SCHEMBL7534893

SCHEMBL7534893

C=Cc1ccccc1OC(=O)OCCC

nearest known ligand 0.44

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ELANE P08246 2/20 0.44
ALDH1A1 P00352 3/20 0.44
LMNA P02545 2/20 0.42
ALOX5 P09917 1/20 0.40
THRA P10827 1/20 0.39
THRB P10828 1/20 0.39
SMN1; SMN2 Q16637 2/20 0.39
HPGD P15428 1/20 0.39
HTT P42858 1/20 0.39
MEN1 O00255 1/20 0.38
PLIN1 O60240 1/20 0.38
POLB P06746 1/20 0.38
MAPT P10636 1/20 0.38
PLIN5 Q00G26 1/20 0.38
KMT2A Q03164 1/20 0.38
ABHD5 Q8WTS1 1/20 0.38
PTGS2 P35354 2/20 0.37
PTGDR2 Q9Y5Y4 1/20 0.36
KDM4E B2RXH2 1/20 0.36
GAA P10253 1/20 0.36

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL365813 0.91 ELANE (0.54) ELANEALDH1A1LMNATHRATHRB
SCHEMBL7541864 0.88 LMNA (0.47) ALDH1A1LMNATHRATHRBSMN1; SMN2
SCHEMBL2791736 0.82 PTGDR2 (0.42) ALDH1A1LMNASMN1; SMN2HPGDHTT
SCHEMBL7538141 0.81 ALDH1A1 (0.45) ALDH1A1HPGDMEN1KMT2APTGDR2
SCHEMBL7945225 0.79 ELANE (0.54) ELANELMNATHRATHRBSMN1; SMN2
SCHEMBL7542596 0.79 KDM4E (0.54) ALDH1A1LMNASMN1; SMN2HPGDHTT
SCHEMBL29315126 0.79 ALDH1A1 (0.50) ELANEALDH1A1LMNAALOX5SMN1; SMN2
SCHEMBL216487 0.79 KMT2A (0.47) ALDH1A1LMNAHPGDHTTMEN1
SCHEMBL766471 0.78 KMT2A (0.48) ALDH1A1LMNATHRATHRBSMN1; SMN2
SCHEMBL9357988 0.78 NPC1 (0.45) ALDH1A1SMN1; SMN2HPGDHTTPTGS2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20020015906-A1 Polymer for photoresist, method of production thereof and photoresist composition containing polymer SAMSUNG ELECTRONICS CO., LTD. (KR) 2002-02-07 US disclosed
EP-0264908-A2 High sensitivity resists having autodecomposition temperatures greater than about 160 C International Business Machines Corporation (US) 1988-04-27 EP disclosed