Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | IDO1 | P14902 | 1/20 | 0.38 |
| ▸ | EP300 | Q09472 | 1/20 | 0.37 |
| ▸ | KAT8 | Q9H7Z6 | 1/20 | 0.37 |
| ▸ | NQO1 | P15559 | 1/20 | 0.37 |
| ▸ | IMPDH2 | P12268 | 1/20 | 0.36 |
| ▸ | IMPDH1 | P20839 | 1/20 | 0.36 |
| ▸ | MAPT | P10636 | 4/20 | 0.35 |
| ▸ | MEN1 | O00255 | 2/20 | 0.35 |
| ▸ | KMT2A | Q03164 | 2/20 | 0.35 |
| ▸ | HPGDS | O60760 | 1/20 | 0.35 |
| ▸ | POLB | P06746 | 1/20 | 0.35 |
| ▸ | CYP1A2 | P05177 | 3/20 | 0.35 |
| ▸ | CYP3A4 | P08684 | 3/20 | 0.35 |
| ▸ | ALDH1A1 | P00352 | 3/20 | 0.35 |
| ▸ | CYP2C9 | P11712 | 2/20 | 0.35 |
| ▸ | HSD17B10 | Q99714 | 2/20 | 0.35 |
| ▸ | STAT6 | P42226 | 1/20 | 0.35 |
| ▸ | LMNA | P02545 | 2/20 | 0.34 |
| ▸ | CYP2C19 | P33261 | 1/20 | 0.34 |
| ▸ | ABCG2 | Q9UNQ0 | 1/20 | 0.33 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL30628538 | 1.00 | IDO1 (0.38) | IDO1EP300KAT8NQO1IMPDH2 | |
| SCHEMBL62367 | 0.85 | IDO1 (0.42) | IDO1EP300KAT8NQO1IMPDH2 | |
| SCHEMBL29350011 | 0.85 | IDO1 (0.42) | IDO1EP300KAT8NQO1IMPDH2 | |
| SCHEMBL28175722 | 0.81 | CYP1A2 (0.39) | MAPTCYP1A2ALDH1A1TSHRSMN1; SMN2 | |
| SCHEMBL15143913 | 0.81 | IDO1 (0.38) | IDO1EP300KAT8NQO1IMPDH2 | |
| SCHEMBL28549528 | 0.80 | IDO1 (0.36) | IDO1EP300KAT8NQO1IMPDH2 | |
| SCHEMBL4411594 | 0.78 | PI4KA (0.38) | MAPTMEN1KMT2ACYP1A2ALDH1A1 | |
| SCHEMBL393466 | 0.77 | CYP1A2 (0.40) | MAPTMEN1KMT2ACYP1A2CYP3A4 | |
| SCHEMBL19810863 | 0.76 | ABCG2 (0.43) | MAPTMEN1KMT2ACYP1A2ALDH1A1 | |
| SCHEMBL11216591 | 0.76 | IDO1 (0.47) | IDO1EP300KAT8NQO1IMPDH2 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 113 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-111176070-B | Negative photoresist composition and use thereof | 台湾永光化学工业股份有限公司 | 2023-09-01 | — | — | CN | claimed |
| CN-111176070-A | Negative photoresist composition and use thereof | 台湾永光化学工业股份有限公司 | 2020-05-19 | — | — | CN | claimed |
| WO-2009054621-A2 | THE COMPOSITION OF DECOLORABLE INK AND DECOLORING METHOD | HAN JONG-SOO (KR) | 2009-04-30 | — | — | WO | claimed |
| CN-1209679-C | Thermal sensitive imaging composition for direct platemaking by positive thermal sensitive computer | UNIV BEIJING NORMAL (CN) | 2005-07-06 | — | — | CN | claimed |
| CN-1490667-A | Thermal sensitive imaging composition for direct platemaking by positive thermal sensitive computer | 北京师范大学 | 2004-04-21 | — | — | CN | claimed |
| WO-1979000448-A1 | INHIBITING IMAGE FORMATION WITH COBALT(III)COMPLEXES | EASTMAN KODAK CO (US) | 1979-07-26 | — | — | WO | claimed |
| CN-118276408-A | Photosensitive resin composition, photo-cured pattern formed thereby, and display device including photo-cured pattern | 东友精细化工有限公司 | 2024-07-02 | — | — | CN | disclosed |
| CN-118108621-A | Diamine compound, heat-resistant resin, resin composition, cured film, and electronic component | 东友精细化工有限公司 | 2024-05-31 | — | — | CN | disclosed |
| EP-4365916-A1 | INSULATED WIRE, COIL COMPRISING INSULATED WIRE, AND CABLE | Daicel Corporation (JP) | 2024-05-08 | — | — | EP | disclosed |
| CN-117715759-A | Lithographic printing plate precursor | 易客发有限公司 | 2024-03-15 | — | — | CN | disclosed |
| US-11866608-B2 | Weather-resistant hard coat composition for metal, cured product, and coated metal substrate | DAICEL CORPORATION (JP) | 2024-01-09 | — | — | US | disclosed |
| CN-113165015-B | Weather-resistant hard coating composition for glass-substitute substrate, cured product, and laminate | 株式会社大赛璐 | 2023-11-28 | — | — | CN | disclosed |
| CN-109709770-B | Resin composition, dry film and method for producing same, method for producing resist film and substrate, method for producing plated molded article, and mercapto compound | 东京应化工业株式会社 | 2023-11-24 | — | — | CN | disclosed |
| CN-1550891-A | Colouring photosensitive resin composition | 住友化学工业株式会社 | 2004-12-01 | — | — | CN | disclosed |
| CN-1490667-A | Thermal sensitive imaging composition for direct platemaking by positive thermal sensitive computer | 北京师范大学 | 2004-04-21 | — | — | CN | disclosed |
| EP-1268660-A1 | LITHOGRAPHIC PRINTING PLATE HAVING HIGH CHEMICAL RESISTANCE | Kodak Polychrome Graphics Company Ltd. (US) | 2003-01-02 | — | — | EP | disclosed |
| WO-2001046318-A1 | LITHOGRAPHIC PRINTING PLATE HAVING HIGH CHEMICAL RESISTANCE | KODAK POLYCHROME GRAPHICS COMPANY LTD. (US) | 2001-06-28 | — | — | WO | disclosed |
| US-5432189-A | Bis-aryl amide and urea antagonists of platelet activating factor | AMERICAN CYANAMID COMPANY (US) | 1995-07-11 | — | — | US | disclosed |
| EP-0391365-B1 | Process for treating metal surface | FUJI PHOTO FILM CO LTD (JP) | 1995-01-18 | — | — | EP | disclosed |
| US-5350759-A | Bis-aryl urea compounds | WISSNER ALLAN (US) | 1994-09-27 | — | — | US | disclosed |