SCHEMBL365813

SCHEMBL365813

C=Cc1ccccc1OC(=O)OCCCC

nearest known ligand 0.54

Predicted protein targets (top 16)

geneUniProtsupporting neighboursconfidence
ELANE P08246 4/20 0.54
TSHR P16473 5/20 0.46
TDP1 Q9NUW8 2/20 0.46
L3MBTL1 Q9Y468 2/20 0.46
THRB P10828 2/20 0.43
THRA P10827 1/20 0.43
HPGD P15428 1/20 0.42
KMT2A Q03164 1/20 0.42
CYP3A4 P08684 2/20 0.42
MAPK1 P28482 2/20 0.42
TP53 P04637 1/20 0.42
ALDH1A1 P00352 3/20 0.41
HSD17B10 Q99714 1/20 0.41
PTGS2 P35354 2/20 0.41
LMNA P02545 1/20 0.41
SMN1; SMN2 Q16637 1/20 0.40

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL7534893 0.91 ELANE (0.44) ELANETHRBTHRAHPGDKMT2A
SCHEMBL7945225 0.88 ELANE (0.54) ELANETSHRTDP1L3MBTL1THRB
SCHEMBL7541864 0.85 LMNA (0.47) TSHRTHRBTHRAHPGDKMT2A
SCHEMBL29315128 0.82 ELANE (0.62) ELANETSHRTDP1L3MBTL1KMT2A
SCHEMBL2544756 0.81 ELANE (0.58) ELANETSHRTDP1L3MBTL1KMT2A
SCHEMBL2196872 0.81 USP2 (0.53) TSHRTDP1L3MBTL1HPGDKMT2A
SCHEMBL8625233 0.80 ELANE (0.61) ELANETSHRTDP1L3MBTL1KMT2A
SCHEMBL406835 0.80 CYP1A2 (0.56) TSHRTDP1L3MBTL1HPGDKMT2A
SCHEMBL2791736 0.79 PTGDR2 (0.42) TSHRHPGDKMT2AMAPK1ALDH1A1
SCHEMBL727949 0.79 ELANE (0.59) ELANETSHRTDP1L3MBTL1CYP3A4

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 146 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-6255032-B1 Chemically amplified color resist composition INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE (TW) 2001-07-03 US claimed
EP-0797792-B1 PHOTOLITHOGRAPHIC METHOD OF PRODUCING STRUCTURAL FEATURES SIEMENS AG (DE) 1998-11-18 EP claimed
EP-0361906-A2 Method of producing an image reversal negative photoresist having a photo-labile blocked imide HOECHST CELANESE CORPORATION (US) 1990-04-04 EP claimed
JP-4359906-A None JP disclosed
JP-4253939-A None JP disclosed
WO-2024047976-A1 PHOTOCURABLE INK-JET INK COMPOSITION サカタインクス株式会社 2024-03-07 WO disclosed
WO-2024029176-A1 PHOTOCURABLE INKJET INK COMPOSITION KJケミカルズ株式会社 2024-02-08 WO disclosed
WO-2023188625-A1 ACTIVE ENERGY RAY-CURABLE ADHESIVE COMPOSITION サカタインクス株式会社 2023-10-05 WO disclosed
WO-2023188627-A1 ACTIVE ENERGY RAY-CURABLE ADHESIVE COMPOSITION サカタインクス株式会社 2023-10-05 WO disclosed
WO-2023188628-A1 ACTIVE ENERGY RAY-CURABLE INK COMPOSITION FOR REVERSE PRINTING サカタインクス株式会社 2023-10-05 WO disclosed
WO-2023037712-A1 DIGITAL EMBOSSING CREATION METHOD サカタインクス株式会社 2023-03-16 WO disclosed
US-4996136-A Radiation sensitive materials and devices made therewith AT&T BELL LABORATORIES (US) 1991-02-26 US disclosed
EP-0291670-B1 VAPOR PHASE PHOTORESIST SILYLATION PROCESS International Business Machines Corporation (US) 1991-02-20 EP disclosed
EP-0405957-A1 Deep U.V. photoresist compositions containing polycyclic cyclopentane -2- diazo-1,3-dione HOECHST CELANESE CORPORATION (US) 1991-01-02 EP disclosed
EP-0404206-A2 Resist compositions International Business Machines Corporation (US) 1990-12-27 EP disclosed
EP-0366590-A2 Highly sensitive positive photoresist compositions International Business Machines Corporation (US) 1990-05-02 EP disclosed
EP-0330386-A2 Radiation sensitive materials and devices made therewith AT&T Corp. (US) 1989-08-30 EP disclosed
EP-0291670-A1 Vapor phase photoresist silylation process International Business Machines Corporation (US) 1988-11-23 EP disclosed
EP-0264908-A2 High sensitivity resists having autodecomposition temperatures greater than about 160 C International Business Machines Corporation (US) 1988-04-27 EP disclosed
EP-0254853-A2 Lithographic method employing thermally stable photoresists with high sensitivity forming a hydogen-bonded network International Business Machines Corporation (US) 1988-02-03 EP disclosed