Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | GLRA1 | P23415 | 1/20 | 0.45 |
| ▸ | ALDH1A1 | P00352 | 4/20 | 0.44 |
| ▸ | TSHR | P16473 | 3/20 | 0.44 |
| ▸ | MAPT | P10636 | 1/20 | 0.43 |
| ▸ | DPP4 | P27487 | 1/20 | 0.43 |
| ▸ | DPP8 | Q6V1X1 | 1/20 | 0.43 |
| ▸ | DPP9 | Q86TI2 | 1/20 | 0.43 |
| ▸ | DPP7 | Q9UHL4 | 1/20 | 0.43 |
| ▸ | PDK1 | Q15118 | 1/20 | 0.40 |
| ▸ | GAA | P10253 | 1/20 | 0.40 |
| ▸ | MAPK1 | P28482 | 1/20 | 0.38 |
| ▸ | SMN1; SMN2 | Q16637 | 1/20 | 0.38 |
| ▸ | MEN1 | O00255 | 1/20 | 0.38 |
| ▸ | KMT2A | Q03164 | 1/20 | 0.38 |
| ▸ | FKBP1A | P62942 | 1/20 | 0.37 |
| ▸ | POLB | P06746 | 1/20 | 0.36 |
| ▸ | AKR1C3 | P42330 | 3/20 | 0.35 |
| ▸ | AKR1C2 | P52895 | 3/20 | 0.35 |
| ▸ | HTT | P42858 | 2/20 | 0.35 |
| ▸ | KDM4E | B2RXH2 | 1/20 | 0.35 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL356037 | 0.73 | USP30 (0.40) | GLRA1ALDH1A1TSHRDPP4DPP8 | |
| SCHEMBL12233362 | 0.73 | GLRA1 (0.52) | GLRA1ALDH1A1TSHRPDK1SMN1; SMN2 | |
| SCHEMBL19699503 | 0.73 | GLRA1 (0.52) | GLRA1ALDH1A1TSHRPDK1SMN1; SMN2 | |
| SCHEMBL19699484 | 0.73 | GLRA1 (0.52) | GLRA1ALDH1A1TSHRPDK1SMN1; SMN2 | |
| SCHEMBL6201066 | 0.72 | ALDH1A1 (0.41) | GLRA1ALDH1A1TSHRMAPTMAPK1 | |
| SCHEMBL23080634 | 0.72 | GLRA1 (0.64) | GLRA1ALDH1A1MAPTSMN1; SMN2MEN1 | |
| SCHEMBL6043763 | 0.72 | GLRA1 (0.51) | GLRA1ALDH1A1TSHRPDK1SMN1; SMN2 | |
| SCHEMBL15788121 | 0.69 | PDK1 (0.50) | GLRA1ALDH1A1TSHRDPP4DPP8 | |
| SCHEMBL22681134 | 0.68 | PDK1 (0.50) | GLRA1DPP4DPP8DPP9DPP7 | |
| SCHEMBL3435470 | 0.68 | KDM4E (0.38) | ALDH1A1TSHRMAPTPDK1MAPK1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 28 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20250271758-A1 | PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT, PRINTED WIRING BOARD, AND METHOD FOR PRODUCING PRINTED WIRING BOARD | RESONAC CORPORATION (JP) | 2025-08-28 | — | — | US | disclosed |
| US-20250116930-A1 | PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT, PRINTED CIRCUIT BOARD, AND METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARD | RESONAC CORPORATION (JP) | 2025-04-10 | — | — | US | disclosed |
| US-12189290-B2 | Photosensitive resin composition, dry film using same, printed wiring board, and printed wiring board manufacturing method | RESONAC CORPORATION (JP) | 2025-01-07 | — | — | US | disclosed |
| CN-119072657-A | Photosensitive resin composition, photosensitive element, printed wiring board, and method for producing printed wiring board | 株式会社力森诺科 | 2024-12-03 | — | — | CN | disclosed |
| CN-118613765-A | Photosensitive resin composition, photosensitive element, printed wiring board, and method for producing printed wiring board | 株式会社力森诺科 | 2024-09-06 | — | — | CN | disclosed |
| WO-2024135741-A1 | PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT, PRINTED WIRING BOARD, AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD | 株式会社レゾナック | 2024-06-27 | — | — | WO | disclosed |
| US-20240134277-A1 | PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT, PRINTED WIRING BOARD, AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD | RESONAC CORPORATION (JP) | 2024-04-25 | — | — | US | disclosed |
| CN-117836717-A | Photosensitive resin composition, photosensitive element, printed wiring board, and method for producing printed wiring board | 株式会社力森诺科 | 2024-04-05 | — | — | CN | disclosed |
| US-11921424-B2 | Photosensitive resin composition, dry film using same, printed wiring board, and printed wiring board manufacturing method | Hitachi Chemical Company, Ltd. (FIPAS) (JP) | 2024-03-05 | — | — | US | disclosed |
| WO-2023214540-A1 | PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT, PRINTED WIRING BOARD, AND METHOD FOR PRODUCING PRINTED WIRING BOARD | 株式会社レゾナック | 2023-11-09 | — | — | WO | disclosed |
| US-20220276558-A1 | PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN FILM, MULTILAYER PRINTED WIRING BOARD, SEMICONDUCTOR PACKAGE, AND PRODUCTION METHOD FOR MULTILAYER PRINTED WIRING BOARD | RESONAC CORPORATION (JP) | 2022-09-01 | — | — | US | disclosed |
| CN-110521290-B | Photosensitive resin composition, dry film using same, printed wiring board, and method for producing printed wiring board | 日立化成株式会社 | 2022-04-05 | — | — | CN | disclosed |
| CN-114270261-A | Photosensitive resin composition, photosensitive resin film, multilayer printed wiring board, semiconductor package, and method for producing multilayer printed wiring board | 昭和电工材料株式会社 | 2022-04-01 | — | — | CN | disclosed |
| CN-113068320-A | Printed wiring board | 味之素株式会社 | 2021-07-02 | — | — | CN | disclosed |
| CN-113038700-A | Printed wiring board | 味之素株式会社 | 2021-06-25 | — | — | CN | disclosed |
| US-20210109444-A1 | PHOTOSENSITIVE RESIN COMPOSITION, DRY FILM USING SAME, PRINTED WIRING BOARD, AND PRINTED WIRING BOARD MANUFACTURING METHOD | RESONAC CORPORATION (JP) | 2021-04-15 | — | — | US | disclosed |
| US-10111328-B2 | Photosensitive resin composition, dry film using same, printed wiring board, and method for producing printed wiring board | HTACHI CHEMICAL COMPANY, LTD. (JP) | 2018-10-23 | — | — | US | disclosed |
| US-20160007454-A1 | PHOTOSENSITIVE RESIN COMPOSITION, DRY FILM USING SAME, PRINTED WIRING BOARD, AND METHOD FOR PRODUCING PRINTED WIRING BOARD | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2016-01-07 | — | — | US | disclosed |
| US-9075307-B2 | Photosensitive resin composition for protective film of printed wiring board for semiconductor package | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2015-07-07 | — | — | US | disclosed |
| US-20110223539-A1 | PHOTOSENSITIVE RESIN COMPOSITION FOR PROTECTIVE FILM OF PRINTED WIRING BOARD FOR SEMICONDUCTOR PACKAGE | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2011-09-15 | — | — | US | disclosed |