SCHEMBL354160

SCHEMBL354160

C=C(CC)C(=O)OCCCCCC1CO1

nearest known ligand 0.44

Predicted protein targets (top 14)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 3/20 0.44
TSHR P16473 2/20 0.42
TDP1 Q9NUW8 2/20 0.36
NAAA Q02083 1/20 0.35
EPHX1 P07099 1/20 0.32
ENPP2 Q13822 1/20 0.32
LPAR2 Q9HBW0 1/20 0.32
SPHK2 Q9NRA0 2/20 0.31
SPHK1 Q9NYA1 1/20 0.31
POLB P06746 1/20 0.31
APEX1 P27695 1/20 0.31
HTT P42858 1/20 0.31
RAD52 P43351 1/20 0.31
NPSR1 Q6W5P4 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL29723519 0.94 ALDH1A1 (0.44) ALDH1A1TSHRTDP1NAAA
SCHEMBL352028 0.87 ALDH1A1 (0.46) ALDH1A1TSHR
SCHEMBL491230 0.84 ALDH1A1 (0.60) ALDH1A1TSHRTDP1EPHX1POLB
SCHEMBL353873 0.84 ALDH1A1 (0.60) ALDH1A1TSHRTDP1EPHX1POLB
SCHEMBL9481747 0.84 ALDH1A1 (0.60) ALDH1A1TSHRTDP1EPHX1POLB
SCHEMBL6663770 0.84 ALDH1A1 (0.60) ALDH1A1TSHRTDP1EPHX1POLB
SCHEMBL17690395 0.84 TSHR (0.53) ALDH1A1TSHRTDP1
SCHEMBL1357079 0.83 ALDH1A1 (0.62) ALDH1A1TSHRTDP1EPHX1POLB
SCHEMBL27926269 0.81 ALDH1A1 (0.43) ALDH1A1TSHRTDP1NAAAEPHX1
SCHEMBL29102695 0.80 TSHR (0.47) ALDH1A1TSHRTDP1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 275 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-117089014-B Acrylate copolymer, adhesive and protective film 江苏皇冠新材料科技有限公司 2024-01-26 CN claimed
CN-108572516-B Positive photosensitive resin composition, display device and pattern forming method thereof 株式会社东进世美肯 2023-10-17 CN claimed
EP-3969242-A1 METHOD FOR REPAIRING OR RECYCLING AN ELASTOMERIC FILM Synthomer Sdn. Bhd. (MY) 2022-03-23 EP claimed
US-10982061-B2 Photosensitive resin composition and display device including the same SAMSUNG DISPLAY CO., LTD. (KR) 2021-04-20 US claimed
US-20200102433-A1 PHOTOSENSITIVE RESIN COMPOSITION AND DISPLAY DEVICE INCLUDING THE SAME SAMSUNG DISPLAY CO., LTD. (KR) 2020-04-02 US claimed
US-10586956-B2 Pouch type secondary battery and method of manufacturing the same LG CHEM, LTD. (KR) 2020-03-10 US claimed
CN-104937491-B Photosensitive resin composition and method for forming pattern using the same 东进世美肯株式会社 2020-01-14 CN claimed
US-10079373-B2 Pouch type secondary battery and method of manufacturing the same LG CHEM, LTD. (KR) 2018-09-18 US claimed
US-20180190953-A1 POUCH TYPE SECONDARY BATTERY AND METHOD OF MANUFACTURING THE SAME LG CHEM, LTD. (KR) 2018-07-05 US claimed
EP-2866275-B1 POUCH-TYPE SECONDARY CELL AND METHOD FOR MANUFACTURING SAME LG CHEMICAL LTD (KR) 2018-01-03 EP claimed
EP-2848663-A1 COATING COMPOSITION WITH EXCELLENT TACTILE CHARACTERISTICS, PREPARATION METHOD THEREOF, AND TRANSFER SHEET USING SAME LG Hausys, Ltd. (KR) 2015-03-18 EP claimed
US-8962741-B2 Thermally curable resin composition for protective film LG CHEM, LTD. (KR) 2015-02-24 US claimed
US-20140377641-A1 POUCH TYPE SECONDARY BATTERY AND METHOD OF MANUFACTURING THE SAME LG ENERGY SOLUTION, LTD. (KR) 2014-12-25 US claimed
US-20140234776-A1 PHOTOSENSITIVE RESIN COMPOSITION AND METHOD OF FORMING PATTERN USING THE SAME SAMSUNG DISPLAY CO., LTD. (KR) 2014-08-21 US claimed
US-8563214-B2 Radiation sensitive resin composition and method of forming an interlayer insulating film SHARP CORPORATION (JP) 2013-10-22 US claimed
US-20120041120-A1 THERMALLY CURABLE RESIN COMPOSITION FOR PROTECTIVE FILM LG CHEM. LTD. (KR) 2012-02-16 US claimed
US-20120010350-A1 THERMALLY CURABLE RESIN COMPOSITION FOR PROTECTIVE FILM LG CHEM, LTD. (KR) 2012-01-12 US claimed
US-20060275700-A1 Photosensitive resin composition, method of manufacturing a thin-film transistor substrate, and method of manufacturing a common electrode substrate using the same SAMSUNG ELECTRONICS CO., LTD. 2006-12-07 US claimed
US-5530036-A STORAGE STABLE THERMOSETTING RESIN COMPOSITIONS JAPAN SYNTHETIC RUBBER CO., LTD. (JP) 1996-06-25 US claimed
US-5399604-A Thermosetting resin composition comprising /A/ copolymer of unsaturated carboxylic acid or anhydride, unsaturated compound with epoxy group, unsaturated carboxylic acid ester or other vinyl compound, /B/ organic solvent, /C/ silane coupler JAPAN SYNTHETIC RUBBER CO., LTD. (JP) 1995-03-21 US claimed