SCHEMBL352369

SCHEMBL352369

O=C(c1cc(O)c(O)c(O)c1)c1cc(O)c(O)c(O)c1

nearest known ligand 0.68

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
KDM4E B2RXH2 3/20 0.65
LMNA P02545 3/20 0.65
TDP1 Q9NUW8 3/20 0.65
ALDH1A1 P00352 2/20 0.65
MAPT P10636 2/20 0.65
FUT7 Q11130 2/20 0.65
CA12 O43570 1/20 0.65
CA1 P00915 1/20 0.65
CA2 P00918 1/20 0.65
TP53 P04637 1/20 0.65
CA3 P07451 1/20 0.65
SELL P14151 1/20 0.65
HPGD P15428 1/20 0.65
SELP P16109 1/20 0.65
FUT4 P22083 1/20 0.65
CA4 P22748 1/20 0.65
CA6 P23280 1/20 0.65
DPP4 P27487 1/20 0.65
MAPK1 P28482 1/20 0.65
CA5A P35218 1/20 0.65

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Formamide SCHEMBL28235985 0.87 FASN (0.53) KDM4ELMNATDP1ALDH1A1MAPT
SCHEMBL21935531 0.86 KDM4E (0.56) KDM4ELMNATDP1ALDH1A1MAPT
SCHEMBL1738859 0.85 FASN (0.68) KDM4ELMNATDP1ALDH1A1MAPT
SCHEMBL10589365 0.85 FASN (0.62) KDM4ELMNATDP1ALDH1A1MAPT
SCHEMBL22156269 0.85 LMNA (0.68) KDM4ELMNATDP1ALDH1A1MAPT
SCHEMBL24040822 0.85 TTR (0.52) KDM4ELMNATDP1ALDH1A1MAPT
SCHEMBL15511901 0.82 TTR (0.54) KDM4ELMNATDP1ALDH1A1MAPT
SCHEMBL352504 0.82 FASN (0.74) KDM4ELMNATDP1ALDH1A1MAPT
SCHEMBL20533600 0.80 FASN (1.00) KDM4ETDP1ALDH1A1CA12CA1
SCHEMBL21935537 0.80 HDAC1 (0.64) KDM4ELMNATDP1ALDH1A1MAPT

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 60 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-112731765-B Fluorine-containing resin composition, preparation method thereof and preparation method of cured film containing fluorine-containing resin composition 西安瑞联新材料股份有限公司 2024-03-26 CN claimed
US-20230194984-A1 FLUORINE-CONTAINING RESIN COMPOSITION AND PREPARATION METHOD THEREOF, AND PREPARATION METHOD OF CURED FILM CONTAINING SAME XI'AN MANARECO NEW MATERIALS CO., LTD. (CN) 2023-06-22 US claimed
WO-2022142537-A1 FLUORINE-CONTAINING RESIN COMPOSITION, PREPARATION METHOD THEREFOR, AND PREPARATION METHOD FOR CURED FILM CONTAINING SAME 西安瑞联新材料股份有限公司 2022-07-07 WO claimed
US-6686120-B2 THERMAL ACID GENERATOR AND A METHOD OF FORMING A PATTERN USING THE SAME. THE PHOTORESIST COMPOSITION INCLUDES ABOUT 100 PARTS BY WEIGHT OF AN ALKALI-SOLUBLE ACRYL COPOLYMER, ABOUT 5-100 PARTS BY WEIGHT OF 1,2-QUINONEDIAZIDE COMPOUND, ABOUT SAMSUNG ELECTRONICS CO., LTD. (KR) 2004-02-03 US claimed
US-20030134222-A1 Photoresist composition and method of forming pattern using the same SAMSUNG ELECTRONICS CO., LTD. 2003-07-17 US claimed
JP-10324657-A None JP disclosed
US-12346025-B2 Fluorine-containing resin composition and preparation method thereof, and preparation method of cured film containing same XI'AN MANARECO NEW MATERIALS CO., LTD. (CN) 2025-07-01 US disclosed
CN-110286561-B Radiation-sensitive composition, cured film, and display element JSR株式会社 2025-06-03 CN disclosed
CN-110850680-B Curable composition, display element, and method for forming cured film JSR株式会社 2024-10-25 CN disclosed
US-12044969-B2 Resist underlayer film-forming composition NISSAN CHEMICAL CORPORATION (JP) 2024-07-23 US disclosed
US-12044969-B2 Resist underlayer film-forming composition NISSAN CHEMICAL CORPORATION (JP) 2024-07-23 US disclosed
CN-112731765-B Fluorine-containing resin composition, preparation method thereof and preparation method of cured film containing fluorine-containing resin composition 西安瑞联新材料股份有限公司 2024-03-26 CN disclosed
CN-102883607-A Compounds for the treatment of cancer GTX INC (US) 2013-01-16 CN disclosed
US-20120015300-A1 PHOTOSENSITIVE RESIN COMPOSITION RESONAC CORPORATION (JP) 2012-01-19 US disclosed
US-20110281040-A1 LIQUID CRYSTAL DISPLAY ELEMENT, POSITIVE TYPE RADIATION SENSITIVE COMPOSITION, INTERLAYER INSULATING FILM FOR LIQUID CRYSTAL DISPLAY ELEMENT, AND FORMATION METHOD THEREOF JSR CORPORATION (JP) 2011-11-17 US disclosed
US-7691915-B2 Photosensitive resin composition for forming organic insulating film and device using the same CHEIL INDUSTRIES INC. (KR) 2010-04-06 US disclosed
US-20080145786-A1 Photosensitive Resin Composition for Forming Organic Insulating Film and Device Using the Same CHEIL INDUSTRIES INC. (KR) 2008-06-19 US disclosed
US-6686120-B2 THERMAL ACID GENERATOR AND A METHOD OF FORMING A PATTERN USING THE SAME. THE PHOTORESIST COMPOSITION INCLUDES ABOUT 100 PARTS BY WEIGHT OF AN ALKALI-SOLUBLE ACRYL COPOLYMER, ABOUT 5-100 PARTS BY WEIGHT OF 1,2-QUINONEDIAZIDE COMPOUND, ABOUT SAMSUNG ELECTRONICS CO., LTD. (KR) 2004-02-03 US disclosed
US-20030134222-A1 Photoresist composition and method of forming pattern using the same SAMSUNG ELECTRONICS CO., LTD. 2003-07-17 US disclosed
JP-H10324657-A POLYHYDROXYBENZENE DERIVATIVE AND PREVENTIVE AND THERAPEUTIC AGENT FOR BONE/CARTILAGE DISEASE COMPRISING THE SAME HOECHST MARION ROUSSEL KK 1998-12-08 JP disclosed