SCHEMBL367068

SCHEMBL367068

NC(N)c1ncncn1

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL3526533 0.73 HSP90AA1 (0.38)
SCHEMBL16671626 0.71
SCHEMBL2363479 0.69
SCHEMBL8570860 0.69
SCHEMBL2517677 0.69
SCHEMBL19273295 0.67
SCHEMBL28117223 0.65 HSP90AA1 (0.35)
SCHEMBL27914112 0.65
SCHEMBL11789018 0.65 HSP90AA1 (0.35)
SCHEMBL27899837 0.65 HSP90AA1 (0.35)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 650 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-119220356-A Preparation method of cleaning liquid 上海新阳半导体材料股份有限公司 2024-12-31 CN claimed
CN-119220354-A Cleaning liquid 上海新阳半导体材料股份有限公司 2024-12-31 CN claimed
CN-119220353-A Application of cleaning liquid 上海新阳半导体材料股份有限公司 2024-12-31 CN claimed
CN-119220351-A Application of cleaning liquid 上海新阳半导体材料股份有限公司 2024-12-31 CN claimed
CN-119220352-A Preparation method of cleaning liquid 上海新阳半导体材料股份有限公司 2024-12-31 CN claimed
CN-118231577-B Secondary battery and electronic device 宁德新能源科技有限公司 2024-08-30 CN claimed
EP-4419619-A1 SELECTIVE WET ETCH COMPOSITION AND METHOD Entegris, Inc. (US) 2024-08-28 EP claimed
CN-118234830-A Selective wet etching composition and method 恩特格里斯公司 2024-06-21 CN claimed
US-11978622-B2 Aqueous and semi-aqueous cleaners for the removal of post-etch residues with tungsten and cobalt compatibility ENTEGRIS, INC. (US) 2024-05-07 US claimed
CN-117625316-A Preparation method of fluorine-containing cleaning fluid composition 上海新阳半导体材料股份有限公司 2024-03-01 CN claimed
US-20050020750-A1 Method for curing aminoplast resins AGROLINZ MELAMIN GMBH (AT) 2005-01-27 US claimed
US-20040082697-A1 Multilayer structure; overcoating filler with amino resin AGROLINZ MELAMIN GMBH (AT) 2004-04-29 US claimed
US-20040054034-A1 Polymer-modified inorganic particles AGROLINZ MELAMIN GMBH (AT) 2004-03-18 US claimed
EP-1353994-A2 MODIFIED INORGANIC PARTICLES AMI Agrolinz Melamine International GmbH (AT) 2003-10-22 EP claimed
EP-1341856-A1 POLYMER MODIFIED INORGANIC PARTICLES Agrolinz Melamin GmbH (AT) 2003-09-10 EP claimed
EP-1341846-A2 METHOD FOR CURING AMINOPLAST RESINS Agrolinz Melamin GmbH (AT) 2003-09-10 EP claimed
EP-1247837-A2 Modified amino resins for semifinished products and molded bodies having an improved resilience Agrolinz Melamin GmbH (AT) 2002-10-09 EP claimed
WO-2002048248-A2 MODIFIED INORGANIC PARTICLES AGROLINZ MELAMIN GMBH (AT) 2002-06-20 WO claimed
WO-2002048270-A1 POLYMER MODIFIED INORGANIC PARTICLES AGROLINZ MELAMIN GMBH (AT) 2002-06-20 WO claimed
WO-2002048261-A2 METHOD FOR CURING AMINOPLAST RESINS AGROLINZ MELAMIN GMBH (AT) 2002-06-20 WO claimed