SCHEMBL352720

SCHEMBL352720

Cc1cc(N(C)C)ccc1C(=O)O

nearest known ligand 0.49

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
SLC16A3 O15427 1/20 0.49
MAPT P10636 4/20 0.47
ALDH1A1 P00352 3/20 0.47
HPGD P15428 3/20 0.47
NPC1 O15118 3/20 0.46
MEN1 O00255 3/20 0.46
KMT2A Q03164 3/20 0.46
KDM4E B2RXH2 1/20 0.46
POLB P06746 1/20 0.46
RAB9A P51151 2/20 0.46
RXRB P28702 2/20 0.45
TP53 P04637 1/20 0.45
SMN1; SMN2 Q16637 1/20 0.45
RXRA P19793 1/20 0.44
LMNA P02545 2/20 0.43
GAA P10253 1/20 0.43
MYC P01106 2/20 0.42
MAOA P21397 1/20 0.41
MAOB P27338 1/20 0.41
CYP1A2 P05177 2/20 0.41

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL27658051 0.98 SLC16A3 (0.47) SLC16A3MAPTALDH1A1HPGDNPC1
Trolamine SCHEMBL5532895 0.87 SLC16A3 (0.40) SLC16A3MAPTALDH1A1HPGDNPC1
SCHEMBL30917334 0.86 ALDH1A1 (0.54) MAPTALDH1A1HPGDNPC1MEN1
SCHEMBL19737036 0.86 MAPT (0.54) SLC16A3MAPTALDH1A1HPGDNPC1
SCHEMBL10658386 0.85 ALDH1A1 (0.54) MAPTALDH1A1HPGDNPC1MEN1
SCHEMBL11111985 0.84 SLC16A3 (0.49) SLC16A3MAPTALDH1A1HPGDNPC1
SCHEMBL8646935 0.83 SLC16A3 (0.51) SLC16A3MAPTALDH1A1HPGDNPC1
SCHEMBL509222 0.82 MAPT (0.45) MAPTALDH1A1HPGDNPC1MEN1
SCHEMBL5342821 0.82 GPR52 (0.47) MAPTALDH1A1HPGDNPC1MEN1
SCHEMBL31332208 0.82 MAPT (0.45) SLC16A3MAPTALDH1A1HPGDNPC1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 330 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-116023895-B UV moisture dual-curing sealant and preparation method thereof 成都拓利科技股份有限公司 2025-02-18 CN claimed
US-11702571-B2 Adhesive sheet for temporary fixation and method of manufacturing semiconductor device using the same LG CHEM, LTD. (KR) 2023-07-18 US claimed
CN-116023895-A UV moisture dual-curing sealant and preparation method thereof 成都拓利科技股份有限公司 2023-04-28 CN claimed
EP-3750967-B1 ADHESIVE COMPOSITION LG CHEMICAL LTD (KR) 2023-03-08 EP claimed
CN-111836867-B Adhesive composition 株式会社LG化学 2022-09-30 CN claimed
CN-111225963-B Adhesive sheet for temporary fixation and method for manufacturing semiconductor device using the same 株式会社LG化学 2022-02-22 CN claimed
US-20210171802-A1 ADHESIVE SHEET FOR TEMPORARY FIXATION AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE USING THE SAME LG CHEM, LTD. (KR) 2021-06-10 US claimed
CN-111836867-A Adhesive composition 株式会社LG化学 2020-10-27 CN claimed
CN-111225963-A Adhesive sheet for temporary fixation and method for manufacturing semiconductor device using the same 株式会社LG化学 2020-06-02 CN claimed
US-9733563-B2 Photosensitive resin composition and photosensitive material comprising the same LG CHEM, LTD. (KR) 2017-08-15 US claimed
EP-2817379-B1 ADHESIVE FOR PRODUCING COMPOUND BODIES, PRIMARILY A PLASTIC-GLASS COMPOUND OR COMPOUND GLASS, FOR ARCHITECTURE AND CONSTRUCTION EVONIK ROEHM GMBH (DE) 2016-04-13 EP claimed
EP-2817379-A1 ADHESIVE FOR PRODUCING COMPOSITE BODIES, PREFERABLY OF A PLASTIC-GLASS COMPOSITE OR COMPOSITE GLASS, FOR ARCHITECTURE AND CONSTRUCTION Evonik Industries AG (DE) 2014-12-31 EP claimed
WO-2013124210-A1 ADHESIVE FOR PRODUCING COMPOSITE BODIES, PREFERABLY OF A PLASTIC-GLASS COMPOSITE OR COMPOSITE GLASS, FOR ARCHITECTURE AND CONSTRUCTION EVONIK INDUSTRIES AG (DE) 2013-08-29 WO claimed
US-8399176-B2 Photosensitive resin composition LG CHEM, LTD. (KR) 2013-03-19 US claimed
US-20100216073-A1 PHOTOSENSITIVE RESIN COMPOSITION LG CHEM, LTD. (KR) 2010-08-26 US claimed
US-6733849-B2 QUALITY, EFFICIENCY JSR CORPORATION (JP) 2004-05-11 US claimed
EP-0626431-B1 PHOTOCURABLE CONDUCTIVE COATING COMPOSITION SEKISUI CHEMICAL CO LTD (JP) 2000-01-26 EP claimed
US-5429846-A Antimony oxide-containing tin oxide powder, (meth) acrylate compound, acetal resin, photopolymerization initiator and organic solvent SEKISUI CHEMICAL CO., LTD. (JP) 1995-07-04 US claimed
EP-0626431-A1 PHOTOCURABLE CONDUCTIVE COATING COMPOSITION SEKISUI CHEMICAL CO., LTD. (JP) 1994-11-30 EP claimed
EP-0136186-B1 PHOTOCURABLE RESIN COMPOSITION MITSUI PETROCHEMICAL INDUSTRIES, LTD. (JP) 1989-09-06 EP claimed