SCHEMBL3623409

SCHEMBL3623409

OCNc1nc(-c2ccccc2)nc(N(CO)CO)n1

nearest known ligand 0.43

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
IDH1 O75874 1/20 0.43
NPSR1 Q6W5P4 1/20 0.43
GPR68 Q15743 2/20 0.39
HTR1A P08908 1/20 0.39
MAPK1 P28482 2/20 0.38
KDM4E B2RXH2 1/20 0.35
ALDH1A1 P00352 1/20 0.35
GLA P06280 1/20 0.35
GAA P10253 1/20 0.35
HPGD P15428 1/20 0.35
PDE5A O76074 2/20 0.35
TPH1 P17752 3/20 0.35
PIK3CA P42336 1/20 0.35
MEN1 O00255 3/20 0.35
KMT2A Q03164 3/20 0.35
ADORA2A P29274 1/20 0.35
HTR2B P41595 1/20 0.35
TSHR P16473 1/20 0.34
HTT P42858 1/20 0.34
NOTUM Q6P988 1/20 0.34

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL197197 0.84 MEN1 (0.42) MAPK1KDM4EALDH1A1MEN1KMT2A
SCHEMBL7179863 0.84 IDH1 (0.57) IDH1NPSR1GPR68HTR1AMAPK1
SCHEMBL13140693 0.79 IDH1 (0.36) IDH1NPSR1GPR68HTR1AMAPK1
SCHEMBL62455 0.78 GAA (0.36) KDM4EGAAMEN1KMT2AMCL1
SCHEMBL60870 0.78 GAA (0.32) KDM4EGAA
SCHEMBL197517 0.76 NPSR1 (0.71) IDH1NPSR1GPR68HTR1ATPH1
SCHEMBL487223 0.76 ADORA2A (0.58) NPSR1GPR68HTR1AALDH1A1HPGD
SCHEMBL18649110 0.75 KMT2A (0.39) KDM4EALDH1A1PDE5APIK3CAMEN1
SCHEMBL16351816 0.74 PRUNE1 (0.39) IDH1NPSR1GPR68HTR1AMAPK1
Formaldehyde SCHEMBL4055303 0.73 CA1 (0.33) GAA

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 66 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
JP-2255856-A None JP disclosed
CN-117940516-A Resin composition, cured product, laminate, method for producing cured product, method for producing laminate, method for producing semiconductor device, and semiconductor device 富士胶片株式会社 2024-04-26 CN disclosed
CN-117881745-A Resin composition, cured product, laminate, method for producing cured product, method for producing laminate, method for producing semiconductor device, and compound 富士胶片株式会社 2024-04-12 CN disclosed
CN-117836715-A Resin composition, cured product, laminate, method for producing cured product, method for producing laminate, method for producing semiconductor device, and alkali generator 富士胶片株式会社 2024-04-05 CN disclosed
CN-117751326-A Method for producing cured product, method for producing laminate, method for producing semiconductor device, resin composition, cured product, laminate, and semiconductor device 富士胶片株式会社 2024-03-22 CN disclosed
CN-117730280-A Method for producing cured product, method for producing laminate, method for producing semiconductor device, resin composition, cured product, laminate, and semiconductor device 富士胶片株式会社 2024-03-19 CN disclosed
CN-117715982-A Resin composition, cured product, laminate, method for producing cured product, method for producing laminate, method for producing semiconductor device, and semiconductor device 富士胶片株式会社 2024-03-15 CN disclosed
CN-117642442-A Resin composition, cured product, laminate, method for producing cured product, method for producing laminate, method for producing semiconductor device, and semiconductor device 富士胶片株式会社 2024-03-01 CN disclosed
CN-117295794-A Resin composition, cured product, laminate, method for producing cured product, semiconductor device, and compound 富士胶片株式会社 2023-12-26 CN disclosed
CN-117203265-A Resin composition, cured product, laminate, method for producing cured product, semiconductor device, and resin 富士胶片株式会社 2023-12-08 CN disclosed
EP-0839856-A2 Polyester film for decorative plate or decorative sheet Mitsubishi Polyester Film Corporation (JP) 1998-05-06 EP disclosed
EP-0742272-A1 Powder coating composition with coalescing and flow agent BASF CORPORATION (US) 1996-11-13 EP disclosed
US-5552487-A Method for powder coatings BASF CORPORATION (US) 1996-09-03 US disclosed
US-5508349-A EPOXY, POLYESTER OR HYDROXY-CONTAINING ACRYLATE BINDERS, CROSSLINKING AGENTS, E.G.DIISOCYANATES, AND A CRYSTALLINE FLOW CONTROL AGENT; SMOOTH SURFACE BASF CORPORATION (US) 1996-04-16 US disclosed
JP-H02255856-A INJECTION-MOLDABLE THERMOSETTING RESIN COMPOSITION MITSUI TOATSU CHEM INC 1990-10-16 JP disclosed
EP-0377998-A2 Injection-molding thermosetting resin composition MITSUI TOATSU CHEMICALS, Inc. (JP) 1990-07-18 EP disclosed
US-4349660-A Process for the production of air drying modified amino resin KEMIRA OY (FI) 1982-09-14 US disclosed
US-4312795-A Paint composition comprising powder paint dispersed in aqueous resin solution NISSAN MOTOR CO., LTD. (JP) 1982-01-26 US disclosed
US-4024100-A BENZOGUANAMINE, POLYESTER BAYER AKTIENGESELLSCHAFT (DT) 1977-05-17 US disclosed
US-3935368-A Vinyl chloride flooring material coated with a hydrophilic acrylic polymer NATIONAL PATENT DEVELOPMENT CORPORATION (US) 1976-01-27 US disclosed