Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | HDAC1 | Q13547 | 1/20 | 0.59 |
| ▸ | SELL | P14151 | 1/20 | 0.58 |
| ▸ | SELP | P16109 | 1/20 | 0.58 |
| ▸ | FNTA | P49354 | 1/20 | 0.53 |
| ▸ | FNTB | P49356 | 1/20 | 0.53 |
| ▸ | HSD17B14 | Q9BPX1 | 4/20 | 0.50 |
| ▸ | ALDH1A1 | P00352 | 3/20 | 0.49 |
| ▸ | HPGD | P15428 | 3/20 | 0.49 |
| ▸ | ALOX15 | P16050 | 3/20 | 0.49 |
| ▸ | RECQL | P46063 | 3/20 | 0.49 |
| ▸ | HSD17B10 | Q99714 | 3/20 | 0.49 |
| ▸ | KDM4E | B2RXH2 | 2/20 | 0.49 |
| ▸ | MAPT | P10636 | 2/20 | 0.49 |
| ▸ | MEN1 | O00255 | 1/20 | 0.49 |
| ▸ | ALOX12 | P18054 | 1/20 | 0.49 |
| ▸ | KMT2A | Q03164 | 1/20 | 0.49 |
| ▸ | ALOX5 | P09917 | 1/20 | 0.48 |
| ▸ | TERT | O14746 | 1/20 | 0.48 |
| ▸ | DBH | P09172 | 1/20 | 0.48 |
| ▸ | ADAMTS4 | O75173 | 1/20 | 0.48 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL29468156 | 1.00 | HDAC1 (0.59) | HDAC1SELLSELPFNTAFNTB | |
| SCHEMBL245254 | 0.93 | FNTA (0.58) | HDAC1SELLSELPFNTAFNTB | |
| SCHEMBL29660832 | 0.91 | GSTA1 (0.56) | HDAC1SELLSELPFNTAFNTB | |
| SCHEMBL93431 | 0.91 | GSTA1 (0.56) | HDAC1SELLSELPFNTAFNTB | |
| SCHEMBL3656656 | 0.91 | HDAC1 (0.59) | HDAC1SELLSELPFNTAFNTB | |
| SCHEMBL1063407 | 0.91 | SELL (0.68) | HDAC1SELLSELPFNTAFNTB | |
| SCHEMBL6847041 | 0.90 | HDAC1 (0.53) | HDAC1SELLSELPFNTAFNTB | |
| SCHEMBL29942150 | 0.90 | HDAC1 (0.53) | HDAC1SELLSELPFNTAFNTB | |
| SCHEMBL21935591 | 0.88 | HDAC1 (0.56) | HDAC1SELLSELPFNTAFNTB | |
| SCHEMBL6568212 | 0.87 | LIG1 (0.62) | HDAC1SELLSELPFNTAFNTB |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 758 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-106138018-A | Dihydroxy benaophenonel application in preparing antiviral and antitumor drug | 广州洁成生物科技有限公司 | 2016-11-23 | — | — | CN | claimed |
| CN-1916111-B | Organic composition, liquid crystal display including the same and method of manufacturing liquid crystal display | SAMSUNG DISPLAY CO LTD | 2014-01-15 | — | — | CN | claimed |
| US-8563214-B2 | Radiation sensitive resin composition and method of forming an interlayer insulating film | SHARP CORPORATION (JP) | 2013-10-22 | — | — | US | claimed |
| CN-102503796-A | 2,2',3,4,4'-pentahydroxybenzophenone and lead (II) complex, and preparation method and application thereof | XIAN MODERN CHEMISTRY RES INST | 2012-06-20 | — | — | CN | claimed |
| CN-101817734-A | 2, 2', 3, 4, 4'-pentahydroxy benzophenone lead (II) and copper (II) binuclear chelate and preparation method thereof | UNIV SHENZHEN | 2010-09-01 | — | — | CN | claimed |
| EP-2203783-A2 | THICK FILM RESISTS | AZ Electronic Materials USA Corp. (US) | 2010-07-07 | — | — | EP | claimed |
| WO-2009040661-A2 | THICK FILM RESISTS | AZ ELECTRONIC MATERIALS USA CORP. (DE) | 2009-04-02 | — | — | WO | claimed |
| CN-1768303-A | Photoresist composition | AZ ELECTRONIC MATERIALS USA (US) | 2006-05-03 | — | — | CN | claimed |
| CN-1768302-A | Photoresist composition | AZ ELECTRONIC MATERIALS USA (US) | 2006-05-03 | — | — | CN | claimed |
| EP-0239423-B1 | Positive type radiation-sensitive resin composition | JAPAN SYNTHETIC RUBBER CO LTD (JP) | 1996-03-20 | — | — | EP | claimed |
| EP-0287212-B1 | Positive photosensitive planographic printing plate | MITSUBISHI CHEM IND (JP) | 1994-12-28 | — | — | EP | claimed |
| US-5362598-A | Compositions for light sensitive elements with styryl dyes | SUMITOMO CHEMICAL CO., LTD. (JP) | 1994-11-08 | — | — | US | claimed |
| US-5283324-A | Reacting phenol compound and quinone diazide sulfonyl halide in solvent mixtures of different dielectric constants | SUMITOMO CHEMICAL COMPANY, LIMITED (JP) | 1994-02-01 | — | — | US | claimed |
| US-5182183-A | Chemical resistance; printing durability | MITSUBISHI KASEI CORPORATION (JP) | 1993-01-26 | — | — | US | claimed |
| US-5162510-A | Prepared by condensing phenolic compounds with a 1,2-naphthoquinonediazide-4-sulfonic acid halide and an organic acid halide | HOECHST CELANESE CORPORATION (US) | 1992-11-10 | — | — | US | claimed |
| US-5124228-A | Based on hydroxy-substituted alkylbenzophenones | SUMITOMO CHEMICAL CO., LTD. (JP) | 1992-06-23 | — | — | US | claimed |
| US-5059507-A | Which is sensitive to ultraviolet rays and x-rays | SUMITOMO CHEMICAL COMPANY, LIMITED (JP) | 1991-10-22 | — | — | US | claimed |
| US-5019479-A | Photoresists for integrated circuits | JAPAN SYNTHETIC RUBBER CO., LTD. (JP) | 1991-05-28 | — | — | US | claimed |
| EP-0287212-A1 | Positive photosensitive planographic printing plate | Mitsubishi Chemical Corporation (JP) | 1988-10-19 | — | — | EP | claimed |
| JP-2282745-A | — | — | None | — | — | JP | disclosed |
| US-12547074-B2 | Photosensitive resin composition, method for producing patterned cured film, patterned cured film and semiconductor element | RESONAC CORPORATION (JP) | 2026-02-10 | — | — | US | disclosed |
| US-12405198-B2 | Photosensitive resin composition, method for selecting photosensitive resin composition, method for producing patterned cured film, and method for producing semiconductor device | RESONAC CORPORATION (JP) | 2025-09-02 | — | — | US | disclosed |
| CN-110286561-B | Radiation-sensitive composition, cured film, and display element | JSR株式会社 | 2025-06-03 | — | — | CN | disclosed |
| CN-114326301-B | Polyimide positive photoresist composition and use thereof | 台湾永光化学工业股份有限公司 | 2025-05-16 | — | — | CN | disclosed |
| US-20240361697-A1 | METHOD FOR SELECTING PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING PATTERNED CURED FILM, CURED FILM, SEMICONDUCTOR DEVICE, AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE | RESONAC CORPORATION (JP) | 2024-10-31 | — | — | US | disclosed |
| CN-110850680-B | Curable composition, display element, and method for forming cured film | JSR株式会社 | 2024-10-25 | — | — | CN | disclosed |
| US-20240352275-A1 | CURED RESIN FILM, SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE | RESONAC CORPORATION (JP) | 2024-10-24 | — | — | US | disclosed |
| WO-2024161658-A1 | AIRTIGHT STRUCTURE, METHOD FOR MANUFACTURING SAME, AND BASE RESIN COMPOSITION FOR MAINTAINING AIRTIGHTNESS | 株式会社レゾナック | 2024-08-08 | — | — | WO | disclosed |
| CN-118325004-A | Phenolic hydroxyl group-containing resin, photosensitive resin composition, curable composition, and resist film | DIC株式会社 | 2024-07-12 | — | — | CN | disclosed |
| CN-113348188-B | Phenolic hydroxyl group-containing resin, photosensitive composition, resist film, curable composition, and cured product | DIC株式会社 | 2024-05-10 | — | — | CN | disclosed |
| CN-112859523-B | Polyimide positive photoresist composition | 台湾永光化学工业股份有限公司 | 2024-04-26 | — | — | CN | disclosed |
| CN-117836927-A | Resin cured film, semiconductor device, and method for manufacturing semiconductor device | 株式会社力森诺科 | 2024-04-05 | — | — | CN | disclosed |
| CN-112731765-B | Fluorine-containing resin composition, preparation method thereof and preparation method of cured film containing fluorine-containing resin composition | 西安瑞联新材料股份有限公司 | 2024-03-26 | — | — | CN | disclosed |
| CN-117751327-A | Positive photosensitive resin composition containing specific copolymer | 日产化学株式会社 | 2024-03-22 | — | — | CN | disclosed |
| CN-114207038-B | Resin composition, method for producing cured product, pattern cured product, interlayer insulating film, covercoat, surface protective film, and electronic component | 艾曲迪微系统股份有限公司 | 2024-03-22 | — | — | CN | disclosed |
| CN-117677901-A | Positive photosensitive resin composition | 日产化学株式会社 | 2024-03-08 | — | — | CN | disclosed |
| CN-117590689-A | Radiation-sensitive composition, cured film, method for producing same, display device, and curable resin composition | JSR株式会社 | 2024-02-23 | — | — | CN | disclosed |
| CN-117321109-A | Phenolic hydroxyl group-containing resin | DIC株式会社 | 2023-12-29 | — | — | CN | disclosed |
| CN-117280447-A | Photosensitive resin composition selection method, pattern cured film production method, cured film, semiconductor device, and semiconductor device production method | 株式会社力森诺科 | 2023-12-22 | — | — | CN | disclosed |
| US-20230324789-A1 | PHOTOSENSITIVE RESIN COMPOSITION, PERMANENT RESIST, METHOD FOR FORMING PERMANENT RESIST, AND METHOD FOR INSPECTING PERMANENT RESIST CURED FILM | RESONAC CORPORATION (JP) | 2023-10-12 | — | — | US | disclosed |
| WO-2023195202-A1 | HYBRID BONDING INSULATION FILM-FORMING MATERIAL, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE | ＨＤマイクロシステムズ株式会社 | 2023-10-12 | — | — | WO | disclosed |
| EP-4216904-A1 | TWO-PHASE COMPOSITION COMPRISING AT LEAST ONE HYDROCARBON OIL AND AT LEAST ONE ESTER OF CITRIC ACID, WHEREIN THE COMPOSITION IS PREFERABLY A CLEANSING COMPOSITION | L'OREAL (FR) | 2023-08-02 | — | — | EP | disclosed |
| US-20230236508-A1 | PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING PATTERNED CURED FILM, PATTERNED CURED FILM AND SEMICONDUCTOR ELEMENT | RESONAC CORPORATION (JP) | 2023-07-27 | — | — | US | disclosed |
| CN-108333869-B | Photosensitive composition, cured film, method for producing same, and display element, light-emitting element, and light-receiving element | JSR株式会社 | 2023-07-18 | — | — | CN | disclosed |
| CN-113227181-B | Resist composition | DIC株式会社 | 2023-07-18 | — | — | CN | disclosed |
| CN-116430671-A | Photoresist composition and photoetching process | 上海飞凯材料科技股份有限公司 | 2023-07-14 | — | — | CN | disclosed |
| CN-110959138-B | Resist material | DIC株式会社 | 2023-06-30 | — | — | CN | disclosed |
| CN-116209690-A | Phenolic hydroxyl group-containing resin, resin composition for alkali-developable resist, resist-curable resin composition, and method for producing phenolic hydroxyl group-containing resin | DIC株式会社 | 2023-06-02 | — | — | CN | disclosed |
| CN-116194840-A | Photosensitive resin composition, permanent resist, method for forming permanent resist, and method for inspecting cured film for permanent resist | 株式会社力森诺科 | 2023-05-30 | — | — | CN | disclosed |
| EP-2980058-B1 | COMPOSITION CONTAINING VINYL-GROUP-CONTAINING COMPOUND | TOKYO OHKA KOGYO CO LTD (JP) | 2023-05-03 | — | — | EP | disclosed |
| US-11639325-B2 | Compositions of polyhydroxylated benzophenones and methods of treatment of neurodegenerative disorders | MASSACHUSETTS INSTITUTE OF TECHNOLOGY (US) | 2023-05-02 | — | — | US | disclosed |
| US-11639325-B2 | Compositions of polyhydroxylated benzophenones and methods of treatment of neurodegenerative disorders | MASSACHUSETTS INSTITUTE OF TECHNOLOGY (US) | 2023-05-02 | — | — | US | disclosed |
| CN-116023607-A | Phenolic hydroxyl group-containing resin | DIC株式会社 | 2023-04-28 | — | — | CN | disclosed |
| CN-115963697-A | Radiation-sensitive composition, cured film, method for producing cured film, and display device | JSR株式会社 | 2023-04-14 | — | — | CN | disclosed |
| CN-115873214-A | Epoxy resin, photosensitive resin composition, resist film, curable composition, and cured film | DIC株式会社 | 2023-03-31 | — | — | CN | disclosed |
| WO-2023026403-A1 | CURED RESIN FILM, SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | 株式会社レゾナック | 2023-03-02 | — | — | WO | disclosed |
| WO-2023027115-A1 | CURED RESIN FILM, SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE | 株式会社レゾナック | 2023-03-02 | — | — | WO | disclosed |
| US-11592744-B2 | Positive-type photosensitive resin composition | HD MICROSYSTEMS, LTD. (JP) | 2023-02-28 | — | — | US | disclosed |
| US-11592743-B2 | Positive-type photosensitive resin composition | HD MICROSYSTEMS, LTD. (JP) | 2023-02-28 | — | — | US | disclosed |
| CN-115704995-A | Curable composition, cured film and application thereof, method for producing cured film, and polymer | JSR株式会社 | 2023-02-17 | — | — | CN | disclosed |
| CN-115704996-A | Radiation-sensitive composition, interlayer insulating film, method for producing same, and display element | JSR株式会社 | 2023-02-17 | — | — | CN | disclosed |
| WO-2023007972-A1 | POSITIVE PHOTOSENSITIVE RESIN COMPOSITION | 日産化学株式会社 | 2023-02-02 | — | — | WO | disclosed |
| WO-2023007941-A1 | POSITIVE PHOTOSENSITIVE RESIN COMPOSITION CONTAINING SPECIFIC COPOLYMER | 日産化学株式会社 | 2023-02-02 | — | — | WO | disclosed |
| CN-107703717-B | Positive photosensitive resin composition, method for producing metal wiring, and laminate | 东京应化工业株式会社 | 2023-01-24 | — | — | CN | disclosed |
| WO-2023281584-A1 | PHOTOSENSITIVE RESIN COMPOSITION, PERMANENT RESIST, METHOD FOR FORMING PERMANENT RESIST, AND METHOD FOR INSPECTING PERMANENT RESIST CURED FILM | 昭和電工マテリアルズ株式会社 | 2023-01-12 | — | — | WO | disclosed |
| CN-115551923-A | Polysulfonamide polymers, positive photosensitive compositions containing them and their use | 崔国英 | 2022-12-30 | — | — | CN | disclosed |
| EP-4099090-A1 | PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING PATTERNED CURED FILM, PATTERNED CURED FILM AND SEMICONDUCTOR ELEMENT | Showa Denko Materials Co., Ltd. (JP) | 2022-12-07 | — | — | EP | disclosed |
| CN-111217946-B | Composition comprising a compound containing a vinyl group | 东京应化工业株式会社 | 2022-12-06 | — | — | CN | disclosed |
| CN-115433358-A | Polyamide-b-amic acid polymers, positive photosensitive compositions and their use | 山东圣泉新材料股份有限公司 | 2022-12-06 | — | — | CN | disclosed |
| CN-115428250-A | Separator for lithium secondary battery, method of manufacturing the same, and lithium secondary battery including the same | 株式会社LG新能源 | 2022-12-02 | — | — | CN | disclosed |
| CN-115398339-A | Photosensitive resin composition, method for producing patterned cured film, and semiconductor device | 昭和电工材料株式会社 | 2022-11-25 | — | — | CN | disclosed |
| WO-2022239232-A1 | METHOD FOR SELECTING PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING PATTERNED CURED FILM, CURED FILM, SEMICONDUCTOR DEVICE, AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE | 昭和電工マテリアルズ株式会社 | 2022-11-17 | — | — | WO | disclosed |
| CN-115202152-A | Composition, cured film and method for producing same, semiconductor element, and display element | JSR株式会社 | 2022-10-18 | — | — | CN | disclosed |
| CN-115151868-A | Photosensitive resin composition, method for sorting photosensitive resin composition, method for producing patterned cured film, and method for producing semiconductor device | 昭和电工材料株式会社 | 2022-10-04 | — | — | CN | disclosed |
| CN-115088129-A | Separator for lithium secondary battery, method of manufacturing the same, and lithium secondary battery including the same | 株式会社LG新能源 | 2022-09-20 | — | — | CN | disclosed |
| CN-107561863-B | Positive photosensitive resin composition and application thereof | 奇美实业股份有限公司 | 2022-09-16 | — | — | CN | disclosed |
| US-20220291584-A1 | Resin Composition, Method for Manufacturing Cured Product, Cured Product, Patterned Cured Product, Interlayer Insulation Film, Cover Coating Layer, Surface Protection Film, and Electronic Component | HD MICROSYSTEMS, LTD. (JP) | 2022-09-15 | — | — | US | disclosed |
| CN-108732831-B | Resin composition, substrate and element comprising same, and method for producing same | JSR株式会社 | 2022-08-16 | — | — | CN | disclosed |
| WO-2022158335-A1 | POLYMER, COMPOSITION, METHOD FOR PRODUCING POLYMER, FILM-FORMING COMPOSITION, RESIST COMPOSITION, METHOD FOR FORMING RESIST PATTERN, RADIATION-SENSITIVE COMPOSITION, COMPOSITION FOR FORMING UNDERLAYER FILM FOR LITHOGRAPHY, METHOD FOR PRODUCING UNDERLAYER FILM FOR LITHOGRAPHY, METHOD FOR FORMING CIRCUIT PATTERN, AND COMPOSITION FOR FORMING OPTICAL MEMBER | 三菱瓦斯化学株式会社 | 2022-07-28 | — | — | WO | disclosed |
| CN-114488688-A | Liquid crystal display element, method for producing same, and radiation-sensitive resin composition | JSR株式会社 | 2022-05-13 | — | — | CN | disclosed |
| CN-114326301-A | Polyimide positive photoresist composition and use thereof | 台湾永光化学工业股份有限公司 | 2022-04-12 | — | — | CN | disclosed |
| CN-114326300-A | Positive photoresist composition, preparation method and photoresist pattern forming method | 上海飞凯材料科技股份有限公司 | 2022-04-12 | — | — | CN | disclosed |
| WO-2022065461-A1 | TWO-PHASE COMPOSITION COMPRISING AT LEAST ONE HYDROCARBON OIL AND AT LEAST ONE ESTER OF CITRIC ACID, WHEREIN THE COMPOSITION IS PREFERABLY A CLEANSING COMPOSITION. | L'OREAL (FR) | 2022-03-31 | — | — | WO | disclosed |
| CN-114207038-A | Resin composition, method for producing cured product, patterned cured product, interlayer insulating film, covercoat, surface protective film, and electronic component | 艾曲迪微系统股份有限公司 | 2022-03-18 | — | — | CN | disclosed |
| WO-2021261448-A1 | PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING PATTERNED CURED FILM, PATTERNED CURED FILM AND SEMICONDUCTOR ELEMENT | 昭和電工マテリアルズ株式会社 | 2021-12-30 | — | — | WO | disclosed |
| WO-2021260944-A1 | PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING PATTERNED CURED FILM, AND SEMICONDUCTOR ELEMENT | 昭和電工マテリアルズ株式会社 | 2021-12-30 | — | — | WO | disclosed |
| US-11180438-B2 | Compositions of polyhydroxylated benzophenones and methods of treatment of neurodegenerative disorders | MASSACHUSETTS INSTITUTE OF TECHNOLOGY (US) | 2021-11-23 | — | — | US | disclosed |
| CN-113589647-A | Radiation-sensitive composition, method for producing cured film, semiconductor element, and display element | JSR株式会社 | 2021-11-02 | — | — | CN | disclosed |
| CN-113552769-A | Radiation-sensitive composition, cured film and method for producing same, semiconductor element, display element, and polymer | JSR株式会社 | 2021-10-26 | — | — | CN | disclosed |
| US-11142629-B2 | Hydrogen barrier agent, hydrogen barrier film forming composition, hydrogen barrier film, method for producing hydrogen barrier film, and electronic element | TOKYO OHKA KOGYO CO., LTD. (JP) | 2021-10-12 | — | — | US | disclosed |
| US-11136435-B2 | Method for producing polyimide film, polyimide film, polyamic acid solution, and photosensitive composition | ENEOS CORPORATION (JP) | 2021-10-05 | — | — | US | disclosed |
| CN-109790263-B | Phenolic hydroxyl group-containing resin and resist material | DIC株式会社 | 2021-09-17 | — | — | CN | disclosed |
| CN-113219690-A | Liquid crystal display element and method for manufacturing the same, radiation-sensitive composition, interlayer insulating film and method for manufacturing the same | JSR株式会社 | 2021-08-06 | — | — | CN | disclosed |
| CN-108604059-B | Positive photosensitive resin composition | 艾曲迪微系统股份有限公司 | 2021-07-02 | — | — | CN | disclosed |
| US-11048167-B2 | Positive photosensitive resin composition, patterned cured film production method, patterned cured film, and electronic component | HD MICROSYSTEMS, LTD. (JP) | 2021-06-29 | — | — | US | disclosed |
| CN-108604060-B | Positive photosensitive resin composition | 艾曲迪微系统股份有限公司 | 2021-06-25 | — | — | CN | disclosed |
| CN-113004478-A | Phenolic polymer and preparation method and application thereof | 彤程化学（中国）有限公司 | 2021-06-22 | — | — | CN | disclosed |
| US-20210171429-A1 | COMPOSITIONS OF POLYHYDROXYLATED BENZOPHENONES AND METHODS OF TREATMENT OF NEURODEGENERATIVE DISORDERS | MASSACHUSETTS INSTITUTE OF TECHNOLOGY (US) | 2021-06-10 | — | — | US | disclosed |
| EP-3413131-B1 | POSITIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION | HD MICROSYSTEMS LTD (JP) | 2021-06-09 | — | — | EP | disclosed |
| CN-104541203-B | Photosensitive resin composition, photosensitive dry film, pattern forming method, printed wiring board, and method for manufacturing printed wiring board | 株式会社微处理 | 2021-06-08 | — | — | CN | disclosed |
| US-11021572-B2 | Photosensitive resin composition, cured product of same, interlayer insulating film, surface protective film and electronic component | HD MICROSYSTEMS, LTD. (JP) | 2021-06-01 | — | — | US | disclosed |
| CN-112859523-A | Polyimide positive photoresist composition | 台湾永光化学工业股份有限公司 | 2021-05-28 | — | — | CN | disclosed |
| CN-107108418-B | Phenolic hydroxyl group-containing compound, composition containing same, and cured film thereof | DIC株式会社 | 2021-04-27 | — | — | CN | disclosed |
| CN-107848926-B | Novolac type phenolic hydroxyl group-containing resin and resist film | DIC株式会社 | 2021-04-20 | — | — | CN | disclosed |
| CN-106795077-B | Naphthol calixarene compound, process for producing the same, photosensitive composition, resist material, and coating film | DIC株式会社 | 2021-03-30 | — | — | CN | disclosed |
| CN-106019841-B | Photosensitive resin composition, pattern forming method, cured film, insulating film, color filter, and display device | 东京应化工业株式会社 | 2021-03-26 | — | — | CN | disclosed |
| CN-108368214-B | Novolac resin and resist film | DIC株式会社 | 2021-03-23 | — | — | CN | disclosed |
| WO-2021039843-A1 | COMPOSITION FOR FORMING FILM FOR LITHOGRAPHY, RESIST PATTERN FORMING METHOD, CIRCUIT PATTERN FORMING METHOD AND PURIFICATION METHOD | 三菱瓦斯化学株式会社 | 2021-03-04 | — | — | WO | disclosed |
| WO-2021024464-A1 | RESIN COMPOSITION, METHOD FOR MANUFACTURING CURED PRODUCT, CURED PRODUCT, PATTERNED CURED PRODUCT, INTERLAYER INSULATION FILM, COVER COATING LAYER, SURFACE PROTECTION FILM, AND ELECTRONIC COMPONENT | ＨＤマイクロシステムズ株式会社 | 2021-02-11 | — | — | WO | disclosed |
| EP-3115380-B1 | COMPOSITE RESIN COMPOSITION AND SAME RESIN COMPOSITION PRODUCTION METHOD | NAGASE CHEMTEX CORP (JP) | 2021-01-20 | — | — | EP | disclosed |
| US-10894887-B2 | Composition for forming film protecting against aqueous hydrogen peroxide solution | NISSAN CHEMICAL CORPORATION (JP) | 2021-01-19 | — | — | US | disclosed |
| CN-108368213-B | Novolac resin and resist film | DIC株式会社 | 2020-12-18 | — | — | CN | disclosed |
| EP-3413132-B1 | POSITIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION | HD MICROSYSTEMS LTD (JP) | 2020-12-16 | — | — | EP | disclosed |
| CN-107111229-B | Curable composition for resist permanent film and resist permanent film | DIC株式会社 | 2020-11-27 | — | — | CN | disclosed |
| CN-109071744-B | Novolac resin and resist material | DIC株式会社 | 2020-11-24 | — | — | CN | disclosed |
| CN-107003612-B | Photosensitive composition for forming resist underlayer film, and resist underlayer film | DIC株式会社 | 2020-11-06 | — | — | CN | disclosed |
| CN-111830749-A | Laminate and method for producing same, method for forming optical film layer, polarizing film and method for producing same, and method for producing liquid crystal display element | JSR株式会社 | 2020-10-27 | — | — | CN | disclosed |
| WO-2020194612-A1 | RESIN COMPOSITION, CURED PRODUCT, SEMICONDUCTOR ELEMENT, AND ELECTRONIC DEVICE | 日立化成株式会社 | 2020-10-01 | — | — | WO | disclosed |
| CN-105301899-B | Photosensitive resin composition for forming insulating film in organic E L display element | 东京应化工业株式会社 | 2020-08-07 | — | — | CN | disclosed |
| WO-2020145406-A1 | FILM FORMING COMPOSITION, RESIST COMPOSITION, RADIATION-SENSITIVE COMPOSITION, METHOD FOR PRODUCING AMORPHOUS FILM, RESIST PATTERN FORMATION METHOD, COMPOSITION FOR FORMING LOWER LAYER FILM FOR LITHOGRAPHY, METHOD FOR PRODUCING LOWER LAYER FILM FOR LITHOGRAPHY, AND CIRCUIT PATTERN FORMATION METHOD | 三菱瓦斯化学株式会社 | 2020-07-16 | — | — | WO | disclosed |
| CN-104950570-B | Resin composition for forming cured film, cured film and method for forming same, and display element | JSR株式会社 | 2020-06-30 | — | — | CN | disclosed |
| CN-111352301-A | Radiation-sensitive resin composition and method for forming microlens | JSR株式会社 | 2020-06-30 | — | — | CN | disclosed |
| CN-111217946-A | Composition comprising a compound containing a vinyl group | 东京应化工业株式会社 | 2020-06-02 | — | — | CN | disclosed |
| CN-108290991-B | Phenolic hydroxyl group-containing resin and resist film | DIC株式会社 | 2020-05-15 | — | — | CN | disclosed |
| CN-107531858-B | Novolac type phenolic hydroxyl group-containing resin and resist film | DIC株式会社 | 2020-05-08 | — | — | CN | disclosed |
| CN-106896644-B | Photosensitive resin composition and application thereof | 青岛蓝帆新材料有限公司 | 2020-05-08 | — | — | CN | disclosed |
| US-20200131376-A1 | COMPOSITION FOR FORMING FILM PROTECTING AGAINST AQUEOUS HYDROGEN PEROXIDE SOLUTION | NISSAN CHEMICAL CORPORATION (JP) | 2020-04-30 | — | — | US | disclosed |
| CN-110959138-A | Resist material | DIC株式会社 | 2020-04-03 | — | — | CN | disclosed |
| US-20200087236-A9 | COMPOSITIONS OF POLYHYDROXYLATED BENZOPHENONES AND METHODS OF TREATMENT OF NEURODEGENERATIVE DISORDERS | THE GENERAL HOSPITAL CORPORATION D/B/A MASSACHUSETTS GENERAL HOSPITAL (US) | 2020-03-19 | — | — | US | disclosed |
| CN-110850680-A | Curable composition, display element, and method for forming cured film | JSR株式会社 | 2020-02-28 | — | — | CN | disclosed |
| CN-110794648-A | Radiation-sensitive composition, cured film, method for producing cured film, and display element | JSR株式会社 | 2020-02-14 | — | — | CN | disclosed |
| CN-104871089-B | Photosensitive resin composition, method for producing cured film, organic EL display device, and liquid crystal display device | 富士胶片株式会社 | 2020-01-14 | — | — | CN | disclosed |
| CN-106200267-B | Positive photosensitive resin composition, pattern forming method and application thereof | 奇美实业股份有限公司 | 2020-01-03 | — | — | CN | disclosed |
| CN-103543607-B | Organic EL element, radiation sensitive linear resin composition and cured film | JSR株式会社 | 2019-11-29 | — | — | CN | disclosed |
| CN-106795258-B | Phenolic hydroxy group resin, preparation method, photonasty or solidification compound, erosion resistant, film, solidfied material and resist lower membrane | DIC株式会社 | 2019-11-08 | — | — | CN | disclosed |
| CN-110317174-A | Hydrogen barrier, hydrogen barrier film, which are formed, uses composition, hydrogen barrier film, the manufacturing method of hydrogen barrier film and electronic component | 东京应化工业株式会社 | 2019-10-11 | — | — | CN | disclosed |
| US-20190300674-A1 | HYDROGEN BARRIER AGENT, HYDROGEN BARRIER FILM FORMING COMPOSITION, HYDROGEN BARRIER FILM, METHOD FOR PRODUCING HYDROGEN BARRIER FILM, AND ELECTRONIC ELEMENT | TOKYO OHKA KOGYO CO., LTD. (JP) | 2019-10-03 | — | — | US | disclosed |
| CN-110286561-A | Radiation sensitive compositions, cured film and display element | JSR株式会社 | 2019-09-27 | — | — | CN | disclosed |
| CN-105093832-B | Photosensitive composition, protective film and element having protective film | 奇美实业股份有限公司 | 2019-08-30 | — | — | CN | disclosed |
| WO-2019151400-A1 | COMPOUND, RESIN, COMPOSITION, METHOD FOR FORMING RESIST PATTERN, METHOD FOR FORMING CIRCUIT PATTERN, AND METHOD FOR PURIFYING RESIN | 三菱瓦斯化学株式会社 | 2019-08-08 | — | — | WO | disclosed |
| WO-2019142897-A1 | COMPOUND, RESIN, COMPOSITION, AND PATTERN FORMING METHOD | 三菱瓦斯化学株式会社 | 2019-07-25 | — | — | WO | disclosed |
| CN-103923426-B | Resin combination, cured film, its forming method, semiconductor element and display element | JSR株式会社 | 2019-06-07 | — | — | CN | disclosed |
| US-20190161580-A1 | PHOTOSENSITIVE RESIN COMPOSITION, CURED PRODUCT OF SAME, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM AND ELECTRONIC COMPONENT | HD MICROSYSTEMS, LTD. (JP) | 2019-05-30 | — | — | US | disclosed |
| EP-2618216-B1 | POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, METHOD OF CREATING RESIST PATTERN, AND ELECTRONIC COMPONENT | HITACHI CHEMICAL CO LTD (JP) | 2019-05-29 | — | — | EP | disclosed |
| CN-105190439-B | Modified novolac type phenolic resin, erosion resistant, film and permanent film against corrosion | DIC株式会社 | 2019-05-17 | — | — | CN | disclosed |
| CN-104914668-B | Curable resin composition, display element cured film, the forming method of display element cured film and display element | JSR株式会社 | 2019-05-14 | — | — | CN | disclosed |
| CN-107001550-B | Novolak phenolics, its manufacturing method, photosensitive composite, erosion resistant and film | DIC株式会社 | 2019-04-02 | — | — | CN | disclosed |
| CN-106458812-B | Containing modified phenolic hydroxyl-compounds, the preparation method containing modified phenolic hydroxyl-compounds, photosensitive composite, protection materials and protection film | DIC株式会社 | 2019-03-26 | — | — | CN | disclosed |
| CN-104698756-B | Positive photosensitive resin composition, pattern forming method, thin film transistor array substrate and liquid crystal display device | 奇美实业股份有限公司 | 2019-03-22 | — | — | CN | disclosed |
| US-20190049842-A1 | POSITIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION | HD MICROSYSTEMS, LTD. (JP) | 2019-02-14 | — | — | US | disclosed |
| US-20190041748-A1 | POSITIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION | HD MICROSYSTEMS, LTD. (JP) | 2019-02-07 | — | — | US | disclosed |
| US-10175577-B2 | Photosensitive resin composition, method for manufacturing patterned cured film, and electronic component | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2019-01-08 | — | — | US | disclosed |
| CN-105531652-B | Touch screen, radiation-sensitive resin composition and cured film | JSR株式会社 | 2018-12-21 | — | — | CN | disclosed |
| CN-109062007-A | positive photosensitive polysiloxane composition and application thereof | 奇美实业股份有限公司 | 2018-12-21 | — | — | CN | disclosed |
| CN-109071744-A | Novolac resin and resist material | DIC株式会社 | 2018-12-21 | — | — | CN | disclosed |
| EP-3413131-A1 | POSITIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION | Hitachi Chemical DuPont Microsystems, Ltd. (JP) | 2018-12-12 | — | — | EP | disclosed |
| EP-3413132-A1 | POSITIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION | Hitachi Chemical DuPont Microsystems, Ltd. (JP) | 2018-12-12 | — | — | EP | disclosed |
| CN-105190901-B | Field effect transistor | 东丽株式会社 | 2018-12-04 | — | — | CN | disclosed |
| EP-3406657-A1 | METHOD FOR PRODUCING POLYIMIDE FILM, POLYIMIDE FILM, POLYAMIDE ACID SOLUTION AND PHOTOSENSITIVE COMPOSITION | Tokyo Ohka Kogyo Co., Ltd. (JP) | 2018-11-28 | — | — | EP | disclosed |
| CN-108732831-A | Liquid crystal display element, organic EL element, radiation-sensitive resin composition, thin film transistor base plate and its manufacturing method | JSR株式会社 | 2018-11-02 | — | — | CN | disclosed |
| US-20180309056-A1 | DISPLAY DEVICE AND ELECTRONIC DEVICE | SEMICONDUCTOR ENERGY LAB (JP) | 2018-10-25 | — | — | US | disclosed |
| CN-108368213-A | Phenolic varnish type resin and etchant resist | DIC株式会社 | 2018-08-03 | — | — | CN | disclosed |
| CN-108368214-A | NOVOLAC RESIN AND RESIST FILM | DIC株式会社 | 2018-08-03 | — | — | CN | disclosed |
| CN-108333869-A | Photosensitive composite, cured film and its manufacturing method and display element, light-emitting component and light receiving element | JSR株式会社 | 2018-07-27 | — | — | CN | disclosed |
| CN-108290991-A | Resin containing phenolic hydroxyl group and etchant resist | DIC株式会社 | 2018-07-17 | — | — | CN | disclosed |
| US-10023540-B2 | Hydrogen barrier agent, hydrogen barrier film forming composition, hydrogen barrier film, method for producing hydrogen barrier film, and electronic element | TOKYO OHKA KOGYO CO., LTD. (JP) | 2018-07-17 | — | — | US | disclosed |
| CN-105555820-B | Manufacturing method, photosensitive composite, erosion resistant and the film of modified hydroxyl naphthol novolak varnish gum, modified hydroxyl naphthol novolak varnish gum | DIC株式会社 | 2018-06-29 | — | — | CN | disclosed |
| US-10003023-B2 | Display device and electronic device | SEMICONDUCTOR ENERGY LABORATORY CO., LTD. (JP) | 2018-06-19 | — | — | US | disclosed |
| CN-108137478-A | Compound, resin, resist composition or radiation-sensitive composition, method for forming resist pattern, method for producing amorphous film, material for forming underlayer film for lithography, composition for forming underlayer film for lithography, method for forming circuit pattern, and purification method | 三菱瓦斯化学株式会社 | 2018-06-08 | — | — | CN | disclosed |
| US-9981914-B2 | — | — | 2018-05-29 | — | — | US | disclosed |
| US-20180086717-A1 | HYDROGEN BARRIER AGENT, HYDROGEN BARRIER FILM FORMING COMPOSITION, HYDROGEN BARRIER FILM, METHOD FOR PRODUCING HYDROGEN BARRIER FILM, AND ELECTRONIC ELEMENT | TOKYO OHKA KOGYO CO., LTD. (JP) | 2018-03-29 | — | — | US | disclosed |
| CN-107848926-A | Novolac type phenolic hydroxyl group-containing resin and resist film | DIC株式会社 | 2018-03-27 | — | — | CN | disclosed |
| US-20180074403-A1 | POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNED CURED FILM PRODUCTION METHOD, PATTERNED CURED FILM, AND ELECTRONIC COMPONENT | HD MICROSYSTEMS, LTD. (JP) | 2018-03-15 | — | — | US | disclosed |
| US-9914687-B2 | Composition containing vinyl-group-containing compound | TOKYO OHKA KOGYO CO., LTD. (JP) | 2018-03-13 | — | — | US | disclosed |
| CN-105392765-B | Compound, photosensitive composite, resist composition, resist film, solidification compound, resist composition for underlayer film and the resist lower membrane of phenolic hydroxy group | DIC株式会社 | 2018-03-02 | — | — | CN | disclosed |
| CN-107703658-A | The manufacture method of substrate | 东京应化工业株式会社 | 2018-02-16 | — | — | CN | disclosed |
| CN-107703717-A | Positive type photosensitive organic compound, the manufacture method of metal line and layered product | 东京应化工业株式会社 | 2018-02-16 | — | — | CN | disclosed |
| CN-107703685-A | The manufacture method of layered product and layered product | 东京应化工业株式会社 | 2018-02-16 | — | — | CN | disclosed |
| EP-2133743-B1 | PHOTOSENSITIVE RESIN COMPOSITION, PROCESS FOR PRODUCING PATTERNED HARDENED FILM WITH USE THEREOF AND ELECTRONIC PART | HITACHI CHEMICAL DUPONT MICROSYSTEMS LTD (JP) | 2018-01-24 | — | — | EP | disclosed |
| EP-2328027-B1 | POSITIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING RESIST PATTERN, AND USES OF SAID RESIST PATTERN | HITACHI CHEMICAL CO LTD (JP) | 2018-01-17 | — | — | EP | disclosed |
| CN-107544209-A | Positive photosensitive resin composition and use thereof | 奇美实业股份有限公司 | 2018-01-05 | — | — | CN | disclosed |
| CN-107531858-A | Phenolic varnish type resin containing phenolic hydroxyl group and etchant resist | DIC株式会社 | 2018-01-02 | — | — | CN | disclosed |
| CN-105814091-B | The manufacture method of composite resin composition and the resin combination | 长濑化成株式会社 | 2017-12-01 | — | — | CN | disclosed |
| CN-107429109-A | The pattern formation method of resin combination and the use resin combination and the synthetic method of polymer | 日产化学工业株式会社 | 2017-12-01 | — | — | CN | disclosed |
| CN-104884423-B | methanofullerene | 亚历克斯·菲利普·格雷厄姆·罗宾逊 | 2017-11-17 | — | — | CN | disclosed |
| US-20170301860-A1 | DISPLAY DEVICE AND ELECTRONIC DEVICE | SEMICONDUCTOR ENERGY LABORATORY CO., LTD. (JP) | 2017-10-19 | — | — | US | disclosed |
| US-9786576-B2 | Positive-type photosensitive resin composition, method for production of resist pattern, semiconductor device, and electronic device | HITACHI CHEMICAL COMPANY, LTD (JP) | 2017-10-10 | — | — | US | disclosed |
| CN-107179652-A | Positive photosensitive polysiloxane composition and application thereof | 奇美实业股份有限公司 | 2017-09-19 | — | — | CN | disclosed |
| CN-107108418-A | Phenolic hydroxyl group-containing compound, composition containing same, and cured film thereof | DIC株式会社 | 2017-08-29 | — | — | CN | disclosed |
| CN-107111229-A | Permanent film solidification compound against corrosion and permanent film against corrosion | DIC株式会社 | 2017-08-29 | — | — | CN | disclosed |
| CN-107087426-A | two-step photoresist composition and method | 亚历克斯·菲利普·格雷厄姆·罗宾逊 | 2017-08-22 | — | — | CN | disclosed |
| CN-107003612-A | Resist lower membrane formation photosensitive composite and resist lower membrane | DIC株式会社 | 2017-08-01 | — | — | CN | disclosed |
| CN-107003607-A | Positive type photosensitive organic compound | 日产化学工业株式会社 | 2017-08-01 | — | — | CN | disclosed |
| CN-107001550-A | Novolak phenolics, its manufacture method, photosensitive composite, erosion resistant and film | DIC株式会社 | 2017-08-01 | — | — | CN | disclosed |
| WO-2017106861-A1 | COMPOSITIONS OF POLYHYDROXYLATED BENZOPHENONES AND METHODS OF TREATMENT OF NEURODEGENERATIVE DISORDERS | MASSACHUSETTS INSTITUTE OF TECHNOLOGY (US) | 2017-06-22 | — | — | WO | disclosed |
| CN-103797418-B | A kind of negative light-sensitive resin combination, pattern formation method, cured film, dielectric film, colour filter and display device | 东京应化工业株式会社 | 2017-06-13 | — | — | CN | disclosed |
| CN-106795258-A | Phenolic hydroxy group resin, preparation method, photonasty or solidification compound, erosion resistant, film, solidfied material and resist lower membrane | DIC株式会社 | 2017-05-31 | — | — | CN | disclosed |
| CN-106795077-A | Naphthol type calixarene compound and its manufacture method, photosensitive composite, erosion resistant and film | DIC株式会社 | 2017-05-31 | — | — | CN | disclosed |
| CN-106715597-A | Resin composition, method for producing heat-resistant resin film, and display device | 东丽株式会社 | 2017-05-24 | — | — | CN | disclosed |
| US-9633848-B2 | Photosensitive resin composition, method for producing patterned cured film, semiconductor element and electronic device | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2017-04-25 | — | — | US | disclosed |
| US-9625812-B2 | Photosensitive resin composition, photosensitive dry film, pattern formation method, printed circuit board, and method for producing same | MICRO PROCESS INC. (JP) | 2017-04-18 | — | — | US | disclosed |
| CN-103547966-B | Photosensitive resin composition | 日产化学工业株式会社 | 2017-03-22 | — | — | CN | disclosed |
| CN-102741750-B | Photosensitive resin composition, photosensitive dry film and pattern forming method | 株式会社微处理 | 2017-03-01 | — | — | CN | disclosed |
| CN-106458812-A | Compound containing modified phenolic hydroxy group, method for producing compound containing modified phenolic hydroxy group, photosensitive composition, resist material, and resist coating film | DIC株式会社 | 2017-02-22 | — | — | CN | disclosed |
| CN-106462063-A | Photosensitive composition for permanent film, resist material and coating film | DIC株式会社 | 2017-02-22 | — | — | CN | disclosed |
| EP-3115380-A1 | COMPOSITE RESIN COMPOSITION AND SAME RESIN COMPOSITION PRODUCTION METHOD | Nagase ChemteX Corporation (JP) | 2017-01-11 | — | — | EP | disclosed |
| CN-103116232-B | The manufacture method of array base palte, liquid crystal display cells and array base palte | JSR株式会社 | 2016-12-21 | — | — | CN | disclosed |
| CN-106200267-A | Positive photosensitive resin composition, pattern forming method and application thereof | 奇美实业股份有限公司 | 2016-12-07 | — | — | CN | disclosed |
| CN-106138018-A | Dihydroxy benaophenonel application in preparing antiviral and antitumor drug | 广州洁成生物科技有限公司 | 2016-11-23 | — | — | CN | disclosed |
| CN-106154750-A | Photosensitive polysiloxane composition, protective film and element with protective film | 奇美实业股份有限公司 | 2016-11-23 | — | — | CN | disclosed |
| US-20160297946-A1 | COMPOSITE RESIN COMPOSITION AND SAME RESIN COMPOSITION PRODUCTION METHOD | NAGASE CHEMTEX CORPORATION (JP) | 2016-10-13 | — | — | US | disclosed |
| US-20160299376-A1 | LIQUID CRYSTAL DISPLAY DEVICE, RADIATION-SENSITIVE RESIN COMPOSITION, INTERLAYER INSULATING FILM, METHOD FOR PRODUCING INTERLAYER INSULATING FILM, AND METHOD FOR MANUFACTURING LIQUID CRYSTAL DISPLAY DEVICE | JSR CORPORATION (JP) | 2016-10-13 | — | — | US | disclosed |
| CN-106019847-A | Photosensitive polysiloxane composition, protective film and element with protective film | 奇美实业股份有限公司 | 2016-10-12 | — | — | CN | disclosed |
| CN-103592819-B | Photosensitive resin composition, spacer, protective film and liquid crystal display element formed from the same | 奇美实业股份有限公司 | 2016-08-24 | — | — | CN | disclosed |
| CN-105874882-A | Display or illumination device, and method for forming insulating film | JSR株式会社 | 2016-08-17 | — | — | CN | disclosed |
| CN-102243386-B | Liquid crystal display cells, positive radiation line sensitive compositions, interlayer dielectric used for liquid crystal display element and forming method thereof | JSR株式会社 | 2016-08-10 | — | — | CN | disclosed |
| US-9395626-B2 | Photosensitive resin composition, method for manufacturing patterned cured film, and electronic component | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2016-07-19 | — | — | US | disclosed |
| CN-102934028-B | Photosensitive polymer combination and display equipment | 日产化学工业株式会社 | 2016-06-29 | — | — | CN | disclosed |
| CN-102455597-B | X-ray sensitive resin composition, cured film and forming method thereof, liquid crystal display cells array base palte and forming method thereof | JSR株式会社 | 2016-06-29 | — | — | CN | disclosed |
| CN-103339532-B | Lenticule formation photosensitive polymer combination | 日产化学工业株式会社 | 2016-06-22 | — | — | CN | disclosed |
| CN-105541659-A | Halogenated oxime derivatives and their use as potential acid | CIBA SPECIALTY CHEMICALS HOLDING INC | 2016-05-04 | — | — | CN | disclosed |
| CN-105555820-A | Modified hydroxy naphthalene novolak resin, production method for modified hydroxy naphthalene novolak resin, photosensitive composition, resist material and coating | DAINIPPON INK & CHEMICALS | 2016-05-04 | — | — | CN | disclosed |
| CN-105531652-A | Touch panel, radiation-sensitive resin composition and cured film | JSR CORP | 2016-04-27 | — | — | CN | disclosed |
| CN-105425545-A | Positive photosensitive resin composition and use thereof | CHI MEI CORP | 2016-03-23 | — | — | CN | disclosed |
| CN-105392765-A | Compound containing phenolic hydroxy group, photosensitive composition, composition for resists, resist coating film, curable composition, composition for resist underlayer films, and resist underlayer film | DAINIPPON INK & | 2016-03-09 | — | — | CN | disclosed |
| US-9274422-B2 | Photosensitive resin composition, method for forming pattern-cured film using photosensitive resin composition, and electronic component | HITACHI CHEMICAL DUPONT MICROSYSTEMS, LTD. (JP) | 2016-03-01 | — | — | US | disclosed |
| US-20160054616-A1 | ARRAY SUBSTRATE, LIQUID CRYSTAL DISPLAY ELEMENT, AND RADIATION-SENSITIVE RESIN COMPOSITION | JSR CORPORATION (JP) | 2016-02-25 | — | — | US | disclosed |
| US-20160046552-A1 | COMPOSITION CONTAINING VINYL-GROUP-CONTAINING COMPOUND | TOKYO OHKA KOGYO CO., LTD. (JP) | 2016-02-18 | — | — | US | disclosed |
| CN-105319851-A | Radiation sensitive linear resin composition, insulation film and display member | JSR CORP | 2016-02-10 | — | — | CN | disclosed |
| EP-2980058-A1 | COMPOSITION CONTAINING VINYL-GROUP-CONTAINING COMPOUND | Tokyo Ohka Kogyo Co., Ltd. (JP) | 2016-02-03 | — | — | EP | disclosed |
| CN-105301899-A | Photosensitive resin composite for forming insulating film in organic EL display element | TOKYO OHKA KOGYO CO LTD | 2016-02-03 | — | — | CN | disclosed |
| CN-105283432-A | Composition comprising a compound containing a vinyl group | TOKYO OHKA KOGYO CO LTD | 2016-01-27 | — | — | CN | disclosed |
| US-9244346-B2 | Negative-type photosensitive resin composition, pattern forming method, cured film, insulating film, color filter, and display device | TOKYO OHKA KOGYO CO., LTD. (JP) | 2016-01-26 | — | — | US | disclosed |
| CN-102782578-B | Photosensitive polymer combination, photosensitive dry film and pattern formation method | MITSUBISHI RAYON CO.,LTD. (JP) | 2016-01-20 | — | — | CN | disclosed |
| CN-105190439-A | Modified phenolic novolac resin, resist material, coating film, and permanent resist film | DAINIPPON INK & | 2015-12-23 | — | — | CN | disclosed |
| CN-102529248-B | For the plastic products of motor-vehicle glass window | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2015-12-16 | — | — | CN | disclosed |
| CN-105103042-A | Array substrate, liquid crystal display element, and radiation-sensitive resin composition | JSR CORP | 2015-11-25 | — | — | CN | disclosed |
| CN-103069339-B | RESIN COMPOSITION FOR PHOTORESIST | SUMITOMO BAKELITE CO.,LTD. (JP) | 2015-11-25 | — | — | CN | disclosed |
| US-20150325431-A1 | PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING PATTERNED CURED FILM, SEMICONDUCTOR ELEMENT AND ELECTRONIC DEVICE | RESONAC CORPORATION (JP) | 2015-11-12 | — | — | US | disclosed |
| CN-104950570-A | Resin composition for forming cured film, the cured film and method for forming the same, and display device | JSR CORP | 2015-09-30 | — | — | CN | disclosed |
| EP-2920142-A1 | METHANOFULLERENES | Robinson, Alex Philip, Graham (GB) | 2015-09-23 | — | — | EP | disclosed |
| CN-104914668-A | Curable resin composition, cured film for display device, method for forming the same, and display device | JSR CORP | 2015-09-16 | — | — | CN | disclosed |
| US-9134608-B2 | Positive photosensitive resin composition, method for producing patterned cured film and electronic component | HITACHI CHEMICAL DUPONT MICROSYSTEMS, LTD. (JP) | 2015-09-15 | — | — | US | disclosed |
| EP-2916169-A1 | PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING PATTERNED CURED FILM, SEMICONDUCTOR ELEMENT AND ELECTRONIC DEVICE | Hitachi Chemical Company, Ltd. (JP) | 2015-09-09 | — | — | EP | disclosed |
| CN-104884423-A | methanofullerene | ROBINSON ALEX PHILIP GRAHAM | 2015-09-02 | — | — | CN | disclosed |
| CN-104871089-A | Photosensitive resin composition, method for producing cured film, cured film, organic EL display device and liquid crystal display device | FUJIFILM CORP | 2015-08-26 | — | — | CN | disclosed |
| CN-103270451-B | Positive light anti-etching agent composition | DIC CORP. (JP) | 2015-08-26 | — | — | CN | disclosed |
| CN-103176364-B | Positive photosensitive resin composition and use thereof | CHI MEI CORP. (CN) | 2015-08-26 | — | — | CN | disclosed |
| CN-104871088-A | Photosensitive resin composition and photosensitive film using same | HITACHI CHEMICAL CO LTD | 2015-08-26 | — | — | CN | disclosed |
| CN-104820340-A | Manufacturing method for hardened film of display element, photoreceptive and radioactive resin composition, applications and heating device | JSR KK | 2015-08-05 | — | — | CN | disclosed |
| US-20150168832-A1 | PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE DRY FILM, PATTERN FORMATION METHOD, PRINTED CIRCUIT BOARD, AND METHOD FOR PRODUCING SAME | MICRO PROCESS INC. (JP) | 2015-06-18 | — | — | US | disclosed |
| CN-104541203-A | Photosensitive resin composition, photosensitive dry film, pattern formation method, printed circuit board, and method for producing same | MICRO PROCESS INC | 2015-04-22 | — | — | CN | disclosed |
| CN-102841504-B | Positive photosensitive resin composition and method for forming pattern using the same | CHI MEI CORP | 2015-03-25 | — | — | CN | disclosed |
| CN-103384850-B | Positive photoresist composition, coating film thereof, and novolac phenol resin | DAINIPPON INK & CHEMICALS | 2015-02-04 | — | — | CN | disclosed |
| US-20150024173-A1 | PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR MANUFACTURING PATTERNED CURED FILM, AND ELECTRONIC COMPONENT | RESONAC CORPORATION (JP) | 2015-01-22 | — | — | US | disclosed |
| CN-102566278-B | Siloxane polymer composition, cured film and method for forming the cured film | JSR CORP | 2015-01-21 | — | — | CN | disclosed |
| EP-2372457-B1 | POSITIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING RESIST PATTERN, SEMICONDUCTOR DEVICE, AND ELECTRONIC DEVICE | HITACHI CHEMICAL CO LTD (JP) | 2014-11-26 | — | — | EP | disclosed |
| CN-102549496-B | Radiation-sensitive resin composition and method of forming interlayer dielectric | SHARP KK | 2014-11-26 | — | — | CN | disclosed |
| US-20140322635-A1 | PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR MANUFACTURING PATTERNED CURED FILM, AND ELECTRONIC COMPONENT | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2014-10-30 | — | — | US | disclosed |
| EP-2793082-A1 | PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR MANUFACTURING PATTERNED CURED FILM, AND ELECTRONIC COMPONENT | Hitachi Chemical Company, Ltd. (JP) | 2014-10-22 | — | — | EP | disclosed |
| US-8859186-B2 | Polyimide precursor, resin composition comprising the polyimide precursor, pattern forming method using the resin composition, and articles produced by using the resin composition | DAI NIPPON PRINTING CO., LTD. (JP) | 2014-10-14 | — | — | US | disclosed |
| US-8852726-B2 | Photosensitive polymer composition, method of producing pattern and electronic parts | HITACHI CHEMICAL DUPONT MICROSYSTEMS LTD. (JP) | 2014-10-07 | — | — | US | disclosed |
| US-8836089-B2 | Positive photosensitive resin composition, method of creating resist pattern, and electronic component | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2014-09-16 | — | — | US | disclosed |
| EP-1744213-B1 | POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR FORMING PATTERN, AND ELECTRONIC COMPONENT | HITACHI CHEM DUPONT MICROSYS (JP) | 2014-09-03 | — | — | EP | disclosed |
| US-20140231729-A1 | NEGATIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION, PATTERN FORMING METHOD, CURED FILM, INSULATING FILM, COLOR FILTER, AND DISPLAY DEVICE | TOKYO OHKA KOGYO CO., LTD. (JP) | 2014-08-21 | — | — | US | disclosed |
| CN-102186815-B | Sulfonium derivatives and the use therof as latent acids | BASF SE | 2014-07-30 | — | — | CN | disclosed |
| CN-103923426-A | Resin Composition, Cured Film, Forming Method Thereof, Semiconductor Element And Display Element | JSR CORP | 2014-07-16 | — | — | CN | disclosed |
| CN-102213918-B | Positive type radiation-sensitive composition, inter-layer insulating film and forming method therefor | JSR CORP | 2014-07-16 | — | — | CN | disclosed |
| US-8765868-B2 | Resin composition for insulating film or surface-protective film of electronic components, method for producing pattern-cured film and electronic components | HITACHI CHEMICAL DUPONT MICROSYSTEMS, LTD. (JP) | 2014-07-01 | — | — | US | disclosed |
| CN-102460299-B | Photosensitive modified polyimide resin composition and use thereof | PI R & D CO LTD | 2014-06-25 | — | — | CN | disclosed |
| CN-101952269-B | Sulphonium salt initiators | BASF SE | 2014-06-25 | — | — | CN | disclosed |
| CN-103869614-A | PHOTOSENSITIVE RESIN COMPOSITION,PHOTOSENSITIVE ELEMENT, PHOTOSENITIVE ELEMENT COIL AND PHOTORESISTANCE PATTERN FORMING METHOD | HITACHI CHEMICAL CO LTD | 2014-06-18 | — | — | CN | disclosed |
| CN-1955843-B | Photosensitive resin composition | DONGJIN SIMIKEN CO LTD | 2014-06-11 | — | — | CN | disclosed |
| CN-102597061-B | Polyimide precursor and photosensitive resin composition containing the same | ASAHI KASEI E MATERIALS CORP | 2014-06-04 | — | — | CN | disclosed |
| CN-103842909-A | Positive-type photosensitive resin composition, and insulating film and OLED formed using the same | KOLON INC | 2014-06-04 | — | — | CN | disclosed |
| WO-2014078097-A1 | METHANOFULLERENES | ROBINSON ALEX PHILIP GRAHAM (GB) | 2014-05-22 | — | — | WO | disclosed |
| CN-103797418-A | Negative-type photosensitive resin composition, pattern forming method, cured film, insulating film, color filter, and display device | TOKYO OHKA KOGYO CO LTD | 2014-05-14 | — | — | CN | disclosed |
| US-20140120462-A1 | PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR FORMING PATTERN-CURED FILM USING PHOTOSENSITIVE RESIN COMPOSITION, AND ELECTRONIC COMPONENT | HITACHI CHEMICAL DUPONT MICROSYSTEMS, LTD. (JP) | 2014-05-01 | — | — | US | disclosed |
| EP-2725423-A1 | NEGATIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION, PATTERN FORMING METHOD, CURED FILM, INSULATING FILM, COLOR FILTER, AND DISPLAY DEVICE | Tokyo Ohka Kogyo Co., Ltd. (JP) | 2014-04-30 | — | — | EP | disclosed |
| CN-102087473-B | Radiation sensitive resin composition, interlayer dielectric, and method for producing thereof | JSR CORP | 2014-04-16 | — | — | CN | disclosed |
| CN-103210349-B | Positive-type photoresist composition | DAINIPPON INK & CHEMICALS | 2014-04-16 | — | — | CN | disclosed |
| US-8697328-B2 | Film type photodegradable transfer material | KOLON INDUSTRIES, INC. (KR) | 2014-04-15 | — | — | US | disclosed |
| CN-103676482-A | Positive photosensitive resin composition and pattern forming method thereof | CHI MEI CORP | 2014-03-26 | — | — | CN | disclosed |
| CN-103576453-A | Ink composition used for silk screen printing and pattern forming method | TOKYO OHKA KOGYO CO LTD | 2014-02-12 | — | — | CN | disclosed |
| US-8647807-B2 | Photosensitive resin composition, photosensitive dry film and method for forming pattern | MICRO PROCESS INC. (JP) | 2014-02-11 | — | — | US | disclosed |
| US-8647806-B2 | Photosensitive resin composition, photosensitive dry film and method for forming pattern | MICRO PROCESS INC (JP) | 2014-02-11 | — | — | US | disclosed |
| CN-103543607-A | Organic EL element, radiation-sensitive resin composition, and cured film | JSR CORP | 2014-01-29 | — | — | CN | disclosed |
| EP-2469337-B1 | Positive photosensitive resin composition, method for forming pattern, and electronic component | HITACHI CHEM DUPONT MICROSYS (JP) | 2014-01-22 | — | — | EP | disclosed |
| US-20140014928-A1 | ORGANIC EL ELEMENT, RADIATION-SENSITIVE RESIN COMPOSITION, AND CURED FILM | JSR CORPORATION (JP) | 2014-01-16 | — | — | US | disclosed |
| CN-1916111-B | Organic composition, liquid crystal display including the same and method of manufacturing liquid crystal display | SAMSUNG DISPLAY CO LTD | 2014-01-15 | — | — | CN | disclosed |
| CN-101809502-B | Thick film resists | AZ ELECTRONIC MATERIALS USA | 2014-01-08 | — | — | CN | disclosed |
| CN-102576192-B | Photosensitive resin composition | DONGJIN SEMICHEM CO LTD | 2014-01-01 | — | — | CN | disclosed |
| EP-2270595-B1 | RADIATION-SENSITIVE RESIN COMPOSITION | NAGASE CHEMTEX CORP (JP) | 2013-11-20 | — | — | EP | disclosed |
| CN-102047180-B | Film type photodegradable transfer material | KOLON INC | 2013-11-20 | — | — | CN | disclosed |
| CN-102053497-B | Positive type radiation-sensitive resin composition, inter-layer insulating film and method for forming the same | JSR CORP | 2013-11-20 | — | — | CN | disclosed |
| CN-103384850-A | Positive photoresist composition, coating film thereof, and novolac phenol resin | DAINIPPON INK & CHEMICALS | 2013-11-06 | — | — | CN | disclosed |
| CN-102395614-B | Photosensitive polyester composition for use in forming thermally cured film | NISSAN CHEMICAL IND LTD | 2013-10-30 | — | — | CN | disclosed |
| CN-102483570-B | Photosensitive resin composition containing copolymer, cured film and microlens | NISSAN CHEMICAL IND LTD | 2013-10-23 | — | — | CN | disclosed |
| US-8563214-B2 | Radiation sensitive resin composition and method of forming an interlayer insulating film | SHARP CORPORATION (JP) | 2013-10-22 | — | — | US | disclosed |
| CN-103339532-A | Photosensitive resin composition for formation of microlenses | NISSAN CHEMICAL IND LTD | 2013-10-02 | — | — | CN | disclosed |
| EP-2221666-B1 | POSITIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCTION OF RESIST PATTERN, AND SEMICONDUCTOR DEVICE | HITACHI CHEMICAL CO LTD (JP) | 2013-09-18 | — | — | EP | disclosed |
| CN-102026967-B | Sulphonium salt initiators | CIBA HOLDING INC | 2013-09-18 | — | — | CN | disclosed |
| CN-102445852-B | Positive photosensitive resin composition and method for forming pattern | CHI MEI CORP | 2013-09-11 | — | — | CN | disclosed |
| US-8530003-B2 | Polybenzoxazole precursor, photosensitive resin composition using the same, and manufacturing method of semiconductor device | FUJIFILM CORPORATION (JP) | 2013-09-10 | — | — | US | disclosed |
| CN-103270451-A | Positive-type photoresist composition | DAINIPPON INK & CHEMICALS | 2013-08-28 | — | — | CN | disclosed |
| CN-103229101-A | Photosensitive resin composition for microlens | NISSAN CHEMICAL IND LTD | 2013-07-31 | — | — | CN | disclosed |
| EP-2618216-A1 | POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, METHOD OF CREATING RESIST PATTERN, AND ELECTRONIC COMPONENT | Hitachi Chemical Co., Ltd. (JP) | 2013-07-24 | — | — | EP | disclosed |
| CN-103210349-A | Positive-type photoresist composition | DAINIPPON INK & CHEMICALS | 2013-07-17 | — | — | CN | disclosed |
| US-20130168859-A1 | POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, METHOD OF CREATING RESIST PATTERN, AND ELECTRONIC COMPONENT | RESONAC CORPORATION (JP) | 2013-07-04 | — | — | US | disclosed |
| CN-103176364-A | Positive photosensitive resin composition and use thereof | CHI MEI CORP | 2013-06-26 | — | — | CN | disclosed |
| CN-101581883-B | Positive photoresist, insulation layer and organic light emitting diode | COLON CO LTD | 2013-06-19 | — | — | CN | disclosed |
| CN-101788767-B | Radiation sensitive linear resin composition and layer insulation film and manufacture method thereof | JSR KK | 2013-06-12 | — | — | CN | disclosed |
| US-8461699-B2 | Positive-type photosensitive resin composition, method for producing resist pattern, semiconductor device, and electronic device | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2013-06-11 | — | — | US | disclosed |
| CN-103116232-A | Array substrate, liquid crystal display device, and process for producing the array substrate | JSR CORP | 2013-05-22 | — | — | CN | disclosed |
| WO-2013064892-A2 | NANOCOMPOSITE POSITIVE PHOTOSENSITIVE COMPOSITION AND USE THEREOF | AZ ELECTRONICS MATERIALS USA CORP. (US) | 2013-05-10 | — | — | WO | disclosed |
| CN-103069339-A | Resin composition for photoresist | SUMITOMO BAKELITE CO | 2013-04-24 | — | — | CN | disclosed |
| US-8426985-B2 | Positive-type photosensitive resin composition, method for producing resist pattern, and electronic component | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2013-04-23 | — | — | US | disclosed |
| US-8420291-B2 | Positive photosensitive resin composition, method for forming pattern, electronic component | HITACHI CHEMICAL DUPONT MICROSYSTEMS, LTD. (JP) | 2013-04-16 | — | — | US | disclosed |
| CN-102934028-A | Photosensitive resin composition and display device | NISSAN CHEMICAL IND LTD | 2013-02-13 | — | — | CN | disclosed |
| CN-101073036-B | Positive type dry film photoresist | KOLON INC | 2013-01-23 | — | — | CN | disclosed |
| CN-101535895-B | Photosensitive resin composition and flexible printed wiring board using the same | ASAHI CHEMICAL IND | 2013-01-16 | — | — | CN | disclosed |
| US-20130004895-A1 | PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE DRY FILM AND METHOD FOR FORMING PATTERN | MICRO PROCESS INC. (JP) | 2013-01-03 | — | — | US | disclosed |
| CN-101308327-B | Radiation-sensed resin composition, layer insulation film, microlens and forming method thereof | JSR CORP | 2013-01-02 | — | — | CN | disclosed |
| CN-1808273-B | Photosensitive resin composition, thin film panel made with photosensitive resin composition, and method for manufacturing thin film panel | SAMSUNG ELECTRONICS CO LTD | 2012-12-26 | — | — | CN | disclosed |
| CN-102841504-A | Positive photosensitive resin composition and method for forming pattern using the same | CHI MEI CORP | 2012-12-26 | — | — | CN | disclosed |
| US-20120301830-A1 | PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE DRY FILM AND METHOD FOR FORMING PATTERN | MICRO PROCESS INC. (JP) | 2012-11-29 | — | — | US | disclosed |
| CN-101359174-B | Radiation-sensitive resin composition, layer insulation film and microlens and manufacture method thereof | JSR CORP | 2012-11-28 | — | — | CN | disclosed |
| CN-101546127-B | Radiation sensitive resin composition, interlayer insulation film and method for manufacturing micro-lens | JSR CORP | 2012-11-28 | — | — | CN | disclosed |
| CN-101073035-B | Positive type dry film photoresist | KOLON INC | 2012-11-28 | — | — | CN | disclosed |
| CN-101971096-B | Radiation-sensitive resin composition | NAGASE CHEMTEX CORP | 2012-11-21 | — | — | CN | disclosed |
| CN-102782578-A | Photosensitive resin composition, photosensitive dry film, and pattern forming method | MICRO PROCESS INC | 2012-11-14 | — | — | CN | disclosed |
| CN-102778816-A | Positive photosensitive resin composition and method for forming pattern using the same | CHI MEI COOPERATION | 2012-11-14 | — | — | CN | disclosed |
| CN-101153121-B | Radiation-sensitive resin composition for spacer, spacer and method for forming the same | JSR CORP | 2012-11-14 | — | — | CN | disclosed |
| US-8304149-B2 | Photosensitive polymer composition, method of forming relief patterns, and electronic equipment | HITACHI CHEMICAL DUPONT MICROSYSTEMS LTD. (JP) | 2012-11-06 | — | — | US | disclosed |
| US-8298747-B2 | Photosensitive resin composition, process for producing patterned hardened film with use thereof and electronic part | HITACHI CHEMICAL DUPONT MICROSYSTEMS, LTD. (JP) | 2012-10-30 | — | — | US | disclosed |
| US-20120270151-A1 | RADIATION SENSITIVE RESIN COMPOSITION AND METHOD OF FORMING AN INTERLAYER INSULATING FILM | JSR CORPORATION (JP) | 2012-10-25 | — | — | US | disclosed |
| US-20120263920-A1 | Photosensitive Polymer Composition, Method of Producing Pattern and Electronic Parts | OOE MASAYUKI (JP) | 2012-10-18 | — | — | US | disclosed |
| CN-102741750-A | Photosensitive resin composition, photosensitive dry film and pattern forming method | MICRO PROCESS INC | 2012-10-17 | — | — | CN | disclosed |
| CN-101324755-B | Radiation sensitive resin composition, interlayer dielectric and microlens, and method for producing thereof | JSR CORP | 2012-10-03 | — | — | CN | disclosed |
| CN-101226329-B | Radiation sensitive resin composition, laminated insulating film, micro lens and preparation method thereof | JSR CORP | 2012-09-05 | — | — | CN | disclosed |
| US-8231959-B2 | Photosensitive polymer composition, method of producing pattern and electronic parts | HITACHI CHEMICAL DUPONT MICROSYSTEMS LTD. (JP) | 2012-07-31 | — | — | US | disclosed |
| CN-101515113-B | Radioactive ray sensibility resin composition, interlayer insulating film, microlens and method of forming the same | JSR CORP | 2012-07-18 | — | — | CN | disclosed |
| CN-101034260-B | Photosensitive resin composition | DONGJIN SEMICOHEM CO LTD | 2012-07-18 | — | — | CN | disclosed |
| CN-102566278-A | Siloxane polymer composition, cured film and method for forming the cured film | JSR CORP | 2012-07-11 | — | — | CN | disclosed |
| CN-102576192-A | Photosensitive resin composition | DONGJIN SEMICHEM CO LTD | 2012-07-11 | — | — | CN | disclosed |
| CN-102549496-A | Radiation-sensitive resin composition and method of forming interlayer dielectric | SHARP KK | 2012-07-04 | — | — | CN | disclosed |
| CN-102529248-A | Plastic article for automotive glazing | SHINETSU CHEMICAL CO | 2012-07-04 | — | — | CN | disclosed |
| EP-2469337-A1 | Positive photosensitive resin composition, method for forming pattern, and electronic component | Hitachi Chemical DuPont MicroSystems Ltd. (JP) | 2012-06-27 | — | — | EP | disclosed |
| CN-102503796-A | 2,2',3,4,4'-pentahydroxybenzophenone and lead (II) complex, and preparation method and application thereof | XIAN MODERN CHEMISTRY RES INST | 2012-06-20 | — | — | CN | disclosed |
| CN-101154040-B | Photoresist composition, its coating method and method of forming photoresist pattern | AZ ELECTRONIC MATERIALS JAPAN | 2012-06-06 | — | — | CN | disclosed |
| CN-102483570-A | Photosensitive resin composition containing copolymer | NISSAN CHEMICAL IND LTD | 2012-05-30 | — | — | CN | disclosed |
| CN-102472833-A | Photosensitive resin composition for microlens | NISSAN CHEMICAL IND LTD | 2012-05-23 | — | — | CN | disclosed |
| CN-102455597-A | Radiation-sensitive resin composition, cured film and forming method thereof, array substrate of liquid crystal display element and forming method thereof | JSR CORP | 2012-05-16 | — | — | CN | disclosed |
| CN-102460299-A | Photosensitive modified polyimide resin composition and use thereof | PI R & D CO LTD | 2012-05-16 | — | — | CN | disclosed |
| US-20120115333-A1 | POLYBENZOXAZOLE PRECURSOR, PHOTOSENSITIVE RESIN COMPOSITION USING THE SAME, AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE | FUJIFILM CORPORATION (JP) | 2012-05-10 | — | — | US | disclosed |
| CN-102445852-A | Positive photosensitive resin composition and method for forming pattern | CHI MEI CORP | 2012-05-09 | — | — | CN | disclosed |
| US-8173349-B2 | Photosensitive resin composition, polymer compound, method of forming a pattern, and electronic device | FUJIFILM CORPORATION (JP) | 2012-05-08 | — | — | US | disclosed |
| US-20120088189-A1 | CONDUCTIVE COMPOSITION, TRANSPARENT CONDUCTIVE FILM, DISPLAY ELEMENT AND INTEGRATED SOLAR BATTERY | FUJIFILM CORPORATION (JP) | 2012-04-12 | — | — | US | disclosed |
| CN-102395614-A | Photosensitive polyester composition for use in forming thermally cured film | NISSAN CHEMICAL IND LTD | 2012-03-28 | — | — | CN | disclosed |
| US-8133550-B2 | Good breaking elongation characteristics, achievable high sensitivity and high film remaining rate, little in pattern size fluctuation at the heating time after lithographic process, capable of stable pattern formation; manufacturing a semiconductor device | FUJIFILM CORPORATION (JP) | 2012-03-13 | — | — | US | disclosed |
| CN-102346372-A | Positive photosensitive resin composition and method for forming pattern using the same | CHI MEI CORP | 2012-02-08 | — | — | CN | disclosed |
| US-8097386-B2 | Positive-type photosensitive resin composition, method for producing patterns, and electronic parts | HITACHI CHEMICAL DUPONT MICROSYSTEMS, LTD. (JP) | 2012-01-17 | — | — | US | disclosed |
| CN-1989455-B | Oxime derivatives and the use therof as latent acids | CIBA SPECIALTY CHEMICALS HOLDING INC. (CH) | 2011-12-21 | — | — | CN | disclosed |
| CN-101025567-B | Radiation-sensitive resin composition, method for forming spacer and spacer | JSR CO., LTD. (JP) | 2011-12-14 | — | — | CN | disclosed |
| CN-101002090-B | Method of printing a time-temperature indicator based on azo coupling reactions onto a substrate | CIBA SC HOLDING AG | 2011-11-23 | — | — | CN | disclosed |
| CN-101154041-B | Radiation sensitive resin composition, and formation of interlayer insulating film and microlens | JSR CORP | 2011-11-23 | — | — | CN | disclosed |
| US-20110281040-A1 | LIQUID CRYSTAL DISPLAY ELEMENT, POSITIVE TYPE RADIATION SENSITIVE COMPOSITION, INTERLAYER INSULATING FILM FOR LIQUID CRYSTAL DISPLAY ELEMENT, AND FORMATION METHOD THEREOF | JSR CORPORATION (JP) | 2011-11-17 | — | — | US | disclosed |
| CN-102243386-A | Liquid crystal display device, positive radiation-sensitive composition, interlayer insulating film for liquid crystal display device and method for forming the same | JSR CORP | 2011-11-16 | — | — | CN | disclosed |
| US-20110254178-A1 | POSITIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING RESIST PATTERN, SEMICONDUCTOR DEVICE, AND ELECTRONIC DEVICE | RESONAC CORPORATION (JP) | 2011-10-20 | — | — | US | disclosed |
| CN-102221782-A | Positive radiation sensitive composition, interlayer insulation film and forming method thereof | JSR CORP | 2011-10-19 | — | — | CN | disclosed |
| CN-102221781-A | Positive radiation sensitive composition, interlayer insulation film and forming method thereof | JSR CORP | 2011-10-19 | — | — | CN | disclosed |
| US-20110250396-A1 | POSITIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCTION OF RESIST PATTERN, SEMICONDUCTOR DEVICE, AND ELECTRONIC DEVICE | RESONAC CORPORATION (JP) | 2011-10-13 | — | — | US | disclosed |
| CN-102213918-A | Positive type radiation-sensitive composition, inter-layer insulating film and forming method therefor | JSR CORP | 2011-10-12 | — | — | CN | disclosed |
| EP-1708026-B1 | PHOTOSENSITIVE POLYMER COMPOSITION, PROCESS FOR PRODUCING PATTERN, AND ELECTRONIC PART | HITACHI CHEM DUPONT MICROSYS (JP) | 2011-10-05 | — | — | EP | disclosed |
| EP-2372457-A1 | POSITIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING RESIST PATTERN, SEMICONDUCTOR DEVICE, AND ELECTRONIC DEVICE | Hitachi Chemical Company, Ltd. (JP) | 2011-10-05 | — | — | EP | disclosed |
| CN-1873534-B | Photosensitive resin composition, method of manufacturing a thin-film transistor substrate, and method of manufacturing a common electrode substrate using the same | SAMSUNG ELECTRONICS CO LTD | 2011-09-28 | — | — | CN | disclosed |
| CN-102186815-A | Sulfonium derivatives and the use therof as latent acids | BASF SE | 2011-09-14 | — | — | CN | disclosed |
| CN-102186904-A | Polyamide resin and composition thereof | NIPPON KAYAKU KK | 2011-09-14 | — | — | CN | disclosed |
| US-20110204528-A1 | POSTIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING RESIST PATTERN, AND ELECTRONIC COMPONENT | RESONAC CORPORATION (JP) | 2011-08-25 | — | — | US | disclosed |
| CN-101111803-B | Positive dry film photoresist and composition for preparing the same | KOLON INC | 2011-07-20 | — | — | CN | disclosed |
| CN-1828416-B | Photosensitive resin composition | DONGJIN SEMICHEM CO LTD | 2011-06-15 | — | — | CN | disclosed |
| CN-1975574-B | Radiation sensitive resin composition | SUMITOMO CHEMICAL CO | 2011-06-15 | — | — | CN | disclosed |
| US-20110135891-A1 | FILM TYPE PHOTODEGRADABLE TRANSFER MATERIAL | KOLON INDUSTRIES, INC. (KR) | 2011-06-09 | — | — | US | disclosed |
| CN-102087473-A | Radiation sensitive resin composition, interlayer dielectric, and method for producing thereof | JSR CORP | 2011-06-08 | — | — | CN | disclosed |
| EP-2328027-A1 | POSITIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING RESIST PATTERN, AND ELECTRONIC COMPONENT | Hitachi Chemical Company, Ltd. (JP) | 2011-06-01 | — | — | EP | disclosed |
| CN-102053497-A | Positive type radiation-sensitive resin composition, inter-layer insulating film and method for forming the same | JSR CORP | 2011-05-11 | — | — | CN | disclosed |
| CN-102056913-A | Sulfonium derivatives and the use thereof as latent acids | BASF SE | 2011-05-11 | — | — | CN | disclosed |
| CN-102047180-A | Film type photodegradable transfer material | KOLON INC | 2011-05-04 | — | — | CN | disclosed |
| US-7932012-B2 | Polymer (polyimide or polybenzoxazole precursor) having an acid functional group, a compound having substituent(s) derived from an amine functional group as chain extender, a photoreactive compound, and a solvent; surface protecting film or interlayer dielectric for semiconductor device | HITACHI CHEMICAL DUPONT MICROSYSTEMS LTD. (JP) | 2011-04-26 | — | — | US | disclosed |
| CN-102026967-A | Sulphonium salt initiators | CIBA HOLDING INC | 2011-04-20 | — | — | CN | disclosed |
| US-20110081613-A1 | RADIATION-SENSITIVE RESIN COMPOSITION | NAGASE CHEMTEX CORPORATION (JP) | 2011-04-07 | — | — | US | disclosed |
| US-20110076458-A1 | PHOTOSENSITIVE POLYMER COMPOSITION, METHOD OF FORMING RELIEF PATTERNS, AND ELECTRONIC EQUIPMENT | NUNOMURA MASATAKA | 2011-03-31 | — | — | US | disclosed |
| CN-101971096-A | Radiation-sensitive resin composition | NAGASE CHEMTEX CORP | 2011-02-09 | — | — | CN | disclosed |
| US-20110027544-A1 | Resin composition for insulating film or surface-protective film of electronic components, method for producing pattern-cured film and electronic components | HITACHI CHEMICAL DUPONT MICROSYSTEMS, LTD. (JP) | 2011-02-03 | — | — | US | disclosed |
| CN-101116036-B | Positive photoresist composition | SAMYANGEMS CO LTD | 2011-02-02 | — | — | CN | disclosed |
| CN-101952248-A | Sulphonium salt initiators | BASF SE | 2011-01-19 | — | — | CN | disclosed |
| CN-101952269-A | Sulphonium salt initiators | BASF SE | 2011-01-19 | — | — | CN | disclosed |
| EP-2270595-A1 | RADIATION-SENSITIVE RESIN COMPOSITION | Nagase ChemteX Corporation (JP) | 2011-01-05 | — | — | EP | disclosed |
| WO-2010143701-A1 | CONDUCTIVE COMPOSITION, TRANSPARENT CONDUCTIVE FILM, DISPLAY ELEMENT AND INTEGRATED SOLAR BATTERY | FUJIFILM CORPORATION (JP) | 2010-12-16 | — | — | WO | disclosed |
| CN-1716094-B | Radiation sensitive resin composition | SUMITOMO CHEMICAL CO | 2010-12-15 | — | — | CN | disclosed |
| US-7851128-B2 | Photosensitive polymer composition, method of forming relief patterns, and electronic equipment | HITACHI CHEMICAL DUPONT MICROSYSTEMS LTD. (JP) | 2010-12-14 | — | — | US | disclosed |
| CN-1800981-B | Photosensitive resin composition, thin film panel made with photosensitive composition, and method for manufacturing thin film panel | SAMSUNG ELECTRONICS CO LTD | 2010-12-01 | — | — | CN | disclosed |
| CN-1760757-B | Radioactivity sensitive resin composition | SUMITOMO CHEMICAL CO | 2010-11-10 | — | — | CN | disclosed |
| CN-1760758-B | Radioactivity sensitive resin composition | SUMITOMO CHEMICAL CO | 2010-11-03 | — | — | CN | disclosed |
| US-20100258336-A1 | POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR FORMING PATTERN, ELECTRONIC COMPONENT | HITACHI CHEMICAL DUPONT MICROSYSTEMS, LTD. (JP) | 2010-10-14 | — | — | US | disclosed |
| CN-101859067-A | Radiation sensitive resin composition, interlayer dielectric and forming method thereof | JSR CORP | 2010-10-13 | — | — | CN | disclosed |
| US-20100227126-A1 | POSITIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING PATTERNS, AND ELECTRONIC PARTS | HITACHI CHEMICAL DUPONT MICROSYSTEMS, LTD. (JP) | 2010-09-09 | — | — | US | disclosed |
| US-7790345-B2 | Positive type dry film photoresist | KOLON INDUSTRIES, INC. (KR) | 2010-09-07 | — | — | US | disclosed |
| CN-101817734-A | 2, 2', 3, 4, 4'-pentahydroxy benzophenone lead (II) and copper (II) binuclear chelate and preparation method thereof | UNIV SHENZHEN | 2010-09-01 | — | — | CN | disclosed |
| EP-2221666-A1 | POSITIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCTION OF RESIST PATTERN, SEMICONDUCTOR DEVICE, AND ELECTRONIC DEVICE | Hitachi Chemical Company, Ltd. (JP) | 2010-08-25 | — | — | EP | disclosed |
| CN-1702554-B | Photosensitive resin composition | DONGJIN SIMIKEN CO LTD | 2010-08-18 | — | — | CN | disclosed |
| CN-101809502-A | Thick film resists | AZ ELECTRONIC MATERIALS USA | 2010-08-18 | — | — | CN | disclosed |
| CN-1898605-B | Radiation-sensitive resin composition, interlayer insulating film, microlens, and method for producing the same | JSR CORP | 2010-08-18 | — | — | CN | disclosed |
| CN-101788767-A | Radiation sensitive linear resin composition and interlayer dielectric and manufacture method thereof | JSR KK | 2010-07-28 | — | — | CN | disclosed |
| EP-2203783-A2 | THICK FILM RESISTS | AZ Electronic Materials USA Corp. (US) | 2010-07-07 | — | — | EP | disclosed |
| CN-101727002-A | Radiation-sensitive resin composition, interlayer insulating film and microlens, and method for forming the same | JSR CORP | 2010-06-09 | — | — | CN | disclosed |
| US-20100092879-A1 | PHOTOSENSITIVE RESIN COMPOSITION, PROCESS FOR PRODUCING PATTERNED HARDENED FILM WITH USE THEREOF AND ELECTRONIC PART | HITACHI CHEMICAL DUPONT MICROSYSTEMS, LTD. (JP) | 2010-04-15 | — | — | US | disclosed |
| US-20100080963-A1 | PHOTOSENSITIVE RESIN COMPOSITION, POLYMER COMPOUND, METHOD OF FORMING A PATTERN, AND ELECTRONIC DEVICE | FUJIFILM CORPORATION (JP) | 2010-04-01 | — | — | US | disclosed |
| CN-101652714-A | Photosensitive resin composition | NIPPON KAYAKU KK JP | 2010-02-17 | — | — | CN | disclosed |
| CN-101630125-A | Film transfer material | KOLON INC | 2010-01-20 | — | — | CN | disclosed |
| US-7638254-B2 | Positive photosensitive resin composition, method for forming pattern, and electronic part | HITACHI CHEMICAL DUPONT MICROSYSTEMS LTD (JP) | 2009-12-29 | — | — | US | disclosed |
| EP-2133743-A1 | PHOTOSENSITIVE RESIN COMPOSITION, PROCESS FOR PRODUCING PATTERNED HARDENED FILM WITH USE THEREOF AND ELECTRONIC PART | Hitachi Chemical DuPont Microsystems, Ltd. (JP) | 2009-12-16 | — | — | EP | disclosed |
| WO-2009145520-A2 | FILM TYPE PHOTODEGRADABLE TRANSFER MATERIAL | KOLON INDUSTRIES, INC. (KR) | 2009-12-03 | — | — | WO | disclosed |
| CN-100565310-C | Method for preparing array plate for display | KOLON INC (KR) | 2009-12-02 | — | — | CN | disclosed |
| CN-101581883-A | Positive photoresist, insulation layer and organic light emitting diode | COLON CO LTD (KR) | 2009-11-18 | — | — | CN | disclosed |
| US-7615324-B2 | Photosensitive composition, and cured relief pattern production method and semiconductor device using the same | FUJIFILM CORPORATION (JP) | 2009-11-10 | — | — | US | disclosed |
| CN-100557509-C | Photosensitive resin composition for photoresist | DONGJIN SEMICHEM CO LTD (KR) | 2009-11-04 | — | — | CN | disclosed |
| CN-101566796-A | Low temperature curing light-sensitive resin composition | DONGJIN SEMICHEM CO LTD (KR) | 2009-10-28 | — | — | CN | disclosed |
| US-20090263745-A1 | POLYIMIDE PRECURSOR, RESIN COMPOSITION COMPRISING THE POLYIMIDE PRECURSOR, PATTERN FORMING METHOD USING THE RESIN COMPOSITION, AND ARTICLES PRODUCED BY USING THE RESIN COMPOSITION | DAI NIPPON PRINTING CO., LTD. (JP) | 2009-10-22 | — | — | US | disclosed |
| CN-100552546-C | Be used for the substrate adhesion promoter of photosensitive resin composition and the photosensitive resin composition that comprises this promoter | AZ ELECTRONIC MATERIALS K K (JP) | 2009-10-21 | — | — | CN | disclosed |
| CN-100547486-C | The photosensitive resin composition | AZ ELECTRONIC MATERIALS JAPAN (JP) | 2009-10-07 | — | — | CN | disclosed |
| US-7598009-B2 | Photosensitive resin composition, production method for cured relief pattern using it, and semiconductor device | FUJIFILM CORPORATION (JP) | 2009-10-06 | — | — | US | disclosed |
| CN-101546127-A | Radiation sensitive resin composition, interlayer insulation film and method for manufacturing micro-lens | JSR CORP | 2009-09-30 | — | — | CN | disclosed |
| CN-101535895-A | Photosensitive resin composition and flexible printed wiring board using the same | ASAHI CHEMICAL IND PI R & D CO (JP) | 2009-09-16 | — | — | CN | disclosed |
| CN-101515113-A | Radioactive ray sensibility resin composition, interlayer insulating film, microlens and method of forming the same | JSR CORP (JP) | 2009-08-26 | — | — | CN | disclosed |
| US-20090207287-A1 | Colored photosensitive composition, and color filter array and solid image pickup device using the same | SONY CORPORATION (JP) | 2009-08-20 | — | — | US | disclosed |
| US-20090207286-A1 | Colored photosensitive composition, and color filter array and solid image pickup device using the same | SONY CORPORATION (JP) | 2009-08-20 | — | — | US | disclosed |
| CN-101493652-A | Colored photosensitive composition, and color filter array and solid image pickup device using the same | SUMITOMO CHEMICAL CO (JP) | 2009-07-29 | — | — | CN | disclosed |
| CN-101493653-A | Colored photosensitive composition, and color filter array and solid image pickup device using the same | SUMITOMO CHEMICAL CO (JP) | 2009-07-29 | — | — | CN | disclosed |
| WO-2009083612-A2 | FLAVONOID AS MEANS FOR THE PROPHYLAXIS AND TREATMENT OF NEURODEGENERATIVE AND OTHER PROTEIN FOLDING-ABERRATION DISEASES | GROSCHUP MARTIN H (DE) | 2009-07-09 | — | — | WO | disclosed |
| CN-101473268-A | Oxime sulfonates and the use therof as latent acids | CIBA HOLDING INC (CH) | 2009-07-01 | — | — | CN | disclosed |
| CN-101466777-A | Photosensitive, aqueous alkaline solution-soluble polyimide resin and photosensitive resin composition containing the same | NIPPON KAYAKU KK (JP) | 2009-06-24 | — | — | CN | disclosed |
| CN-101443704-A | Positive photosensitive resin composition and porous film obtained therefrom | NISSAN CHEMICAL IND LTD (JP) | 2009-05-27 | — | — | CN | disclosed |
| CN-100475798-C | Sulfonate derivatives and the use therof as latent acids | CIBA SC HOLDING AG (CH) | 2009-04-08 | — | — | CN | disclosed |
| WO-2009040661-A2 | THICK FILM RESISTS | AZ ELECTRONIC MATERIALS USA CORP. (DE) | 2009-04-02 | — | — | WO | disclosed |
| EP-1376231-B1 | Photosensitive polymer composition, method of forming relief patterns, and electronic equipment | HITACHI CHEM DUPONT MICROSYS (JP) | 2009-04-01 | — | — | EP | disclosed |
| CN-100472330-C | Bilayer laminate and patterning method using the same | JSR CORP (JP) | 2009-03-25 | — | — | CN | disclosed |
| CN-101387829-A | Radiation-sensitive resin composition | SUMITOMO CHEMICAL CO (JP) | 2009-03-18 | — | — | CN | disclosed |
| US-20090035693-A1 | PHOTOSENSITIVE RESIN COMPOSITION, PRODUCTION METHOD FOR CURED RELIEF PATTERN USING IT, AND SEMICONDUCTOR DEVICE | FUJIFILM CORPORATION (JP) | 2009-02-05 | — | — | US | disclosed |
| CN-101359174-A | Radiation-sensitive resin composition, layer insulation film and microlens and manufacture method thereof | JSR CORP (JP) | 2009-02-04 | — | — | CN | disclosed |
| CN-101359175-A | Photoresist compistion | SUMITOMO CHEMICAL CO (JP) | 2009-02-04 | — | — | CN | disclosed |
| EP-2016463-A1 | COMPOSITION FOR POSITIVE TYPE PHOTORESIST AND POSITIVE TYPE PHOTORESIST FILM MANUFACTURED THEREBY | KOLON INDUSTRIES, INC. (KR) | 2009-01-21 | — | — | EP | disclosed |
| US-20090011364-A1 | POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR FORMING PATTERN, AND ELECTRONIC PART | HATTORI TAKASHI | 2009-01-08 | — | — | US | disclosed |
| CN-100445846-C | Photosensitive resin composition for photoresist | DONGJIN SEMICHEM CO LTD (KR) | 2008-12-24 | — | — | CN | disclosed |
| CN-101324755-A | Radiation sensitive resin composition, interlayer dielectric and microlens, and method for producing thereof | JSR CORP (JP) | 2008-12-17 | — | — | CN | disclosed |
| CN-101308327-A | Radiation-sensed resin composition, layer insulation film, microlens and forming method thereof | JSR CORP (JP) | 2008-11-19 | — | — | CN | disclosed |
| US-7435525-B2 | Positive photosensitive resin composition, method for forming pattern, and electronic part | HITACHI CHEMICAL DUPONT MICROSYSTEMS LTD. (JP) | 2008-10-14 | — | — | US | disclosed |
| US-20080237553-A1 | Colored photosensitive resin composition, and color filter array and solid-state image pickup device using the same | SUMITOMO CHEMICAL COMPANY, LIMITED | 2008-10-02 | — | — | US | disclosed |
| US-20080237554-A1 | Colored photosensitive resin composition, and color filter array and solid-state image pickup device using the same | SUMITOMO CHEMICAL COMPANY LIMITED | 2008-10-02 | — | — | US | disclosed |
| CN-101276146-A | Colored photosensitive resin composition, and color filter array and solid-state image pickup device using the same | SUMITOMO CHEMICAL CO (JP) | 2008-10-01 | — | — | CN | disclosed |
| CN-101276145-A | Colored photosensitive resin composition, and color filter array and solid-state image pickup device using the same | SUMITOMO CHEMICAL CO (JP) | 2008-10-01 | — | — | CN | disclosed |
| US-20080233513-A1 | Heat-Resistant Photosensitive Resin Composition, Method For Forming Pattern Using the Composition, and Electronic Part | HITACHI CHEMICAL DUPONT MICROSYSTEMS LTD. (JP) | 2008-09-25 | — | — | US | disclosed |
| US-20080227024-A1 | PHOTOSENSITIVE COMPOSITION, AND CURED RELIEF PATTERN PRODUCTION METHOD AND SEMICONDUCTOR DEVICE USING THE SAME | FUJIFILM CORPORATION (JP) | 2008-09-18 | — | — | US | disclosed |
| EP-1970761-A1 | Photosensitive composition, and cured relief pattern production method and semiconductor device using the same | FUJIFILM Corporation (JP) | 2008-09-17 | — | — | EP | disclosed |
| US-20080220222-A1 | Photosensitive Polymer Composition, Method of Producing Pattern and Electronic Parts | HITACHI CHEMICAL DUPONT MICROSYSTEMS LTD. (JP) | 2008-09-11 | — | — | US | disclosed |
| CN-101253449-A | Photosensitive resin composition and photosensitive element | HITACHI CHEMICAL CO LTD (JP) | 2008-08-27 | — | — | CN | disclosed |
| CN-101231465-A | Two-layer film and method of forming pattern by using the same | JSR CORP (JP) | 2008-07-30 | — | — | CN | disclosed |
| CN-101226329-A | Radiation sensitive resin composition, laminated insulating film, micro lens and preparation method thereof | JSR CORP (JP) | 2008-07-23 | — | — | CN | disclosed |
| CN-101206401-A | Radiation sensitive resin composition, interlayer dielectric and microlens, and method for producing thereof | JSR CORP (JP) | 2008-06-25 | — | — | CN | disclosed |
| US-7368216-B2 | Photosensitive resin composition and manufacturing method of semiconductor device using the same | FUJIFILM CORPORATION (JP) | 2008-05-06 | — | — | US | disclosed |
| EP-1913444-A2 | PHOTORESIST COMPOSITION FOR IMAGING THICK FILMS | AZ Electronic Materials USA Corp. (US) | 2008-04-23 | — | — | EP | disclosed |
| CN-100383665-C | Onium salts and their use as latent acids | CIBA SC HOLDING AG (CH) | 2008-04-23 | — | — | CN | disclosed |
| US-20080090168-A1 | positive type photoresist resin film includes a support film and a thermosetting positive type photoresist resin layer laminated over the support film. The positive type photoresist resin layer contains alkali soluble resin, a diazide based photosensitive compound and a sensitivity enhancer | KOLON INDUSTRIES, INC (KR) | 2008-04-17 | — | — | US | disclosed |
| CN-101153121-A | Radiation-sensitive resin composition for spacer, spacer and method for forming the same | JSR CORP (JP) | 2008-04-02 | — | — | CN | disclosed |
| CN-101154041-A | Radiation sensitive resin composition, and formation of interlayer insulating film and microlens | JSR CORP (JP) | 2008-04-02 | — | — | CN | disclosed |
| CN-101154040-A | Photoresist composition, its coating method and method of forming photoresist pattern | AZ ELECTRONIC MATERIALS JAPAN (JP) | 2008-04-02 | — | — | CN | disclosed |
| US-20080076849-A1 | POLYBENZOXAZOLE PRECURSOR, PHOTOSENSITIVE RESIN COMPOSITION USING THE SAME, AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE | FUJIFILM CORPORATION (JP) | 2008-03-27 | — | — | US | disclosed |
| EP-1902019-A1 | SULPHONIUM SALT INITIATORS | CIBA SPECIALTY CHEMICALS HOLDING INC. Patent Departement (CH) | 2008-03-26 | — | — | EP | disclosed |
| US-7338737-B2 | Photosensitive resin composition, thin film panel made with photosensitive resin composition, and method for manufacturing thin film panel | SAMSUNG ELECTRONICS CO., LTD. (KR) | 2008-03-04 | — | — | US | disclosed |
| CN-101116036-A | Positive photoresist composition | SAMYANGEMS CO LTD (KR) | 2008-01-30 | — | — | CN | disclosed |
| CN-101111803-A | Positive dry film photoresist and composition for preparing the same | KOLON INC (KR) | 2008-01-23 | — | — | CN | disclosed |
| CN-101111798-A | Method for manufacturing array board for display device | KOLON INC (KR) | 2008-01-23 | — | — | CN | disclosed |
| CN-101097404-A | Homocercal chromatic radiation sensitive resin combination | SUMITOMO CHEMICAL CO (JP) | 2008-01-02 | — | — | CN | disclosed |
| CN-100351700-C | Radiation-sensitive resin composition | SUMITOMO CHEMICAL CO (JP) | 2007-11-28 | — | — | CN | disclosed |
| US-7297452-B2 | Alkali-soluble resin; a quinone diazide; and a mixture of surfactants including a 3-(perfluoroalkyl)-1,2-epoxypropane, reaction product between methylhydrobis(trimethylsiloxy)silane and polyalkylene glycol monoallyl ether preferably having a molecular weight from 200 to 500 and a 2nd ether silicone | SAMSUNG ELECTRONICS CO., LTD. (KR) | 2007-11-20 | — | — | US | disclosed |
| CN-101073035-A | Positive type dry film photoresist | KOLON INC (KR) | 2007-11-14 | — | — | CN | disclosed |
| CN-101073036-A | Positive type dry film photoresist and composition for preparing the same | KOLON INC (KR) | 2007-11-14 | — | — | CN | disclosed |
| EP-1852743-A1 | Method for manufacturing photosensitive resin composition and relief pattern using the same | FUJIFILM Corporation (JP) | 2007-11-07 | — | — | EP | disclosed |
| US-20070254243-A1 | METHOD FOR MANUFACTURING PHOTOSENSITIVE RESIN COMPOSITION AND RELIEF PATTERN USING THE SAME | FUJIFILM CORPORATION (JP) | 2007-11-01 | — | — | US | disclosed |
| US-20070254221-A1 | Akali-soluble resin, quinone diazide, surfactant mixture of a 3-perfluoroalkylpropane epoxide and polyethersilicones), and a solvent; high-quality display panels with uniformly-coated insulating layers. | SAMSUNG DISPLAY CO., LTD. (KR) | 2007-11-01 | — | — | US | disclosed |
| WO-2007119949-A1 | COMPOSITION FOR POSITIVE TYPE PHOTORESIST AND POSITIVE TYPE PHOTORESIST FILM MANUFACTURED THEREBY | KOLON INDUSTRIES, INC (KR) | 2007-10-25 | — | — | WO | disclosed |
| CN-101059651-A | Radiation sensitive resin composition, protrusion and spacer made therefrom and forming method for the protrusion and spacer, and liquid crystal display device | JSR CORP (JP) | 2007-10-24 | — | — | CN | disclosed |
| CN-101059653-A | Photosensitive resin composition | DONGJIN SEMICHEM CO LTD (KR) | 2007-10-24 | — | — | CN | disclosed |
| CN-101034260-A | Photosensitive resin composition | DONGJIN SEMICHEM CO LTD (KR) | 2007-09-12 | — | — | CN | disclosed |
| CN-101025567-A | Radiation-sensitive resin composition, method for forming spacer and spacer | JSR CORP (JP) | 2007-08-29 | — | — | CN | disclosed |
| US-20070189672-A1 | Method for Preparing Polymeric Optical Waveguide Device | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2007-08-16 | — | — | US | disclosed |
| US-20070172753-A1 | Photosensitive resin composition and manufacturing method of semiconductor device using the same | FUJIFILM CORPORATION (JP) | 2007-07-26 | — | — | US | disclosed |
| EP-1811340-A2 | Photosensitive resin composition and manufacturing method of semiconductor device using the same | Fujifilm Corporation (JP) | 2007-07-25 | — | — | EP | disclosed |
| CN-101002090-A | Method of printing a time-temperature indicator based on azo coupling reactions onto a substrate | CIBA SC HOLDING AG (CH) | 2007-07-18 | — | — | CN | disclosed |
| CN-1989455-A | Oxime derivatives and the use therof as latent acids | CIBA SC HOLDING AG (CH) | 2007-06-27 | — | — | CN | disclosed |
| CN-1983031-A | Photosensitive resin composition for organic light emitting diodes | DONGJIN SEMICHEM CO LTD (KR) | 2007-06-20 | — | — | CN | disclosed |
| CN-1975574-A | Radiation sensitive resin composition | SUMITOMO CHEMICAL CO (JP) | 2007-06-06 | — | — | CN | disclosed |
| CN-1320406-C | Method for forming thick resist pattern | CLARIANT INTERNATONAL LTD (JP) | 2007-06-06 | — | — | CN | disclosed |
| US-20070122733-A1 | Positive photosensitive resin composition, method for forming pattern, and electronic part | HITACHI CHEMICAL DUPONT MICROSYSTEMS LTD. (JP) | 2007-05-31 | — | — | US | disclosed |
| CN-1955843-A | Photonasty resin compositon | DONGJIN SIMIKEN CO LTD (KR) | 2007-05-02 | — | — | CN | disclosed |
| CN-1945432-A | Radiation sensitive resin composition, and formation of interlayer insulating film and microlens | JSR CORP (JP) | 2007-04-11 | — | — | CN | disclosed |
| US-20070072122-A1 | Photosensitive polymer composition, method of forming relief patterns, and electronic equipment | NUNOMURA MASATAKA | 2007-03-29 | — | — | US | disclosed |
| CN-1306337-C | Positively photosensitive resin composition | CLARIANT INT LTD (JP) | 2007-03-21 | — | — | CN | disclosed |
| CN-1916111-A | Organic composition, liquid crystal display including the same and method of manufacturing liquid crystal display | SAMSUNG ELECTRONICS CO LTD (KR) | 2007-02-21 | — | — | CN | disclosed |
| CN-1903942-A | Radiation sensitive resin composition | SUMITOMO CHEMICAL CO (JP) | 2007-01-31 | — | — | CN | disclosed |
| EP-1013650-B1 | Tetracarboxylic dianhydride, derivative and production thereof, polyimide precursor, polyimide, resin composition, photosensitive resin composition, method of forming relief pattern, and electronic part | HITACHI CHEM DUPONT MICROSYS (JP) | 2007-01-24 | — | — | EP | disclosed |
| US-7166410-B2 | Colored photosensitive resin composition and color filter comprising the same | SUMITOMO CHEMICAL COMPANY, LIMITED (JP) | 2007-01-23 | — | — | US | disclosed |
| WO-2007007176-A2 | PHOTORESIST COMPOSITION FOR IMAGING THICK FILMS | AZ ELECTRONIC MATERIALS USA CORP. (DE) | 2007-01-18 | — | — | WO | disclosed |
| EP-1744213-A1 | POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR FORMING PATTERN, AND ELECTRONIC COMPONENT | Hitachi Chemical DuPont Microsystems Ltd. (JP) | 2007-01-17 | — | — | EP | disclosed |
| CN-1898605-A | Radiation-sensitive resin composition, interlayer insulating film, microlens, and method for producing the same | JSR CORP (JP) | 2007-01-17 | — | — | CN | disclosed |
| WO-2007003507-A1 | SULPHONIUM SALT INITIATORS | CIBA SPECIALTY CHEMICALS HOLDING INC. (CH) | 2007-01-11 | — | — | WO | disclosed |
| CN-1881082-A | Radiation sensitive resin composition, protrusion and spacer made therefrom, and liquid crystal display device comprising them | JSR CORP (JP) | 2006-12-20 | — | — | CN | disclosed |
| US-7150947-B2 | Photosensitive polymer composition, method of forming relief patterns, and electronic equipment | HITACHI CHEMICAL DUPONT MICROSYSTEMS LTD. (JP) | 2006-12-19 | — | — | US | disclosed |
| CN-1873534-A | Photosensitive resin composition, method of manufacturing a thin-film transistor substrate, and method of manufacturing a common electrode substrate using the same | SAMSUNG ELECTRONICS CO LTD (KR) | 2006-12-06 | — | — | CN | disclosed |
| CN-1854895-A | Radiation sensitive resin composite, prominency formed therewith, separator and its producing method and liquid crystal display component | JSR CORP (JP) | 2006-11-01 | — | — | CN | disclosed |
| EP-1708026-A1 | PHOTOSENSITIVE POLYMER COMPOSITION, PROCESS FOR PRODUCING PATTERN, AND ELECTRONIC PART | Hitachi Chemical DuPont Microsystems Ltd. (JP) | 2006-10-04 | — | — | EP | disclosed |
| CN-1841193-A | X-ray sensitive resin composition, protruded body and barrier body formed thereby and liquid crystal display member containing the same | JSR CORP (JP) | 2006-10-04 | — | — | CN | disclosed |
| CN-1828416-A | Photosensitive resin composition | DONGJIN SEMICHEM CO LTD (KR) | 2006-09-06 | — | — | CN | disclosed |
| CN-1818778-A | Photosensitive resin composition, thin film panel and method for manufacturing thin film panel | SAMSUNG ELECTRONICS CO LTD (KR) | 2006-08-16 | — | — | CN | disclosed |
| US-20060177767-A1 | Photosensitive resin composition, thin film panel including a layer made from photosensitive resin composition, and method for manufacturing thin film panel | SAMSUNG ELECTRONICS CO., LTD. | 2006-08-10 | — | — | US | disclosed |
| CN-1808273-A | Photosensitive resin composition, thin film panel made with photosensitive resin composition, and method for manufacturing thin film panel | SAMSUNG ELECTRONICS CO LTD (KR) | 2006-07-26 | — | — | CN | disclosed |
| CN-1266544-C | Photosnesitive resin composition comprising quinonediazide sulfate ester compound | DONGJIN SEMICHEM CO LTD (KR) | 2006-07-26 | — | — | CN | disclosed |
| CN-1800981-A | Photosensitive resin composition, thin film panel made with photosensitive composition, and method for manufacturing thin film panel | SAMSUNG ELECTRONICS CO LTD (KR) | 2006-07-12 | — | — | CN | disclosed |
| US-20060141393-A1 | Alkali-soluble resin; a quinone diazide; and a mixture of surfactants including a 3-(perfluoroalkyl)-1,2-epoxypropane, reaction product between methylhydrobis(trimethylsiloxy)silane and polyalkylene glycol monoallyl ether preferably having a molecular weight from 200 to 500 and a 2nd ether silicone | SAMSUNG ELECTRONICS CO., LTD. | 2006-06-29 | — | — | US | disclosed |
| CN-1261822-C | Photosensitive resin composition for photoresist | DONGJIN SEMICHEM CO LTD (KR) | 2006-06-28 | — | — | CN | disclosed |
| US-20060131267-A1 | Photosensitive resin composition, thin film panel made with photosensitive resin composition, and method for manufacturing thin film panel | SAMSUNG DISPLAY CO., LTD. (KR) | 2006-06-22 | — | — | US | disclosed |
| CN-1771466-A | Substrate adhesion improver for photosensitive resin composition and photosensitive resin composition containing the same | AZ ELECTRONIC MATERIALS K K (JP) | 2006-05-10 | — | — | CN | disclosed |
| CN-1766732-A | Photosensitive resin composition for photoresist | DONGJIN SEMICHEM CO LTD (KR) | 2006-05-03 | — | — | CN | disclosed |
| CN-1768303-A | Photoresist composition | AZ ELECTRONIC MATERIALS USA (US) | 2006-05-03 | — | — | CN | disclosed |
| CN-1768302-A | Photoresist composition | AZ ELECTRONIC MATERIALS USA (US) | 2006-05-03 | — | — | CN | disclosed |
| CN-1766719-A | Photosensitive resin composition for photoresist | DONGJIN SEMICHEM CO LTD (KR) | 2006-05-03 | — | — | CN | disclosed |
| CN-1760758-A | Radioactivity sensitive resin composition | SUMITOMO CHEMICAL CO (JP) | 2006-04-19 | — | — | CN | disclosed |
| CN-1760756-A | Radioactivity sensitive resin composition | SUMITOMO CHEMICAL CO (JP) | 2006-04-19 | — | — | CN | disclosed |
| CN-1760757-A | Radioactivity sensitive resin composition | SUMITOMO CHEMICAL CO (JP) | 2006-04-19 | — | — | CN | disclosed |
| CN-1751269-A | Halogenated oxime derivatives and their use as latent acids | CIBA SC HOLDING AG (CH) | 2006-03-22 | — | — | CN | disclosed |
| EP-1614005-A2 | PHOTORESIST COMPOSITIONS | AZ Electronic Materials USA Corp. (US) | 2006-01-11 | — | — | EP | disclosed |
| CN-1716094-A | Radiation sensitive resin composition | SUMITOMO CHEM ENG (JP) | 2006-01-04 | — | — | CN | disclosed |
| CN-1717626-A | Pattern forming method using ultra-high heat-resistant positive photosensitive composition | AZ ELECTRONIC MATERIALS JAPAN (JP) | 2006-01-04 | — | — | CN | disclosed |
| CN-1714315-A | Coating property improver for photosensitive resin composition and photosensitive resin composition containing the same | AZ ELECTRONIC MATERIALS JAPAN (JP) | 2005-12-28 | — | — | CN | disclosed |
| CN-1702554-A | Light sensitive resin composition | DONGJIN SIMIKEN CO LTD (KR) | 2005-11-30 | — | — | CN | disclosed |
| CN-1226670-C | Photosensitive resin composition and method for improving dry etching resistance of the same | AZ ELECTRONIC MATERIAL CO LTD (JP) | 2005-11-09 | — | — | CN | disclosed |
| CN-1226669-C | Radiation-sensitive resin composition | AZ ELECTRONIC MATERIAL CO LTD (JP) | 2005-11-09 | — | — | CN | disclosed |
| US-6960420-B2 | Photosensitive resin composition, process for forming relief pattern, and electronic component | HITACHI CHEMICAL DUPONT MICROSYSTEMS LTD (JP) | 2005-11-01 | — | — | US | disclosed |
| CN-1223901-C | Positive photosensitive polyimide resin composition | NISSAN CHEMICAL IND LTD (JP) | 2005-10-19 | — | — | CN | disclosed |
| CN-1662853-A | Onium salts and their use as latent acids | CIBA SC HOLDING AG (CH) | 2005-08-31 | — | — | CN | disclosed |
| CN-1213343-C | Iodonium salt used as potential acid provider | CIBA SPECIATY CHEMICALS HOLDIN (CH) | 2005-08-03 | — | — | CN | disclosed |
| CN-1208686-C | Photosensitive composition | AZ ELECTRONIC MATERIALS JAPAN (JP) | 2005-06-29 | — | — | CN | disclosed |
| CN-1208684-C | Process for producing 1,2-naphthaquinone dinitride photosensitisers | TOYO GOSEI KOGYO KK (JP) | 2005-06-29 | — | — | CN | disclosed |
| CN-1208687-C | High-resolution photosnesiitve resin composition usable with I-line and method of forming patter | AZ ELECTRONIC MATERIALS JAPAN (JP) | 2005-06-29 | — | — | CN | disclosed |
| CN-1628268-A | Sulfonic acid derivatives and their use as latent acids | CIBA SC HOLDING AG (CH) | 2005-06-15 | — | — | CN | disclosed |
| US-6881529-B2 | Positive photoresist transfer material and method for processing surface of substrate using the transfer material | FUJI PHOTO FILM CO., LTD. (JP) | 2005-04-19 | — | — | US | disclosed |
| US-6861210-B2 | Resist remover composition | DONGJIN SEMICHEN CO., LTD. (KR) | 2005-03-01 | — | — | US | disclosed |
| CN-1187654-C | Radiation-sensitive resin composition | CLARIANT INT LTD (VG) | 2005-02-02 | — | — | CN | disclosed |
| EP-1497368-A1 | NOVOLAK RESIN MIXTURES AND PHOTOSENSITIVE COMPOSITIONS COMPRISING THE SAME | Clariant International Ltd. (CH) | 2005-01-19 | — | — | EP | disclosed |
| CN-1568444-A | Photosnesitive resin composition comprising quinonediazide sulfate ester compound | DONGJIN SEMICHEM CO LTD (KR) | 2005-01-19 | — | — | CN | disclosed |
| CN-1550893-A | Solidified resin pattern forming method | 住友化学工业株式会社 | 2004-12-01 | — | — | CN | disclosed |
| CN-1543591-A | Photosensitive resin composition for photoresist | 东进瑟弥侃株式会社 | 2004-11-03 | — | — | CN | disclosed |
| CN-1542548-A | Radiation-sensitive resin composition | 住友化学工业株式会社 | 2004-11-03 | — | — | CN | disclosed |
| WO-2004088424-A2 | PHOTORESIST COMPOSITIONS | AZ ELECTRONIC MATERIALS USA CORP. (US) | 2004-10-14 | — | — | WO | disclosed |
| CN-1170204-C | Radiation-sensitive resin composition | �������ؽ��ڣ�BVI������˾ | 2004-10-06 | — | — | CN | disclosed |
| CN-1170205-C | Radiation-sensitive resin composition for roll coating and roll coating method | �������ؽ��ڣ�BVI������˾ | 2004-10-06 | — | — | CN | disclosed |
| US-6797450-B2 | ALKALI-SOLUBLE RESIN HAVING NO EPOXY GROUP AND A 1,2-QUINONEDIAZIDE COMPOUND | JSR CORPORATION (JP) | 2004-09-28 | — | — | US | disclosed |
| US-20040170917-A1 | Method of forming thick resist pattern | AZ ELECTRONIC MATERIALS USA CORP. | 2004-09-02 | — | — | US | disclosed |
| US-20040152022-A1 | Resist remover composition | DONGJIN SEMICHEM CO., LTD. (KR) | 2004-08-05 | — | — | US | disclosed |
| CN-1518685-A | Method for forming thick resist pattern | ���Ͽع�����˾ | 2004-08-04 | — | — | CN | disclosed |
| US-20040142275-A1 | Photosensitive resin composition, process for forming relief pattern, and electronic component | HITACHI CHEMICAL DUPONT MICROSYSTEMS LTD. (JP) | 2004-07-22 | — | — | US | disclosed |
| US-20040131956-A1 | Colored photosensitive resin composition and color filter comprising the same | SONY CORPORATION (JP) | 2004-07-08 | — | — | US | disclosed |
| US-20040121249-A1 | Red-colored photosensitive composition and color filter comprising the same | SONY CORPORATION (JP) | 2004-06-24 | — | — | US | disclosed |
| EP-0851298-B1 | Use of a solvent mixture for roller coating a radiation sensitive composition | CLARIANT FINANCE BVI LTD (VG) | 2004-06-16 | — | — | EP | disclosed |
| CN-1503930-A | Bilayer laminate and patterning method using the same | ������ʱ����ʽ���� | 2004-06-09 | — | — | CN | disclosed |
| CN-1501167-A | Radiation-sensitive resin composition | 住友化学工业株式会社 | 2004-06-02 | — | — | CN | disclosed |
| US-20040029045-A1 | Photosensitive polymer composition, method of forming relief patterns, and electronic equipment | HITACHI CHEMICAL DUPONT MICROSYSTEMS L.L.C. | 2004-02-12 | — | — | US | disclosed |
| US-6689531-B2 | NOVOLAK PHOTORESISTS WITH IMPROVED ADHESION AT THE INTERFACE OF A SUBSTRATE; WET ETCHING, PHOTOSENSITIVITY, RESOLUTION AND HEAT RESISTANCE | SUMITOMO CHEMICAL COMPANY, LIMITED (JP) | 2004-02-10 | — | — | US | disclosed |
| CN-1468391-A | Positive photosensitive polyimide resin composition | �ղ���ѧ��ҵ��ʽ���� | 2004-01-14 | — | — | CN | disclosed |
| EP-1376231-A1 | Photosensitive polymer composition, method of forming relief patterns, and electronic equipment | Hitachi Chemical DuPont MicroSystems Ltd. (JP) | 2004-01-02 | — | — | EP | disclosed |
| US-6653043-B1 | Mixtures of photoresists, sensitizers and active materials such as silica sol modified by resorcin coupled to silanes, used to improve sensitivity and resolution | KANSAI RESEARCH INSTITUTE, INC. (JP) | 2003-11-25 | — | — | US | disclosed |
| WO-2003085045-A1 | NOVOLAK RESIN MIXTURES AND PHOTOSENSITIVE COMPOSITIONS COMPRISING THE SAME | CLARIANT INTERNATIONAL LTD (CH) | 2003-10-16 | — | — | WO | disclosed |
| US-6600053-B2 | Useful for producing polyimide precursors or polyimides having low thermal expansion and low residual stress | HITACHI CHEMICAL DUPONT MICROSYSTEMS LTD. (JP) | 2003-07-29 | — | — | US | disclosed |
| US-20030119957-A1 | Resist composition | SUMITOMO CHEMICAL COMPANY, LIMITED (JP) | 2003-06-26 | — | — | US | disclosed |
| EP-0997777-B1 | Photosensitive polymer composition, method for forming relief patterns, and electronic parts | HITACHI CHEM DUPONT MICROSYS (JP) | 2003-06-04 | — | — | EP | disclosed |
| EP-1312982-A1 | RADIATION-SENSITIVE COMPOSITION, INSULATING FILM AND ORGANIC EL DISPLAY ELEMENT | JSR Corporation (JP) | 2003-05-21 | — | — | EP | disclosed |
| US-20030087179-A1 | Positive photoresist transfer material and method for processing surface of substrate using the transfer material | FUJI PHOTO FILM CO., LTD. | 2003-05-08 | — | — | US | disclosed |
| EP-1028354-B1 | Positive photosensitive resin composition, method of forming relief pattern, and use of a relief pattern | HITACHI CHEM DUPONT MICROSYS (JP) | 2003-05-02 | — | — | EP | disclosed |
| US-20030054284-A1 | Radiation-sensitive composition, insulating film and organic el display element | JSR CORPORATION (JP) | 2003-03-20 | — | — | US | disclosed |
| US-6534235-B1 | Photosensitive resin and inorganic particles having a functional group obtained by a reaction between inorganic particles and a coupling agent | KANSAI RESEARCH INSTITUTE, INC. (JP) | 2003-03-18 | — | — | US | disclosed |
| CN-1401096-A | High resolution photosensitive resin composition for i-line and method of forming pattern | CLARIANT INT LTD (CH) | 2003-03-05 | — | — | CN | disclosed |
| US-6514658-B2 | Polyimide or precursor thereof soluble in alkaline solution, a photosensitive acid generator, and a compound having a phenolic hydroxyl group; positive-type, heat resistance | HITACHI CHEMICAL DUPONT MICROSYSTEMS, LTD. (JP) | 2003-02-04 | — | — | US | disclosed |
| CN-1386072-A | Method for forming protective coating | CLARIANT FINANCE JAPAN K K (JP) | 2002-12-18 | — | — | CN | disclosed |
| WO-2002095500-A1 | RESIST REMOVER COMPOSITION | DONGJIN SEMICHEM CO., LTD. (KR) | 2002-11-28 | — | — | WO | disclosed |
| US-6440632-B2 | FORMING PATTERN; EXPOSURE TO LIGHT | KANSAI RESEARCH INSTITUTE (JP) | 2002-08-27 | — | — | US | disclosed |
| US-6420081-B1 | APPLYING BACKING BEFORE PHOTOSENSITIVE LAYERS | AGFA-GEVAERT (BE) | 2002-07-16 | — | — | US | disclosed |
| US-6383708-B1 | ALKALI SOLUBLE NOVOLAK RESIN AN ESTER OF HYDROXYL GROUPS CONTAINING QUINONE DIAZIDE SULFONIC ACID AND SOLVENTS | SUMITOMO CHEMICAL COMPANY, LIMITED (JP) | 2002-05-07 | — | — | US | disclosed |
| CN-1343325-A | Photosensitive resin composition for roll coating and method of roll coating | CLARIANT INT LTD (CH) | 2002-04-03 | — | — | CN | disclosed |
| US-6365306-B2 | ADDING A DISSOLUTION INHIBITOR TO A POLYMER SOLUBLE IN AN AQUEOUS ALKALINE DEVELOPER AND A QUINONEDIAZIDE PHOTOSENSITIZER TO INCREASE THE SOLUBILITY DIFFERENCE BETWEEN THE EXPOSED AND UNEXPOSED PARTS; FINENESS; RESOLUTION; FILMS | HITACHI CHEMICAL DUPONT MICROSYSTEMS L.L.C. | 2002-04-02 | — | — | US | disclosed |
| US-20020037991-A1 | Photosensitive resin composition | HITACHI CHEMICAL DUPONT MICROSYSTEMS LTD. (JP) | 2002-03-28 | — | — | US | disclosed |
| US-20020028403-A1 | Process for the production of back-coating recording material for the production of offset printing plates | AGFA GRAPHICS NV (BE) | 2002-03-07 | — | — | US | disclosed |
| US-20020012867-A1 | PHOTOSENSITIVE RESIN COMPOSITION AND PROCESS FOR PRODUCING THE SAME | KRI, INC. (JP) | 2002-01-31 | — | — | US | disclosed |
| US-6340546-B1 | WHICH, ON HEATING, BECOME HEAT-RESISTANT POLYIMIDE POLYMERS SUITABLE FOR SURFACE-PROTECTING FILMS, INTERLAYER INSULATING FILMS | HITACHI CHEMICAL DUPONT MICROSYSTEMS LTD. (JP) | 2002-01-22 | — | — | US | disclosed |
| CN-1327547-A | Photosensitive composition | CLARIANT INT LTD (CH) | 2001-12-19 | — | — | CN | disclosed |
| US-6329494-B1 | HIGH-SPEED DEVELOPABILITY, HIGH RESOLUTION AND GOOD DIMENSIONAL ACCURACY TO SUIT THEM TO THE PRODUCTION OF INTERLAYER INSULATING FILMS OR SURFACE-PROTECTING FILMS IN SEMICONDUCTOR DEVICES | HITACHI CHEMICAL DUPONT MICROSYSTEMS LTD. (JP) | 2001-12-11 | — | — | US | disclosed |
| US-6329110-B1 | POSITIVES, POLYIMIDE SOLUBLE IN AN AQUEOUS ALKALINE SOLUTION; QUINONEDIAZIDE CAPABLE OF GENERATING AN ACID WHEN EXPOSED TO LIGHT; COMPOUND HAVING A PHENOLIC HYDROXYL GROUP; | HITACHI CHEMICAL DUPONT MICROSYSTEMS LTD (JP) | 2001-12-11 | — | — | US | disclosed |
| EP-1156370-A1 | Process for the production of back-coated recording material for the production of offset printing plates | Agfa-Gevaert (BE) | 2001-11-21 | — | — | EP | disclosed |
| CN-1322966-A | Process for producing 1,2-naphthaquinone dinitride photosensitisers | TOYO GOSEI KOGYO KK (JP) | 2001-11-21 | — | — | CN | disclosed |
| US-20010031419-A1 | Photosensitive polymer composition, method for forming relief patterns, and electronic parts | NUNOMURA MASATAKA (JP) | 2001-10-18 | — | — | US | disclosed |
| CN-1316068-A | Photosensitive resin composition and method for improving dry etching resistance of photosensitive resin composition | CLARIANT INT LTD (CH) | 2001-10-03 | — | — | CN | disclosed |
| EP-0392409-B1 | Photoresist composition | SUMITOMO CHEMICAL CO (JP) | 2001-09-05 | — | — | EP | disclosed |
| US-6274287-B1 | Positive resist compositions comprising a hydroxyphenyl ketone | SUMITOMO CHEMICAL COMPANY, LIMITED (JP) | 2001-08-14 | — | — | US | disclosed |
| CN-1306224-A | Iodonium salt used as potential acid provider | CIBA SPECIATY CHEMICALS HOLDIN (CH) | 2001-08-01 | — | — | CN | disclosed |
| US-20010009746-A1 | Photosensitive polymer composition, method for forming relief patterns, and electronic parts | NUNOMURA MASATAKA (JP) | 2001-07-26 | — | — | US | disclosed |
| US-6265129-B1 | FORM A RESIST PATTERN THAT HAD A MICRO-GROOVE IN EACH ELEMENT AND WHICH YET WAS SATISFACTORY IN FEATURE PROFILE AND RESOLUTION. | TOKYO OHKA KOGYO CO., LTD. (JP) | 2001-07-24 | — | — | US | disclosed |
| US-6245478-B1 | Resist composition | SUMITOMO CHEMICAL COMPANY, LIMITED (JP) | 2001-06-12 | — | — | US | disclosed |
| CN-1066746-C | Aromatic hydroxycarboxylic acid resin and use thereof | MITSUI CHEMICALS INC (JP) | 2001-06-06 | — | — | CN | disclosed |
| CN-1297542-A | Radiation-sensitive resin composition | CLARIANT INT LTD (CH) | 2001-05-30 | — | — | CN | disclosed |
| CN-1296024-A | Partial esterification products of aromatic hydroxy-carboxylic resin and use thereof | MITSUI CHEMICALS INC (JP) | 2001-05-23 | — | — | CN | disclosed |
| US-6232032-B1 | MIXTURE OF POLYBENZOXAZOLE AND POLYAMIDE | HITACHI CHEMICAL DUPONT MICROSYSTEMS L.L.C. | 2001-05-15 | — | — | US | disclosed |
| CN-1294703-A | Photosensitive resin compsn. | CLARIANT INT LTD (CH) | 2001-05-09 | — | — | CN | disclosed |
| EP-1096313-A1 | Active particle, photosensitive resin composition, and process for forming pattern | Kansai Research Institute, Inc. (JP) | 2001-05-02 | — | — | EP | disclosed |
| CN-1293772-A | Positively photosensitive resin composition | CLARIANT INT LTD (CH) | 2001-05-02 | — | — | CN | disclosed |
| CN-1290357-A | Positively photosensitive resin composition | CLARIANT INT LTD (CH) | 2001-04-04 | — | — | CN | disclosed |
| CN-1288529-A | Radiation-sensitive resin composition | CLARIANT INT LTD (CH) | 2001-03-21 | — | — | CN | disclosed |
| US-6140027-A | WATER SOLUBLE AMINE, POLAR ORGANIC SOLVENT, TRIAZOLE COMPOUND AND SILICONE SURFACTANT | DONGJIN SEMICHEM CO., LTD. (KR) | 2000-10-31 | — | — | US | disclosed |
| EP-1028354-A1 | Positive photosensitive resin composition, method of forming relief pattern, and electronic part | Hitachi Chemical DuPont MicroSystems Ltd. (JP) | 2000-08-16 | — | — | EP | disclosed |
| EP-1013650-A2 | Tetracarboxylic dianhydride, derivative and production thereof, polyimide precursor, polyimide, resin composition, photosensitive resin composition, method of forming relief pattern, and electronic part | Hitachi Chemical DuPont MicroSystems Ltd. (JP) | 2000-06-28 | — | — | EP | disclosed |
| EP-0997777-A1 | Photosensitive polymer composition, method for forming relief patterns, and electronic parts | Hitachi Chemical DuPont MicroSystems Ltd. (JP) | 2000-05-03 | — | — | EP | disclosed |
| EP-0557991-B1 | Positive type resist composition | SUMITOMO CHEMICAL CO (JP) | 2000-01-26 | — | — | EP | disclosed |
| EP-0962825-A1 | PHOTOSENSITIVE RESIN COMPOSITION AND PROCESS FOR PRODUCING THE SAME | Kansai Research Institute (KRI) (JP) | 1999-12-08 | — | — | EP | disclosed |
| EP-0961169-A1 | Photosensitive polymer composition, method for forming relief patterns, and electronic parts | Hitachi Chemical DuPont MicroSystems Ltd. (JP) | 1999-12-01 | — | — | EP | disclosed |
| EP-0550009-B1 | Positive resist composition | SUMITOMO CHEMICAL CO (JP) | 1999-06-02 | — | — | EP | disclosed |
| EP-0650091-B1 | Positive photoresist composition | SUMITOMO CHEMICAL CO (JP) | 1999-03-10 | — | — | EP | disclosed |
| EP-0461654-B1 | Radiation-sensitive positive resist composition | SUMITOMO CHEMICAL CO (JP) | 1999-02-17 | — | — | EP | disclosed |
| EP-0651893-B1 | HEXAHYDROXYBENZOPHENONE SULFONATE ESTERS OF DIAZONAPHTHOQUINONE SENSITIZERS AND POSITIVE PHOTORESISTS EMPLOYING SAME | CLARIANT FINANCE BVI LTD (VG) | 1999-01-20 | — | — | EP | disclosed |
| EP-0886183-A1 | Positive-working photoresist composition | Fuji Photo Film Co., Ltd. (JP) | 1998-12-23 | — | — | EP | disclosed |
| US-5849457-A | Positive-working quinonediazide sulfonic acid ester resist composition utilizing solvent system including 2-heptanone, ethyl lactate, and γ- | SUMITOMO CHEMICAL COMPANY, LIMITED (JP) | 1998-12-15 | — | — | US | disclosed |
| EP-0559204-B1 | Positive type resist composition | SUMITOMO CHEMICAL CO (JP) | 1998-09-30 | — | — | EP | disclosed |
| EP-0863436-A1 | Heat resistant photosensitive polymer composition, process for forming pattern and semiconductor device | HITACHI CHEMICAL CO., LTD. (JP) | 1998-09-09 | — | — | EP | disclosed |
| CN-1191993-A | Radiation sensitive composition adapted for roller coating | CLARIANT INT LTD (CH) | 1998-09-02 | — | — | CN | disclosed |
| CN-1191992-A | Radiation-sensitive composition adapted for roller coating | CLARIANT INT LTD (CH) | 1998-09-02 | — | — | CN | disclosed |
| US-5798422-A | USEFUL AS A COLOR-DEVELOPING SHEET IN ITS MULTIVALENT-METAL-MODIFIED FORM | MITSUI TOATSU CHEMICALS, INC. (JP) | 1998-08-25 | — | — | US | disclosed |
| EP-0851298-A1 | Radiation sensitive composition adapted for roller coating | CLARIANT INTERNATIONAL LTD. (CH) | 1998-07-01 | — | — | EP | disclosed |
| EP-0851297-A1 | Radiation-sensitive composition adapted for roller coating | CLARIANT INTERNATIONAL LTD. (CH) | 1998-07-01 | — | — | EP | disclosed |
| EP-0458988-B1 | POSITIVE RESIST COMPOSITION | SUMITOMO CHEMICAL CO (JP) | 1998-04-01 | — | — | EP | disclosed |
| EP-0480388-B1 | Light-sensitive litho printing plate requiring no dampening water | KONISHIROKU PHOTO IND (JP) | 1998-03-18 | — | — | EP | disclosed |
| US-5700620-A | POSITIVE PHOTORESIST HAVING HIGH RESOLUTION AND SMALL FILM THICKNESS DEPENDENCE | FUJI PHOTO FILM CO., LTD. (JP) | 1997-12-23 | — | — | US | disclosed |
| US-5695906-A | MIXTURE HAVING CONTROLLED AMOUNTS OF QUINONEDIAZIDE SULFONATES OF A NOVOLAK RESIN AND OF A HYDROXY BENZOPHENONE, FOR FORMING RESIST PATTERNS ON SEMICONDUCTOR SUBSTRATES | MITSUBISHI CHEMICAL CORPORATION (JP) | 1997-12-09 | — | — | US | disclosed |
| EP-0510671-B1 | Positive resist composition | SUMITOMO CHEMICAL CO (JP) | 1997-11-12 | — | — | EP | disclosed |
| EP-0525185-B1 | POSITIVE RESIST COMPOSITION | SUMITOMO CHEMICAL CO (JP) | 1997-07-16 | — | — | EP | disclosed |
| EP-0571989-B1 | Positive resist composition | SUMITOMO CHEMICAL CO (JP) | 1997-03-12 | — | — | EP | disclosed |
| US-5609982-A | Positive-working photoresist composition | FUJI PHOTO FILM CO., LTD. (JP) | 1997-03-11 | — | — | US | disclosed |
| EP-0742489-A1 | Positive-working resist composition | SUMITOMO CHEMICAL COMPANY LIMITED (JP) | 1996-11-13 | — | — | EP | disclosed |
| EP-0351849-B1 | Resist composition | SUMITOMO CHEMICAL CO (JP) | 1996-10-09 | — | — | EP | disclosed |
| EP-0510670-B1 | Positive resist composition | SUMITOMO CHEMICAL CO (JP) | 1996-09-25 | — | — | EP | disclosed |
| EP-0346808-B1 | Resist composition | SUMITOMO CHEMICAL CO (JP) | 1996-09-11 | — | — | EP | disclosed |
| EP-0341608-B1 | Resist composition, novel phenol compound and quinone diazide sulfonic acid ester of novel phenol compound | SUMITOMO CHEMICAL CO (JP) | 1996-09-11 | — | — | EP | disclosed |
| EP-0461388-B1 | Positive resist composition | SUMITOMO CHEMICAL CO (JP) | 1996-09-04 | — | — | EP | disclosed |
| EP-0460416-B1 | Positive resist composition | SUMITOMO CHEMICAL CO (JP) | 1996-08-21 | — | — | EP | disclosed |
| CN-1127763-A | Aromatic hydroxycarboxylic acid resin and use thereof | MITSUI TOATSU CHEMICALS (JP) | 1996-07-31 | — | — | CN | disclosed |
| EP-0239423-B1 | Positive type radiation-sensitive resin composition | JAPAN SYNTHETIC RUBBER CO LTD (JP) | 1996-03-20 | — | — | EP | disclosed |
| EP-0510726-B1 | Photoresist compositions comprising styryl compounds | SUMITOMO CHEMICAL CO (JP) | 1996-03-13 | — | — | EP | disclosed |
| EP-0571988-B1 | Positive resist composition | SUMITOMO CHEMICAL CO (JP) | 1996-01-10 | — | — | EP | disclosed |
| US-5468590-A | Positive resist composition | SUMITOMO CHEMICAL COMPANY, LIMITED (JP) | 1995-11-21 | — | — | US | disclosed |
| EP-0488686-B1 | A process of making naphthoquinone diazide esters using lactone solvents | HOECHST CELANESE CORP (US) | 1995-09-27 | — | — | EP | disclosed |
| US-5451484-A | Aromatic-aldehyde resin from high molecular weight phenolic compound with multiple benzene rings, production of integrated circuits | SUMITOMO CHEMICAL COMPANY, LTD. (JP) | 1995-09-19 | — | — | US | disclosed |
| US-5429904-A | Photoresist, aromatic-aldehyde resin, free of scum | SUMITOMO CHEMICAL COMPANY, LTD. (JP) | 1995-07-04 | — | — | US | disclosed |
| EP-0658807-A1 | Positive-working photoresist composition | FUJI PHOTO FILM CO., LTD. (JP) | 1995-06-21 | — | — | EP | disclosed |
| US-5424167-A | Sensitivity, resolution, heat resistance, adhesive | SUMITOMO CHEMICAL CO., LTD. (JP) | 1995-06-13 | — | — | US | disclosed |
| EP-0651893-A1 | HEXAHYDROXYBENZOPHENONE SULFONATE ESTERS OF DIAZONAPHTHOQUINONE SENSITIZERS AND POSITIVE PHOTORESISTS EMPLOYING SAME | HOECHST CELANESE CORPORATION (US) | 1995-05-10 | — | — | EP | disclosed |
| US-5413895-A | Photosensitive patterns | SUMITOMO CHEMICAL COMPANY, LIMITED (JP) | 1995-05-09 | — | — | US | disclosed |
| EP-0650091-A1 | Positive photoresist composition | SUMITOMO CHEMICAL COMPANY, LIMITED (JP) | 1995-04-26 | — | — | EP | disclosed |
| US-5395728-A | Containing alkali soluble novolak resin; improved heat resistance without sacrificing other propertes | CLARIANT FINANCE (BVI) LIMITED (VG) | 1995-03-07 | — | — | US | disclosed |
| US-5395727-A | Sensitivity, heat resistance, and film thickness retention | SUMITOMO CHEMICAL COMPANY, LIMITED (JP) | 1995-03-07 | — | — | US | disclosed |
| EP-0508269-B1 | Radiation-sensitive ester and process for its production | HOECHST AG (DE) | 1995-02-01 | — | — | EP | disclosed |
| EP-0369219-B1 | Light-sensitive compounds, preparation of a light-sensitive mixture therewith and a recording material | HOECHST AG (DE) | 1995-01-04 | — | — | EP | disclosed |
| US-5378586-A | Improved resolution, high film thickness, integrated circuits | SUMITOMO CHEMICAL COMPANY, LIMITED (JP) | 1995-01-03 | — | — | US | disclosed |
| EP-0287212-B1 | Positive photosensitive planographic printing plate | MITSUBISHI CHEM IND (JP) | 1994-12-28 | — | — | EP | disclosed |
| US-5374742-A | Improved sensitivity without deterioration of heat resistance and film thickness retention; hydroxy substituted spiro(cyclo-hexane-1,9'xanthene) compounds | SUMITOMO CHEMICAL COMPANY, LIMITED (JP) | 1994-12-20 | — | — | US | disclosed |
| US-5368987-A | Process for producing resist composition | SUMITOMO CHEMICAL CO., LTD. (JP) | 1994-11-29 | — | — | US | disclosed |
| US-5362598-A | Compositions for light sensitive elements with styryl dyes | SUMITOMO CHEMICAL CO., LTD. (JP) | 1994-11-08 | — | — | US | disclosed |
| US-5360696-A | Resist composition | SUMITOMO CHEMICAL CO., LTD. (JP) | 1994-11-01 | — | — | US | disclosed |
| US-5354644-A | Light absorbers for microlithography | SUMITOMO CHEMICAL COMPANY, LIMITED (JP) | 1994-10-11 | — | — | US | disclosed |
| US-5336583-A | Positive quinonediazide resist composition utilizing mixed solvent of ethyl lactate and 2-heptanone | SUMITOMO CHEMICAL COMPANY, LIMITED (JP) | 1994-08-09 | — | — | US | disclosed |
| US-5326665-A | Phenolic resin and quinonediazide compound | SUMITOMO CHEMICAL COMPANY, LIMITED (JP) | 1994-07-05 | — | — | US | disclosed |
| EP-0598320-A2 | Positive resist composition | SUMITOMO CHEMICAL COMPANY, LIMITED (JP) | 1994-05-25 | — | — | EP | disclosed |
| US-5300396-A | Process of making naphthoquinone diazide esters using lactone solvents | HOECHST CELANESE CORPORATION (US) | 1994-04-05 | — | — | US | disclosed |
| US-5294521-A | Forming patterns on semiconductor wafers | HOECHST CELANESE CORPORATION (US) | 1994-03-15 | — | — | US | disclosed |
| US-5290656-A | Positive photoresists | SUMITOMO CHEMICAL COMPANY, LIMITED (JP) | 1994-03-01 | — | — | US | disclosed |
| US-5290657-A | Improved sensitivity while maintaining heat resistance and film thickness retention | SUMITOMO CHEMICAL COMPANY, LIMITED (JP) | 1994-03-01 | — | — | US | disclosed |
| WO-1994002885-A1 | HEXAHYDROXYBENZOPHENONE SULFONATE ESTERS OF DIAZONAPHTHOQUINONE SENSITIZERS AND POSITIVE PHOTORESISTS EMPLOYING SAME | HOECHST CELANESE CORPORATION (US) | 1994-02-03 | — | — | WO | disclosed |
| US-5283324-A | Reacting phenol compound and quinone diazide sulfonyl halide in solvent mixtures of different dielectric constants | SUMITOMO CHEMICAL COMPANY, LIMITED (JP) | 1994-02-01 | — | — | US | disclosed |
| US-5283155-A | Better resolution | SUMITOMO CHEMICAL COMPANY, LIMITED (JP) | 1994-02-01 | — | — | US | disclosed |
| US-5268252-A | Polyol with o-naphthoquinone-2-diazide-4-sulfonic acid | HOECHST AKTIENGESELLSCHAFT (DE) | 1993-12-07 | — | — | US | disclosed |
| EP-0571989-A2 | Positive resist composition | SUMITOMO CHEMICAL COMPANY, LIMITED (JP) | 1993-12-01 | — | — | EP | disclosed |
| EP-0571988-A2 | Positive resist composition | SUMITOMO CHEMICAL COMPANY, LIMITED (JP) | 1993-12-01 | — | — | EP | disclosed |
| US-5260167-A | Containing a layer formed by irradiating a primer composition | KONICA CORPORATION (JP) | 1993-11-09 | — | — | US | disclosed |
| US-5256522-A | Image reversal negative working O-naphthoquinone diazide and cross-linking compound containing photoresist process with thermal curing | HOECHST CELANESE CORPORATION (US) | 1993-10-26 | — | — | US | disclosed |
| EP-0559204-A1 | Positive type resist composition | SUMITOMO CHEMICAL COMPANY, LIMITED (JP) | 1993-09-08 | — | — | EP | disclosed |
| EP-0557991-A1 | Positive type resist composition | SUMITOMO CHEMICAL COMPANY, LIMITED (JP) | 1993-09-01 | — | — | EP | disclosed |
| EP-0558102-A2 | Resist composition and process for producing the same | SUMITOMO CHEMICAL COMPANY, LIMITED (JP) | 1993-09-01 | — | — | EP | disclosed |
| EP-0323631-B1 | STYRYL COMPOUNDS, PROCESS FOR PREPARING THE SAME AND PHOTORESIST COMPOSITIONS COMPRISING THE SAME | SUMITOMO CHEMICAL COMPANY, LIMITED (JP) | 1993-08-11 | — | — | EP | disclosed |
| EP-0550009-A1 | Positive resist composition | SUMITOMO CHEMICAL COMPANY, LIMITED (JP) | 1993-07-07 | — | — | EP | disclosed |
| US-5218136-A | Light absorbers | SUMITOMO CHEMICAL COMPANY, LIMITED (JP) | 1993-06-08 | — | — | US | disclosed |
| US-5206348-A | Thermostability, high speed, heat resistance | MORTON INTERNATIONAL, INC. (US) | 1993-04-27 | — | — | US | disclosed |
| EP-0244763-B1 | POSITIVE-WORKING PHOTOSENSITIVE COMPOSITION AND PHOTOSENSITIVE RECORDING MATERIAL PREPARED THEREFROM | HOECHST CELANESE CORPORATION (US) | 1993-03-10 | — | — | EP | disclosed |
| EP-0528401-A1 | Positive resist composition | SUMITOMO CHEMICAL COMPANY, LIMITED (JP) | 1993-02-24 | — | — | EP | disclosed |
| US-5188920-A | Photosensitivity, resolution, heat resistance, adhesiveness | SUMITOMO CHEMICAL COMPANY, LIMITED (JP) | 1993-02-23 | — | — | US | disclosed |
| EP-0525185-A1 | POSITIVE RESIST COMPOSITION | SUMITOMO CHEMICAL COMPANY LIMITED (JP) | 1993-02-03 | — | — | EP | disclosed |
| US-5182183-A | Chemical resistance; printing durability | MITSUBISHI KASEI CORPORATION (JP) | 1993-01-26 | — | — | US | disclosed |
| US-5162510-A | Prepared by condensing phenolic compounds with a 1,2-naphthoquinonediazide-4-sulfonic acid halide and an organic acid halide | HOECHST CELANESE CORPORATION (US) | 1992-11-10 | — | — | US | disclosed |
| EP-0510726-A1 | Photoresist compositions comprising styryl compounds | SUMITOMO CHEMICAL COMPANY, LIMITED (JP) | 1992-10-28 | — | — | EP | disclosed |
| EP-0510671-A1 | Positive resist composition | SUMITOMO CHEMICAL COMPANY, LIMITED (JP) | 1992-10-28 | — | — | EP | disclosed |
| EP-0510670-A1 | Positive resist composition | SUMITOMO CHEMICAL COMPANY, LIMITED (JP) | 1992-10-28 | — | — | EP | disclosed |
| EP-0509431-A1 | Process for preparing radiation sensitive compound and positive resist composition | SUMITOMO CHEMICAL COMPANY, LIMITED (JP) | 1992-10-21 | — | — | EP | disclosed |
| EP-0508269-A1 | Radiation-sensitive ester and process for its production | HOECHST AKTIENGESELLSCHAFT (DE) | 1992-10-14 | — | — | EP | disclosed |
| EP-0504724-A1 | Positive resist composition | SUMITOMO CHEMICAL COMPANY, LIMITED (JP) | 1992-09-23 | — | — | EP | disclosed |
| EP-0271199-B1 | NOVOLAK RESIN FOR POSITIVE PHOTORESIST | SUMITOMO CHEMICAL COMPANY, LIMITED (JP) | 1992-09-09 | — | — | EP | disclosed |
| US-5130225-A | And alkali soluble resin, a quinone oxazide compound and a hydroxyl containing compound, film thickness retention | SUMITOMO CHEMICAL CO. LTD. (JP) | 1992-07-14 | — | — | US | disclosed |
| US-5124228-A | Based on hydroxy-substituted alkylbenzophenones | SUMITOMO CHEMICAL CO., LTD. (JP) | 1992-06-23 | — | — | US | disclosed |
| EP-0488686-A1 | A process of making naphthoquinone diazide esters using lactone solvents | HOECHST CELANESE CORPORATION (US) | 1992-06-03 | — | — | EP | disclosed |
| US-5114816-A | RADIATION-SENSITIVE COMPOUNDS, RADIATION-SENSITIVE MIXTURE PREPARED THEREWITH AND COPYING MATERIAL | HOECHST AKTIENGESELLSCHAFT (DE) | 1992-05-19 | — | — | US | disclosed |
| EP-0480388-A2 | Light-sensitive litho printing plate requiring no dampening water | KONICA CORPORATION (JP) | 1992-04-15 | — | — | EP | disclosed |
| EP-0244762-B1 | PHOTOSENSITIVE POSITIVE COMPOSITION AND PHOTOSENSITIVE REGISTRATION MATERIAL PREPARED THEREFROM | HOECHST CELANESE CORPORATION (US) | 1992-01-15 | — | — | EP | disclosed |
| EP-0243964-B1 | PHOTOSENSITIVE POSITIVE COMPOSITION AND PHOTOSENSITIVE REGISTRATION MATERIAL PREPARED THEREFROM | HOECHST CELANESE CORPORATION (US) | 1992-01-02 | — | — | EP | disclosed |
| EP-0461388-A1 | Positive resist composition | SUMITOMO CHEMICAL COMPANY, LIMITED (JP) | 1991-12-18 | — | — | EP | disclosed |
| EP-0461654-A2 | Radiation-sensitive positive resist composition | SUMITOMO CHEMICAL COMPANY, LIMITED (JP) | 1991-12-18 | — | — | EP | disclosed |
| EP-0460416-A1 | Positive resist composition | SUMITOMO CHEMICAL COMPANY, LIMITED (JP) | 1991-12-11 | — | — | EP | disclosed |
| EP-0459708-A2 | Image reversal negative working photoresist | HOECHST CELANESE CORPORATION (US) | 1991-12-04 | — | — | EP | disclosed |
| EP-0458988-A1 | POSITIVE RESIST COMPOSITION | SUMITOMO CHEMICAL COMPANY, LIMITED (JP) | 1991-12-04 | — | — | EP | disclosed |
| US-5059507-A | Which is sensitive to ultraviolet rays and x-rays | SUMITOMO CHEMICAL COMPANY, LIMITED (JP) | 1991-10-22 | — | — | US | disclosed |
| US-5035976-A | Photoresists, improved shelf life | HOECHST CELANESE CORPORATION (US) | 1991-07-30 | — | — | US | disclosed |
| JP-H02282745-A | POSITIVE TYPE PHOTORESIST COMPOSITION AND FINE PATTERN FORMING METHOD USING THE SAME COMPOSITION | TORAY IND INC | 1990-11-20 | — | — | JP | disclosed |
| EP-0392409-A1 | Photoresist composition | SUMITOMO CHEMICAL COMPANY, LIMITED (JP) | 1990-10-17 | — | — | EP | disclosed |
| EP-0384481-A1 | Positive photoresist composition and method for formation of resist pattern | Chisso Corporation (JP) | 1990-08-29 | — | — | EP | disclosed |
| US-4929536-A | Image reversal negative working O-napthoquinone diazide and cross-linking compound containing photoresist process with thermal curing | HOECHST CELANESE CORPORATION (US) | 1990-05-29 | — | — | US | disclosed |
| EP-0369219-A1 | Light-sensitive compounds, preparation of a light-sensitive mixture therewith and a recording material | HOECHST AKTIENGESELLSCHAFT (DE) | 1990-05-23 | — | — | EP | disclosed |
| EP-0363978-A2 | Resist composition | SUMITOMO CHEMICAL COMPANY, LIMITED (JP) | 1990-04-18 | — | — | EP | disclosed |
| US-4902785-A | Phenolic photosensitizers containing quinone diazide and acidic halide substituents | HOECHST CELANESE CORPORATION (US) | 1990-02-20 | — | — | US | disclosed |
| EP-0351849-A2 | Resist composition | SUMITOMO CHEMICAL COMPANY, LIMITED (JP) | 1990-01-24 | — | — | EP | disclosed |
| US-4892801-A | PHOTORESISTS | HOECHST CELANESE CORPORATION (US) | 1990-01-09 | — | — | US | disclosed |
| EP-0349301-A2 | Positive-type photoresist composition | MITSUBISHI KASEI CORPORATION (JP) | 1990-01-03 | — | — | EP | disclosed |
| EP-0346808-A2 | Resist composition | SUMITOMO CHEMICAL COMPANY, LIMITED (JP) | 1989-12-20 | — | — | EP | disclosed |
| EP-0342035-A2 | Powdered epoxy resin compositions | MINNESOTA MINING AND MANUFACTURING COMPANY (US) | 1989-11-15 | — | — | EP | disclosed |
| EP-0341608-A2 | Resist composition, novel phenol compound and quinone diazide sulfonic acid ester of novel phenol compound | SUMITOMO CHEMICAL COMPANY, LIMITED (JP) | 1989-11-15 | — | — | EP | disclosed |
| US-4863827-A | O-QUINONE DIAZIDE | AMERICAN HOECHST CORPORATION (US) | 1989-09-05 | — | — | US | disclosed |
| EP-0323631-A2 | Styryl compounds, process for preparing the same and photoresist compositions comprising the same | SUMITOMO CHEMICAL COMPANY, LIMITED (JP) | 1989-07-12 | — | — | EP | disclosed |
| US-4812551-A | CRESOL OR PHENOL, PRINTED CIRCUITS | SUMITOMO CHEMICAL COMPANY, LIMITED (JP) | 1989-03-14 | — | — | US | disclosed |
| EP-0287212-A1 | Positive photosensitive planographic printing plate | Mitsubishi Chemical Corporation (JP) | 1988-10-19 | — | — | EP | disclosed |
| EP-0271199-A2 | Novolak resin for positive photoresist | SUMITOMO CHEMICAL COMPANY, LIMITED (JP) | 1988-06-15 | — | — | EP | disclosed |
| EP-0264845-A2 | Multilayer positive-registration material | HOECHST CELANESE CORPORATION (US) | 1988-04-27 | — | — | EP | disclosed |
| US-4732836-A | SOLUTION STABILITY PHENOLIC COMPOUNDS CONDENSED WITH QUINONES | HOECHST CELANESE CORPORATION (US) | 1988-03-22 | — | — | US | disclosed |
| US-4732837-A | Novel mixed ester O-quinone photosensitizers | HOECHST CELANESE CORPORATION (US) | 1988-03-22 | — | — | US | disclosed |
| EP-0244762-A2 | Photosensitive positive composition and photosensitive registration material prepared therefrom | HOECHST CELANESE CORPORATION (US) | 1987-11-11 | — | — | EP | disclosed |
| EP-0244763-A2 | Positive-working photosensitive composition and photosensitive recording material prepared therefrom | HOECHST CELANESE CORPORATION (US) | 1987-11-11 | — | — | EP | disclosed |
| EP-0243964-A2 | Photosensitive positive composition and photosensitive registration material prepared therefrom | HOECHST CELANESE CORPORATION (US) | 1987-11-04 | — | — | EP | disclosed |
| EP-0227487-A2 | Positive type radiation-sensitive resin composition | JAPAN SYNTHETIC RUBBER CO., LTD. (JP) | 1987-07-01 | — | — | EP | disclosed |
| EP-0227487-A2 | Positive type radiation-sensitive resin composition | JAPAN SYNTHETIC RUBBER CO., LTD. (JP) | 1987-07-01 | — | — | EP | disclosed |
Patent text — is the patent's own abstract consistent with the prediction?
For each of this compound's patents that has machine-readable text (10 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.
| Patent | Title | Text reads most about | Predicted target · text-rank |
|---|---|---|---|
| US-11639325-B2 | Compositions of polyhydroxylated benzophenones and methods of treatment of neurodegenerative disorders | HDAC1, HDAC10, HDAC6 | HDAC1 1/4885SELL 4882/4885SELP 4697/4885 |
| US-20160046552-A1 | COMPOSITION CONTAINING VINYL-GROUP-CONTAINING COMPOUND | C5, C1S, C1R | HDAC1 891/4885SELL 4632/4885SELP 4502/4885 |
| US-11180438-B2 | Compositions of polyhydroxylated benzophenones and methods of treatment of neurodegenerative disorders | HDAC1, HDAC10, HDAC6 | HDAC1 1/4885SELL 4882/4885SELP 4697/4885 |
| US-20200087236-A9 | COMPOSITIONS OF POLYHYDROXYLATED BENZOPHENONES AND METHODS OF TREATMENT OF NEURODEGENERATIVE DISORDERS | HDAC1, HDAC10, HDAC6 | HDAC1 1/4885SELL 4882/4885SELP 4697/4885 |
| US-20180086717-A1 | HYDROGEN BARRIER AGENT, HYDROGEN BARRIER FILM FORMING COMPOSITION, HYDROGEN BARRIER FILM, METHOD FOR PRODUCING HYDROGEN BARRIER FILM, AND ELECTRONIC ELEMENT | SLC9A2, SLC9A1, NHERF1 | HDAC1 1322/4885SELL 4862/4885SELP 4362/4885 |
| US-20210171429-A1 | COMPOSITIONS OF POLYHYDROXYLATED BENZOPHENONES AND METHODS OF TREATMENT OF NEURODEGENERATIVE DISORDERS | HDAC1, HDAC10, HDAC6 | HDAC1 1/4885SELL 4882/4885SELP 4697/4885 |
| US-12547074-B2 | Photosensitive resin composition, method for producing patterned cured film, patterned cured film and semiconductor element | JMJD6, RARA, BCR | HDAC1 2473/4885SELL 2909/4885SELP 1065/4885 |
| US-10023540-B2 | Hydrogen barrier agent, hydrogen barrier film forming composition, hydrogen barrier film, method for producing hydrogen barrier film, and electronic element | SLC9A2, SLC9A1, NHERF1 | HDAC1 1322/4885SELL 4862/4885SELP 4362/4885 |
| US-20120115333-A1 | POLYBENZOXAZOLE PRECURSOR, PHOTOSENSITIVE RESIN COMPOSITION USING THE SAME, AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE | CD79B, BRIX1, SMARCB1 | HDAC1 2305/4885SELL 3760/4885SELP 1130/4885 |
| US-20090263745-A1 | POLYIMIDE PRECURSOR, RESIN COMPOSITION COMPRISING THE POLYIMIDE PRECURSOR, PATTERN FORMING METHOD USING THE RESIN COMPOSITION, AND ARTICLES PRODUCED BY USING THE RESIN COMPOSITION | TERB1, PUF60, CD79B | HDAC1 1516/4885SELL 4771/4885SELP 4543/4885 |
“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.