Aminobenzoic Acid

Aminobenzoic Acid

SCHEMBL366997

CC1CO1.Nc1ccc(C(=O)O)cc1.Nc1ccc(C(=O)O)cc1

nearest known ligand 0.46

Full drug profile on Sugi Atlas →

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
TSHR P16473 2/20 0.46
TP53 P04637 1/20 0.46
HPGD P15428 1/20 0.44
TDP1 Q9NUW8 3/20 0.44
ALDH1A1 P00352 3/20 0.43
ALOX15 P16050 1/20 0.43
SMN1; SMN2 Q16637 1/20 0.43
USP2 O75604 1/20 0.42
SRD5A2 P31213 3/20 0.41
CA1 P00915 2/20 0.40
CA2 P00918 2/20 0.40
RXRA P19793 1/20 0.40
RXRB P28702 1/20 0.40
CA12 O43570 1/20 0.40
CA3 P07451 1/20 0.40
TYR P14679 1/20 0.40
DRD1 P21728 1/20 0.40
CA4 P22748 1/20 0.40
CA6 P23280 1/20 0.40
CA5A P35218 1/20 0.40

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Aminobenzoic Acid SCHEMBL367762 1.00 TSHR (0.46) TSHRTP53HPGDTDP1ALDH1A1
Aminobenzoic Acid SCHEMBL18092766 1.00 TSHR (0.46) TSHRTP53HPGDTDP1ALDH1A1
Terephthalic Acid SCHEMBL28687 0.90 TSHR (0.57) TSHRTP53HPGDTDP1ALDH1A1
Aminobenzoic Acid SCHEMBL10410580 0.82 ALDH1A1 (0.43) TSHRTP53HPGDTDP1ALDH1A1
Aminobenzoic Acid SCHEMBL5874326 0.81 TSHR (0.63) TSHRTP53HPGDALDH1A1ALOX15
Aminobenzoic Acid SCHEMBL11323913 0.81 TSHR (0.63) TSHRTP53HPGDALDH1A1ALOX15
Terephthalic Acid SCHEMBL9717815 0.81 TSHR (0.71) TSHRTP53TDP1ALDH1A1ALOX15
Aminobenzoic Acid SCHEMBL8249 0.81 TSHR (0.71) TSHRTP53TDP1ALDH1A1ALOX15
Aminobenzoic Acid SCHEMBL1768920 0.81 TSHR (0.71) TSHRTP53TDP1ALDH1A1ALOX15
Terephthalic Acid SCHEMBL7648718 0.81 TSHR (0.71) TSHRTP53TDP1ALDH1A1ALOX15

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 128 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-109867764-B High removal rate chemical mechanical polishing pad from curing agents containing amine-initiated polyols 罗门哈斯电子材料CMP控股股份有限公司 2021-11-23 CN claimed
US-10280250-B2 Resin composition, insulating matrix comprising the same and circuit board using the same Chang, Chi-Lan (TW) 2019-05-07 US claimed
US-9827646-B2 Polishing pad and preparing method thereof FNS TECH CO., LTD. (KR) 2017-11-28 US claimed
US-20170158805-A1 Resin composition, insulating matrix comprising the same and circuit board using the same CHANG, CHI-LAN (TW) 2017-06-08 US claimed
US-20170129072-A1 Porous Polishing Pad and Preparing Method of the Same FNS TECH CO., LTD. (KR) 2017-05-11 US claimed
US-20160339559-A1 POLISHING PAD AND PREPARING METHOD THEREOF FNS Tech. Co., Ltd. (KR) 2016-11-24 US claimed
US-8551201-B2 Polyurethane composition for CMP pads and method of manufacturing same PRAXAIR S.T. TECHNOLOGY, INC. (US) 2013-10-08 US claimed
US-8431489-B2 Chemical mechanical polishing pad having a low defect window ROHM AND HAAS ELECTRONIC MATERIALS CMP HOLDINGS, INC. (US) 2013-04-30 US claimed
US-20120295442-A1 Chemical mechanical polishing pad having a low defect window ROHM AND HAAS ELECTRONIC MATERIALS CMP HOLDINGS, INC. (US) 2012-11-22 US claimed
US-8257544-B2 Chemical mechanical polishing pad having a low defect integral window ROHM AND HAAS ELECTRONIC MATERIALS CMP HOLDINGS, INC. (US) 2012-09-04 US claimed
CN-117999150-A Textured CMP pad comprising polymer particles CMC材料有限责任公司 2024-05-07 CN disclosed
CN-117381658-A Chemical mechanical planarization pad having polishing layer with multi-lobed embedded features 罗门哈斯电子材料CMP控股股份有限公司 2024-01-12 CN disclosed
US-20240009798-A1 Chemical Mechanical Planarization Pad Having Polishing Layer with Multi-lobed Embedded Features U.S. BANK TRUST COMPANY, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT 2024-01-11 US disclosed
US-11845156-B2 Polishing pad employing polyamine and cyclohexanedimethanol curatives CMC MATERIALS, INC. (US) 2023-12-19 US disclosed
CN-117207058-A CMP pad having low specific gravity polishing layer 罗门哈斯电子材料CMP控股股份有限公司 2023-12-12 CN disclosed
US-7169030-B1 Chemical mechanical polishing pad ROHM AND HAAS ELECTRONIC MATERIALS CMP HOLDINGS, INC. (US) 2007-01-30 US disclosed
EP-1716193-A1 POLYURETHANE POLISHING PAD Rohm and Haas Electronic Materials CMP Holdings, Inc. (US) 2006-11-02 EP disclosed
WO-2005077999-A1 POLYURETHANE POLISHING PAD ROHM AND HAAS ELECTRONIC MATERIALS CMP HOLDINGS, INC. (US) 2005-08-25 WO disclosed
US-20050171225-A1 Polyurethane polishing pad ROHM AND HAAS ELECTRONIC MATERIALS CMP HOLDINGS, INC. 2005-08-04 US disclosed
US-20050171224-A1 Polyurethane polishing pad ROHM AND HAAS ELECTRONIC MATERIALS CMP HOLDINGS, INC. 2005-08-04 US disclosed