197704-A1 Photoresist compositions AZ ELECTRONIC MATERIALS USA CORP. 2004-10-07 US claimed
US-6790582-B1 NOVOLAK RESIN PARTIALLY ESTERIFIED WITH NAPHTHOQUINONEDIAZIDOSULFONYL GROUP; DILUTION RESIN(S), AND SOLVENT CLARIANT FINANCE BVI LIMITED (VG) 2004-09-14 US claimed
US-6686120-B2 THERMAL ACID GENERATOR AND A METHOD OF FORMING A PATTERN USING THE SAME. THE PHOTORESIST COMPOSITION INCLUDES ABOUT 100 PARTS BY WEIGHT OF AN ALKALI-SOLUBLE ACRYL COPOLYMER, ABOUT 5-100 PARTS BY WEIGHT OF 1,2-QUINONEDIAZIDE COMPOUND, ABOUT SAMSUNG ELECTRONICS CO., LTD. (KR) 2004-02-03 US claimed
US-20030134222-A1 Photoresist composition and method of forming pattern using the same SAMSUNG ELECTRONICS CO., LTD. 2003-07-17 US claimed
US-20250362597-A1 RESIST COMPOSITION AND RESIST FILM FORMING METHOD USING SAME MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2025-11-27 US disclosed
US-20250321485-A1 RESIST AUXILIARY FILM COMPOSITION, AND PATTERN FORMING METHOD USING SAME MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2025-10-16 US disclosed
EP-0428398-A2 Radiation-sensitive resin composition JAPAN SYNTHETIC RUBBER CO., LTD. (JP) 1991-05-22 EP disclosed
EP-0365318-A2 Radiation-sensitive resin composition JAPAN SYNTHETIC RUBBER CO., LTD. (JP) 1990-04-25 EP disclosed
EP-0227487-A2 Positive type radiation-sensitive resin composition JAPAN SYNTHETIC RUBBER CO., LTD. (JP) 1987-07-01 EP disclosed