SCHEMBL36052

SCHEMBL36052

N#CC(=NOS(=O)(=O)C(F)(F)F)c1ccccc1

nearest known ligand 0.43

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
PLA2G7 Q13093 1/20 0.43
MAPT P10636 4/20 0.36
CES1 P23141 1/20 0.34
PDE4A P27815 1/20 0.32
PDE4B Q07343 1/20 0.32
PDE4C Q08493 1/20 0.32
PDE4D Q08499 1/20 0.32
POLB P06746 1/20 0.32
KAT6A Q92794 1/20 0.31
KMT2A Q03164 2/20 0.31
KDM4E B2RXH2 1/20 0.31
ALDH1A1 P00352 2/20 0.31
CYP1A2 P05177 1/20 0.31
CYP3A4 P08684 1/20 0.31
CYP2D6 P10635 1/20 0.31
CYP2C9 P11712 1/20 0.31
HPGD P15428 1/20 0.31
CYP2C19 P33261 1/20 0.31
SMN1; SMN2 Q16637 1/20 0.31
LMNA P02545 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL297051 1.00 PLA2G7 (0.43) PLA2G7MAPTCES1PDE4APDE4B
SCHEMBL18431383 0.94 PLA2G7 (0.36) PLA2G7MAPT
SCHEMBL9891190 0.94 PLA2G7 (0.36) PLA2G7MAPT
SCHEMBL9891195 0.91 PLA2G7 (0.36) PLA2G7MAPTPDE4APDE4BPDE4C
SCHEMBL18431387 0.91 PLA2G7 (0.36) PLA2G7MAPTPDE4APDE4BPDE4C
SCHEMBL26068450 0.91 PLA2G7 (0.36) PLA2G7MAPTPDE4APDE4BPDE4C
SCHEMBL14375144 0.88 PLA2G7 (0.33) PLA2G7MAPTALDH1A1LMNA
SCHEMBL17109491 0.88 PLA2G7 (0.33) PLA2G7MAPT
SCHEMBL18090886 0.88 PLA2G7 (0.32) PLA2G7PKML3MBTL1
SCHEMBL107127 0.87 CA2 (0.34) PLA2G7MAPTCES1POLBKMT2A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 775 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-6042988-A ALKALI-SOLUBLE RESIN, A COMPOUND CAPABLE OF GENERATING AN ACID BY IRRADIATION AND A CROSSLINKING AGENT, AND FURTHER CONTAINS AN ORGANIC CARBOXYLIC ACID AS ACIDIC COMPOUND AND ORGANIC AMINE AS ALKALINE COMPOUND; DEFINITION AND PRECISION TOKYO OHKA KOGYO CO., LTD. (JP) 2000-03-28 US claimed
US-20250321485-A1 RESIST AUXILIARY FILM COMPOSITION, AND PATTERN FORMING METHOD USING SAME MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2025-10-16 US disclosed
CN-120044752-A Photosensitive resin composition 东京应化工业株式会社 2025-05-27 CN disclosed
CN-119452307-A Resist auxiliary film composition and pattern forming method using the same 三菱瓦斯化学株式会社 2025-02-14 CN disclosed
CN-119422108-A Resist composition and method for forming resist film using same 三菱瓦斯化学株式会社 2025-02-11 CN disclosed
CN-117769684-A Resist auxiliary film composition and pattern forming method using the same 三菱瓦斯化学株式会社 2024-03-26 CN disclosed
CN-117716290-A Resist composition and method for forming resist film using the same 三菱瓦斯化学株式会社 2024-03-15 CN disclosed
WO-2024014329-A1 RESIST COMPOSITION AND RESIST FILM FORMING METHOD USING SAME 三菱瓦斯化学株式会社 2024-01-18 WO disclosed
WO-2024014330-A1 RESIST AUXILIARY FILM COMPOSITION, AND PATTERN FORMING METHOD USING SAME 三菱瓦斯化学株式会社 2024-01-18 WO disclosed
US-11852970-B2 Material for lithography, production method therefor, composition for lithography, pattern formation method, compound, resin, and method for purifying the compound or the resin MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2023-12-26 US disclosed
US-6022666-A Chemical-sensitization photoresist composition TOKYO OHKA KOGYO CO., LTD. (JP) 2000-02-08 US disclosed
US-5976760-A Chemical-sensitization resist composition TOKYO OHKA KOGYO CO., LTD. (JP) 1999-11-02 US disclosed
US-5928837-A Negative-working chemical-sensitization photoresist composition comprising oxime sulfonate compounds TOKYO OHKA KOGYO CO., LTD. (JP) 1999-07-27 US disclosed
US-5929271-A Compounds for use in a positive-working resist composition TOKYO OHKA KOGYO CO., LTD. (JP) 1999-07-27 US disclosed
US-5925495-A Photoresist laminate and method for patterning using the same TOKYO OHKA KOGYO CO., LTD. (JP) 1999-07-20 US disclosed
US-5902713-A Chemical-sensitization photoresist composition TOKYO OHKA KOGYO CO., LTD. (JP) 1999-05-11 US disclosed
US-5817444-A POLYHYDROXYSTYRENE SUBSTITUTED WITH TETRAHYDROPYRAN GROUPS, POLYHYDROXYSTYRENE SUBSTITUTED WITH ALKOXYALKYL GROUPS TOKYO OHKA KOGYO CO., LTD. (JP) 1998-10-06 US disclosed
EP-0848289-A1 Negative-working chemical sensitization photoresist composition TOKYO OHKA KOGYO CO., LTD. (JP) 1998-06-17 EP disclosed
EP-0821274-A1 Chemical-sensitization resist composition TOKYO OHKA KOGYO CO., LTD. (JP) 1998-01-28 EP disclosed
EP-0780729-A1 Chemical-sensitization photoresist composition TOKYO OHKA KOGYO CO., LTD. (JP) 1997-06-25 EP disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (1 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-11852970-B2 Material for lithography, production method therefor, composition for lithography, pattern formation method, compound, resin, and method for purifying the compound or the resin SLC39A11, CROCC, TERB1 PLA2G7 1574/4885MAPT 1634/4885CES1 2563/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.