SCHEMBL3673260

SCHEMBL3673260

C=C(C)C(=O)CCOP(=O)(O)OCCC(=O)C(=C)C

nearest known ligand 0.53

Predicted protein targets (top 9)

geneUniProtsupporting neighboursconfidence
BTN3A1 O00481 1/20 0.53
MVD P53602 2/20 0.32
PEPD P12955 1/20 0.31
FNTA P49354 1/20 0.31
FNTB P49356 1/20 0.31
THRB P10828 1/20 0.31
P2RY10 O00398 4/20 0.30
GPR34 Q9UPC5 2/20 0.30
ALDH1A1 P00352 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL4671117 0.93 BTN3A1 (0.47) BTN3A1P2RY10GPR34
SCHEMBL1146679 0.88 BTN3A1 (0.44) BTN3A1
SCHEMBL1926070 0.88 BTN3A1 (0.48) BTN3A1PEPD
SCHEMBL1926069 0.85 BTN3A1 (0.41) BTN3A1THRBALDH1A1
SCHEMBL21571268 0.80 BTN3A1 (0.77) BTN3A1MVDFNTAFNTB
SCHEMBL92114 0.78
SCHEMBL8677288 0.77 BTN3A1 (0.40) BTN3A1PEPDTHRB
SCHEMBL4671069 0.76 LPAR3 (0.47) BTN3A1PEPD
SCHEMBL2141362 0.76 BTN3A1 (0.38) BTN3A1PEPD
SCHEMBL28240661 0.76 LMNA (0.47)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2025105467-A1 USE OF ADDITIVE IN CLAY-CONTAINING HYDRAULIC COMPOSITION 花王株式会社 2025-05-22 WO disclosed
WO-2025105468-A1 USE OF DISPERSANT IN CLAY-CONTAINING HYDRAULIC COMPOSITION 花王株式会社 2025-05-22 WO disclosed
US-20170073547-A1 Curable Composition, Temporary Bonding Material, and Method for Temporarily Bonding Component Part and Substrate By Same CENTRAL GLASS COMPANY, LTD. (JP) 2017-03-16 US disclosed
US-7754790-B2 Epoxy acrylate, a resin component having no unsaturated double bond; a bis(methacryloyloxyethyl) hydrogen phosphate; and a radical polymerization initiator; low-temperature curability, high adhesion, high reliability SONY CORPORATION (JP) 2010-07-13 US disclosed