Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | FASN | P49327 | 2/20 | 0.74 |
| ▸ | KDM4E | B2RXH2 | 3/20 | 0.52 |
| ▸ | LMNA | P02545 | 3/20 | 0.52 |
| ▸ | TDP1 | Q9NUW8 | 3/20 | 0.52 |
| ▸ | HPGD | P15428 | 2/20 | 0.52 |
| ▸ | ALDH1A1 | P00352 | 2/20 | 0.52 |
| ▸ | MAPT | P10636 | 2/20 | 0.52 |
| ▸ | FUT7 | Q11130 | 2/20 | 0.52 |
| ▸ | CA12 | O43570 | 1/20 | 0.52 |
| ▸ | CA1 | P00915 | 1/20 | 0.52 |
| ▸ | CA2 | P00918 | 1/20 | 0.52 |
| ▸ | TP53 | P04637 | 1/20 | 0.52 |
| ▸ | CA3 | P07451 | 1/20 | 0.52 |
| ▸ | SELL | P14151 | 1/20 | 0.52 |
| ▸ | SELP | P16109 | 1/20 | 0.52 |
| ▸ | FUT4 | P22083 | 1/20 | 0.52 |
| ▸ | CA4 | P22748 | 1/20 | 0.52 |
| ▸ | CA6 | P23280 | 1/20 | 0.52 |
| ▸ | DPP4 | P27487 | 1/20 | 0.52 |
| ▸ | MAPK1 | P28482 | 1/20 | 0.52 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL9639010 | 0.85 | FASN (1.00) | FASNHPGDCA12CA1CA2 | |
| SCHEMBL21936687 | 0.83 | FASN (0.62) | FASNKDM4ELMNATDP1HPGD | |
| SCHEMBL21935566 | 0.82 | HDAC1 (0.62) | FASNKDM4ELMNATDP1HPGD | |
| SCHEMBL6272879 | 0.82 | FASN (0.75) | FASNKDM4ELMNATDP1HPGD | |
| SCHEMBL352369 | 0.82 | KDM4E (0.65) | FASNKDM4ELMNATDP1HPGD | |
| SCHEMBL21935531 | 0.80 | KDM4E (0.56) | FASNKDM4ELMNATDP1HPGD | |
| SCHEMBL3656921 | 0.80 | FASN (0.73) | FASNKDM4ELMNATDP1HPGD | |
| SCHEMBL21935910 | 0.79 | FASN (0.58) | FASNHPGDALDH1A1CA12CA1 | |
| SCHEMBL21935919 | 0.79 | FASN (0.58) | FASNKDM4ELMNATDP1HPGD | |
| SCHEMBL21935534 | 0.78 | FASN (0.62) | FASNKDM4ELMNATDP1HPGD |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 415 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-1798596-B1 | Positive photoresist composition | SHINETSU CHEMICAL CO (JP) | 2012-08-01 | — | — | EP | claimed |
| EP-2203783-A2 | THICK FILM RESISTS | AZ Electronic Materials USA Corp. (US) | 2010-07-07 | — | — | EP | claimed |
| WO-2009040661-A2 | THICK FILM RESISTS | AZ ELECTRONIC MATERIALS USA CORP. (DE) | 2009-04-02 | — | — | WO | claimed |
| US-20090081589-A1 | THICK FILM RESISTS | MERCK PATENT GMBH (DE) | 2009-03-26 | — | — | US | claimed |
| US-20030134222-A1 | Photoresist composition and method of forming pattern using the same | SAMSUNG ELECTRONICS CO., LTD. | 2003-07-17 | — | — | US | claimed |
| EP-4702010-A1 | PHOTOACTIVE COMPOUNDS | Merck Patent GmbH (DE) | 2026-03-04 | — | — | EP | disclosed |
| US-20250376552-A1 | RESIN COMPOSITION, CURED SUBSTANCE, LAMINATE, MANUFACTURING METHOD FOR CURED SUBSTANCE, MANUFACTURING METHOD FOR LAMINATE, MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE | FUJIFILM CORP (JP) | 2025-12-11 | — | — | US | disclosed |
| US-20250264801-A1 | RESIN COMPOSITION, CURED SUBSTANCE, LAMINATE, MANUFACTURING METHOD FOR CURED SUBSTANCE, MANUFACTURING METHOD FOR LAMINATE, MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE | FUJIFILM CORPORATION (JP) | 2025-08-21 | — | — | US | disclosed |
| EP-4596608-A1 | RESIN COMPOSITION, CURED PRODUCT, LAMINATE, METHOD FOR PRODUCING CURED PRODUCT, METHOD FOR PRODUCING LAMINATE, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE | FUJIFILM Corporation (JP) | 2025-08-06 | — | — | EP | disclosed |
| EP-4597225-A1 | FILM PRODUCTION METHOD, PHOTOSENSITIVE RESIN COMPOSITION, CURED PRODUCT PRODUCTION METHOD, CURED PRODUCT, AND LAMINATE | FUJIFILM Corporation (JP) | 2025-08-06 | — | — | EP | disclosed |
| EP-4596607-A1 | RESIN COMPOSITION, CURED OBJECT, LAYERED PRODUCT, METHOD FOR PRODUCING CURED OBJECT, METHOD FOR PRODUCING LAYERED PRODUCT, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE | FUJIFILM Corporation (JP) | 2025-08-06 | — | — | EP | disclosed |
| US-20250236697-A1 | RESIN COMPOSITION, CURED SUBSTANCE, LAMINATE, MANUFACTURING METHOD FOR CURED SUBSTANCE, MANUFACTURING METHOD FOR LAMINATE, MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE | FUJIFILM CORPORATION (JP) | 2025-07-24 | — | — | US | disclosed |
| EP-0443533-A2 | Positive photoresist composition | FUJI PHOTO FILM CO., LTD. (JP) | 1991-08-28 | — | — | EP | disclosed |
| EP-0435437-A1 | Positive resist composition | NIPPON ZEON CO., LTD. (JP) | 1991-07-03 | — | — | EP | disclosed |
| EP-0365318-A2 | Radiation-sensitive resin composition | JAPAN SYNTHETIC RUBBER CO., LTD. (JP) | 1990-04-25 | — | — | EP | disclosed |
| US-4883739-A | PHOTORESISTS | FUJI PHOTO FILM CO., LTD. (JP) | 1989-11-28 | — | — | US | disclosed |
| EP-0307951-A2 | Light-sensitive resin composition | FUJI PHOTO FILM CO., LTD. (JP) | 1989-03-22 | — | — | EP | disclosed |
| US-4801610-A | ANTIINFLAMMATORY | G. D. SEARLE & CO. (US) | 1989-01-31 | — | — | US | disclosed |
| US-4683241-A | ANTIINFLAMMATORY AGENTS ENZYME INHIBITORS | G. D. SEARLE & CO. (US) | 1987-07-28 | — | — | US | disclosed |
| EP-0227487-A2 | Positive type radiation-sensitive resin composition | JAPAN SYNTHETIC RUBBER CO., LTD. (JP) | 1987-07-01 | — | — | EP | disclosed |