⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL6049401 | 0.85 | CHRM1 (0.34) | — | |
| SCHEMBL74357 | 0.74 | GRIK1 (0.31) | — | |
| SCHEMBL74358 | 0.74 | GRIK1 (0.31) | — | |
| SCHEMBL1543776 | 0.72 | PTGS1 (0.30) | — | |
| SCHEMBL27805093 | 0.72 | GRIK1 (0.31) | — | |
| SCHEMBL1000711 | 0.72 | PTGS1 (0.32) | — | |
| SCHEMBL9767228 | 0.72 | PTGS1 (0.32) | — | |
| SCHEMBL9231077 | 0.72 | PTGS1 (0.32) | — | |
| SCHEMBL11360502 | 0.70 | ALDH1A1 (0.32) | — | |
| SCHEMBL8764559 | 0.70 | ALDH1A1 (0.32) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 7 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-9388302-B2 | Latex for dip molding, composition for dip molding, preparation method of dip molded product, and dip molded product prepared thereby | LG CHEM, LTD. (KR) | 2016-07-12 | — | — | US | disclosed |
| US-20150352747-A1 | BLADDER FOR TIRE VULCANIZATION | DENKI KAGAKU KOGYO KABUSHIKI KAISHA (JP) | 2015-12-10 | — | — | US | disclosed |
| US-20140329956-A1 | LATEX FOR DIP MOLDING, COMPOSITION FOR DIP MOLDING, PREPARATION METHOD OF DIP MOLDED PRODUCT, AND DIP MOLDED PRODUCT PREPARED THEREBY | LG CHEMICAL LTD (KR) | 2014-11-06 | — | — | US | disclosed |
| US-20130295209-A1 | TIRE BLADDER | DENKI KAGAKU KOGYO KABUSHIKI KAISHA (JP) | 2013-11-07 | — | — | US | disclosed |
| US-20130090424-A1 | ACRYLIC RUBBER COMPOSITION, VULCANIZATE, HOSE PART, AND SEALING PART | DENKI KAGAKU KOGYO KABUSHIKI KAISHA (JP) | 2013-04-11 | — | — | US | disclosed |
| US-7662890-B2 | Composition for dip forming and molding obtained by dip forming | ZEON CORPORATION (JP) | 2010-02-16 | — | — | US | disclosed |
| US-20070149693-A1 | Composition for dip forming and molding obtained by dip forming | ZEON CORPORATION (JP) | 2007-06-28 | — | — | US | disclosed |