SCHEMBL356037

SCHEMBL356037

CSc1ccc(C2CN(C(=O)C(C)C)CCO2)cc1

nearest known ligand 0.41

Predicted protein targets (top 14)

geneUniProtsupporting neighboursconfidence
USP30 Q70CQ3 2/20 0.40
DPP4 P27487 1/20 0.39
DPP8 Q6V1X1 1/20 0.39
DPP9 Q86TI2 1/20 0.39
DPP7 Q9UHL4 1/20 0.39
PDE4B Q07343 1/20 0.38
ALDH1A1 P00352 2/20 0.37
TSHR P16473 1/20 0.36
MAPK1 P28482 1/20 0.36
SMN1; SMN2 Q16637 1/20 0.36
NAMPT P43490 1/20 0.35
DRD3 P35462 2/20 0.34
GLRA1 P23415 1/20 0.33
DGAT1 O75907 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL20236146 0.85 DRD3 (0.40) USP30PDE4BALDH1A1TSHRMAPK1
SCHEMBL21169302 0.84 USP30 (0.54) USP30NAMPTDRD3
SCHEMBL27838186 0.77 DRD3 (0.52) DRD3
SCHEMBL2424925 0.73 GLRA1 (0.45) DPP4DPP8DPP9DPP7ALDH1A1
SCHEMBL20665224 0.72 KRAS (0.44) USP30ALDH1A1SMN1; SMN2
SCHEMBL15228193 0.70 USP30 (0.51) USP30SMN1; SMN2DRD3
SCHEMBL24827579 0.70 MEN1 (0.48) PDE4B
SCHEMBL15864467 0.69 USP30 (0.41) USP30PDE4BSMN1; SMN2DRD3
SCHEMBL12468940 0.69 MAOB (0.44) USP30ALDH1A1DRD3
SCHEMBL17095010 0.69 CASP6 (0.45) USP30PDE4BSMN1; SMN2DRD3DGAT1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 74 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20250271758-A1 PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT, PRINTED WIRING BOARD, AND METHOD FOR PRODUCING PRINTED WIRING BOARD RESONAC CORPORATION (JP) 2025-08-28 US disclosed
US-12189290-B2 Photosensitive resin composition, dry film using same, printed wiring board, and printed wiring board manufacturing method RESONAC CORPORATION (JP) 2025-01-07 US disclosed
US-20240228840-A9 UV-Curable Adhesive Agent Composition, Adhesive Film Including Same, Polarization Film Including Same, and Display Device Including Polarization Film LG CHEM, LTD. (KR) 2024-07-11 US disclosed
WO-2024135741-A1 PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT, PRINTED WIRING BOARD, AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD 株式会社レゾナック 2024-06-27 WO disclosed
US-20240132760-A1 UV-Curable Adhesive Agent Composition, Adhesive Film Including Same, Polarization Film Including Same, and Display Device Including Polarization Film LG CHEM, LTD. (KR) 2024-04-25 US disclosed
US-11921424-B2 Photosensitive resin composition, dry film using same, printed wiring board, and printed wiring board manufacturing method Hitachi Chemical Company, Ltd. (FIPAS) (JP) 2024-03-05 US disclosed
EP-4276158-A1 UV-CURABLE ADHESIVE AGENT COMPOSITION, ADHESIVE FILM INCLUDING SAME, POLARIZATION FILM INCLUDING SAME, AND DISPLAY DEVICE INCLUDING POLARIZATION FILM Lg Chem, Ltd. (KR) 2023-11-15 EP disclosed
WO-2023214540-A1 PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT, PRINTED WIRING BOARD, AND METHOD FOR PRODUCING PRINTED WIRING BOARD 株式会社レゾナック 2023-11-09 WO disclosed
US-20230350292-A1 PHOTOSENSITIVE RESIN COMPOSITION, DRY FILM USING SAME, PRINTED WIRING BOARD, AND PRINTED WIRING BOARD MANUFACTURING METHOD RESONAC CORPORATION (JP) 2023-11-02 US disclosed
WO-2023153103-A1 PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT, PRINTED WIRING BOARD, AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD 株式会社レゾナック 2023-08-17 WO disclosed
US-20080026224-A1 Radiation curable inks MARKEM CORPORATION 2008-01-31 US disclosed
US-20070035594-A1 Ink supply system MARKEM CORPORATION 2007-02-15 US disclosed
US-20070035586-A1 Printing devices and related devices and methods MARKEM CORPORATION 2007-02-15 US disclosed
EP-1092740-B1 Ultraviolet curable resin compositions having enhanced shadow cure properties ROYAL ADHESIVES AND SEALANTS L (US) 2006-08-23 EP disclosed
US-6896937-B2 Radiation-curable inks MARKEM CORPORATION (US) 2005-05-24 US disclosed
US-20040132862-A1 Mixture of colroant, monomer and photoinitiator; forming images MARKEM-IMAJE CORPORATION 2004-07-08 US disclosed
EP-1216142-A4 THERMOFORMABLE OPHTHALMIC LENS NOVARTIS AG (CH) 2003-06-11 EP disclosed
EP-1216142-A1 THERMOFORMABLE OPHTHALMIC LENS Wesley Jessen Corporation (US) 2002-06-26 EP disclosed
EP-1092740-A1 Ultraviolet curable resin compositions having enhanced shadow cure properties RHEOX, INC. (US) 2001-04-18 EP disclosed
WO-2001005578-A1 THERMOFORMABLE OPHTHALMIC LENS WESLEY-JESSEN CORPORATION (US) 2001-01-25 WO disclosed